Abstract: An organic light-emitting display device and a method of manufacturing the same are disclosed. The organic light-emitting display device includes: a lower substrate including a display area and a non-display area, the lower substrate further including a power supply wiring unit disposed in the non-display area, the power supply wiring unit including at least one power supply wiring extending along an edge of the display area; an encapsulation substrate having an outer surface and an inner surface facing the lower substrate; a cavity formed into the inner surface of the encapsulation substrate in a region over the power supply wiring unit such that the cavity overlaps at least part of the power supply wiring when viewed in a direction perpendicular to the outer surface of the encapsulation substrate; and a polarizing plate disposed on the outer surface of the encapsulation substrate.

Abstract: A polarizing film, a polarizing plate, a method of preparing the polarizing film, and an organic light-emitting apparatus including the polarizing plate.

Abstract: A visibility enhancing film includes a polymer film; and photonic crystals disposed within a hole formed in the polymer film, with each of the photonic crystals comprising colloidal particles. A method of forming the visibility enhancing film and an organic light emitting apparatus including the visibility enhancing film are also provided.

Abstract: An organic light emitting display device comprises: a substrate; a plurality of thin film transistors (TFTs) formed on a first surface of the substrate; a passivation layer covering the plurality of TFTs; a plurality of first pixel electrodes formed on the passivation layer and respectively electrically connected to the plurality of TFTs, and overlapping with the plurality of TFTs so as to cover the plurality of TFTs, and including a reflection layer formed of a light-reflecting conductive material; a second pixel electrode formed of a light-transmitting conductive material and disposed on the passivation layer so as to be electrically connected to the plurality of first pixel electrodes; an opposite electrode formed such that light is transmitted or reflected therethrough, and disposed opposite the plurality of first pixel electrodes and the second pixel electrode; and an organic layer interposed between the plurality of first pixel electrodes and the second pixel electrode, and including an emission layer.

Abstract: A polarizing plate including a polarizing film, a retardation film, and a color adhesive layer disposed between the polarizing film and the retardation film, and an organic light-emitting device including the polarizing plate. The color adhesive layer may include a first dye that absorbs a first light beam having a peak wavelength of about 470 to about 510 nm, a second dye that absorbs a second light beam having a peak wavelength of about 540 to about 610 nm, and a binder.

Abstract: A double-sided light-emitting display device includes optical layers having transmissive axes perpendicular to each other and polarizing members having polarization axes parallel with the transmissive axes of the optical layers. Thus, loss of internal light and reflection of external light are greatly reduced.

Abstract: An organic light emitting display device including: a substrate; an organic light emitting device on the substrate to display an image; a sealing member on the organic light emitting device; a phase delay layer disposed on the substrate, the organic light emitting device, or the sealing member; a linear polarization layer disposed on the substrate, the organic light emitting device, the sealing member, or the phase delay layer and is located closer to a display surface of the organic light emitting display where the image is displayed than the organic light emitting device, the sealing member, and the phase delay layer are from the display surface; a multi-phase delay layer between the phase delay layer and the linear polarization layer; and a transmittance control layer disposed on the substrate, the organic light emitting device, the sealing member, the phase delay layer, the multi-phase delay layer, or the linear polarization layer.

Abstract: An optical film capable of preventing reflection of external light, and an organic light emitting display (OLED) apparatus including the same, are disclosed. The optical film is disposed on a substrate of an organic light emitting display, and comprises a first substrate, a first electrode, a light emitting unit comprising a plurality of organic light emitting elements, and a second electrode sequentially formed on the first substrate. The second substrate concentrates light emitted from the light emitting unit so as to emit outward, and absorbs external light so as to prevent the external light from being reflected.

Abstract: An OLED display including: a substrate main body; a first transflective electrode formed on the substrate main body; an organic emission layer formed on the first transflective electrode; a second transflective electrode formed on the organic emission layer; and a dual brightness enhancement film (DBEF) disposed on a dual brightness enhancement film (DBEF) on at least one of a side of the first transflective electrode facing away from the organic emission layer, or a side of the second transflective electrode facing away from the organic emission layer.

Abstract: High-Cr ferritic/martensitic steels having an improved tensile strength and creep resistance are provided, which includes 0.04˜0.13 weight % of carbon, 0.03˜0.07 weight % of silicon, 0.40˜0.50 weight % of manganese, 0.40˜0.50 weight % of nickel, 8.5˜9.5 weight % of chromium, 0.45˜0.55 weight % of molybdenum, 0.10˜0.25 weight % of vanadium, 0.02˜0.10 weight % of tantalum, 0.15˜0.25 weight % of niobium, 1.5˜3.0 weight % of tungsten, 0.05˜0.12 weight % of nitrogen, 0.004˜0.008 weight % of boron, and optionally, 0.002˜0.010 weight % of phosphorus or 0.01˜0.08 weight % of zirconium, and iron balance. By regulating the contents of alloying elements such as niobium, tantalum, tungsten, nitrogen, boron, zirconium, carbon, the high-Cr ferritic/martensitic steels with superior tensile strength and creep resistance are provided, and can be effectively used as an in-core structural material for Generation IV sodium-cooled fast reactor (SFR) which is used under high temperature and high irradiation conditions.

