Abstract: An inner door assembly for a drum washing machine includes an inner door internal shell formed of plastic and including a rim portion and a projecting portion projecting from the rim portion; and an inner door external shell formed of metal and including a rim portion and a projecting portion corresponding to the rim portion and the projecting portion of the inner door internal shell, wherein the inner door external shell is combined not to be separated from the inner door internal shell.

Abstract: A display controller includes a frame rate converter creating a second reference image having a second frame rate higher than a first frame rate of a first reference image, based on the first reference image, a buffer storing the second reference image, and an image processor creating an output image a user by selecting at least a portion of the second reference image.

Abstract: A light emitting device package includes a cell array including a plurality of semiconductor light emitting units, and having a first surface and a second surface opposite the first surface, each of the plurality of semiconductor light emitting units having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer stacked on each other.

Abstract: A light emitting device package includes a cell array including a plurality of semiconductor light emitting units, and having a first surface and a second surface opposite the first surface, each of the plurality of semiconductor light emitting units having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer stacked on each other.

Abstract: A light source module includes a circuit board having a plurality of chip mounting regions, the plurality of chip mounting regions respectively having at least one connection pad; at least one alignment component respectively disposed on the plurality of chip mounting regions, and having a convex or concave shape; and a plurality of LED chips respectively mounted on the plurality of chip mounting regions, respectively having at least one electrode electrically connected to the at least one connection pad, and respectively coupled to the at least one alignment component.

Abstract: Disclosed are an organic light emitting device and a method of fabricating the same. The method of fabricating an organic light emitting device comprises forming a flexible substrate, and forming an organic light emitting layer on the flexible substrate. The forming the flexible substrate comprises, forming a first polymer pattern on a first metal layer, forming a second metal layer on an exposed portion of the first metal layer through the first polymer pattern, forming a gas barrier layer on the first polymer pattern and the second metal layer, forming a second polymer layer on the gas barrier layer, and removing the first metal layer to expose a surface of the first polymer pattern and a surface of the second metal layer.

Abstract: Provided is a method of manufacturing an organic light emitting device, the method including forming a lower electrode on a lower substrate, forming an organic layer on the lower electrode, forming a light extraction layer including an adhesion layer and nanoparticles on an upper substrate, forming an upper electrode on the light extraction layer, and coupling the lower substrate to the upper substrate so that the upper electrode contacts the organic layer. The forming of the light extraction layer includes providing an adhesive between a first sacrificial substrate and the upper substrate, curing the adhesive to form the adhesion layer to form the adhesion layer, and removing the first sacrificial substrate to expose the adhesion layer. The first sacrificial substrate and the upper substrate are coupled to each other by the adhesion layer.

Abstract: A light-emitting diode (LED) package includes a light-emitting structure, an optical wavelength conversion layer on the light-emitting structure, and an optical filter layer on the optical wavelength conversion layer. The light-emitting structure includes a first-conductivity-type semiconductor layer, an active layer on the first-conductivity-type semiconductor layer, and a second-conductivity-type semiconductor layer on the active layer, and emits first light having a first peak wavelength. The optical wavelength conversion layer absorbs the first light emitted from the light-emitting structure and emits second light having a second peak wavelength different from the first peak wavelength. The optical filter layer reflects the first light emitted from the light-emitting structure and transmits the second light emitted from the optical wavelength conversion layer.

Abstract: A semiconductor package may include a DRAM chip mounted on a substrate; an interposer stacked over the DRAM chip and including redistribution structures; a nonvolatile memory chip stacked over the interposer; a memory controller chip mounted on the substrate, and including a control circuit for controlling the nonvolatile memory chip and first pads and second pads electrically coupled to the control circuit; first conductive coupling members configured to electrically couple bonding pads of the nonvolatile memory chip to the redistribution structures; second conductive coupling members configured to electrically couple the redistribution structures to the first pads; and third conductive coupling members configured to electrically couple the second pads to the substrate.

Abstract: Disclosed is a 3-dimensional porous mono-polar electrode body that includes a 3-dimensional porous parent substance, which has a 3-dimensional structure including a side and a remaining side that communicate with each other via a plurality of pores arranged in multiple layers and which is made of a metal material to have dimensional stability, and an electrode catalyst layer applied on the 3-dimensional porous parent substance. The 3-dimensional porous mono-polar electrode body is used to