Abstract: An optical film and an organic light emitting display apparatus including the optical film are disclosed. In one embodiment, the optical film is formed on a substrate of the organic light emitting display, and the substrate is configured to transmit light, emitted from an organic light emission unit of the display, toward the optical film. Further, the optical film is configured to absorb ambient light via a first portion, and the optical film is further configured to at least partially transmit light emitted from the organic light emission unit to the environment via a second portion.

Abstract: An organic light emitting diode display is disclosed. The display includes a first semitransparent electrode, an organic emissive layer placed on the first semitransparent electrode, a second semitransparent electrode placed on the organic emissive layer, and a first selective reflection layer placed on the second semitransparent electrode.

Abstract: A flat panel display including a first substrate, a second substrate, a light emitting region between the first and second substrates, and a sealant applied outside of the light emitting region, wherein the sealant has a rectangular shape and includes a first sealing part and a third sealing part opposite each other, and a second sealing part and a fourth sealing part opposite each other, the first, second, third, and fourth sealing parts being interconnected, and wherein the flat panel display includes a compensating part corresponding to at least one of the first, second, third, and fourth sealing parts on or in the first or second substrate.

Abstract: The present invention discloses a method for inspecting the electrical performance of a flash memory cell, which comprises: performing electron-storage programming on a flash memory cell for a pre-determined period; screening out flash memory cells that reach a specified reference value as a mother batch of flash memory cells that meet the preliminary requirement, by measuring the threshold voltage; then performing a second electron-storage programming on the flash memory cells screened out for a certain time period; baking these flash memory cells; and finally, measuring the threshold voltage of these baked flash memory cells again and determining whether the threshold voltage can still be maintained at or above the reference value, so that it can be determined ultimately whether the flash memory cells meet the electrical performance requirements.

Abstract: An organic light emitting diode (OLED) display includes a display substrate assembly including an organic light emitting structure, an encapsulation substrate assembly disposed facing the display substrate assembly, a sealant disposed between the display substrate assembly and the encapsulation substrate assembly to seal the display substrate assembly and the encapsulation substrate assembly with each other, and a substrate deformation protection body disposed between the sealant and the organic light emitting structure.

Abstract: A method of reworking a semiconductor substrate and a method of forming a pattern of semiconductor device using the same without damage to an organic anti-reflective coating (ARC) is provided. The method of reworking a semiconductor substrate includes forming a photoresist pattern on a substrate having the organic ARC formed thereon. An entire surface of the substrate having the photoresist pattern formed thereon may be exposed when a defect is present in the photoresist pattern. The entire-surface-exposed photoresist pattern may be removed by performing a developing process without damage to the organic ARC.

Abstract: Provided is a method of manufacturing a high strength ferritic/martensitic steel. The method includes melting a ferritic/martensitic steel, hot-working the melted ferritic/martensitic steel, normalizing the hot-worked ferritic/martensitic steel at a temperature of about 1050° C. to about 1200° C., tempering the ferritic/martensitic steel at a temperature of about 600° C. or less, and leaving MX precipitates while preventing a M23C6 precipitate from being precipitated, and cold-working and thermal-treating the ferritic/martensitic steel in a multistage fashion, and precipitating M23C6 precipitates. Through the above described configuration, the high strength ferritic/martensitic steel that prevents a ductility from being deteriorated even in a high-temperature environment may be manufactured.

Abstract: A bake-hardenable high-strength cold-rolled steel sheet, a hot-dipped steel sheet thereof, and a method for manufacturing the same. The steel sheet comprises 0.0016˜0.01% of C; 0.1% or less of Si; 0.2˜1.5% of Mn; 0.05˜0.15% of P; 0.01% or less of S; 0.08˜0.5% of (soluble) Al; 0.0025% or less of N; 0.003˜0.1% of Nb; 0.003% or less of Ti; 0.01˜0.4% of Mo; 0.0005˜0.005% of B; and the balance of Fe and other unavoidable impurities, in terms of weight %. The method includes the steps of heating a steel slab of the above composition to a temperature of 1,200° C. or more; and then hot rolling the steel slab with finish rolling at or above the Ar3 temperature to provide a hot rolled steel sheet; coiling the hot rolled steel sheet; cold rolling the hot rolled and coiled sheet; and continuous annealing the cold rolled sheet.

Abstract: Disclosed herein are a nuclear fuel rod for fast reactors, which includes an oxide coating layer formed on the inner surface of a cladding, and a manufacturing method thereof. The nuclear fuel rod for fast reactors, which includes the oxide coating layer formed on the inner surface of the cladding, can increase the maximum permissible burnup and maximum permissible temperature of the metallic fuel slug for fast reactors so as to prolong the its lifecycle in the fast reactors, thus increasing economic efficiency. Also, the fuel rod is manufactured in a simpler manner compared to the existing method, in which a metal liner is formed, and the disclosed method enables the cladding of the fuel rod to be manufactured in an easy and cost-effective way.

Abstract: A method of reworking a semiconductor substrate and a method of forming a pattern of semiconductor device using the same without damage to an organic anti-reflective coating (ARC) is provided. The method of reworking a semiconductor substrate includes forming a photoresist pattern on a substrate having the organic ARC formed thereon. An entire surface of the substrate having the photoresist pattern formed thereon may be exposed when a defect is present in the photoresist pattern. The entire-surface-exposed photoresist pattern may be removed by performing a developing process without damage to the organic ARC.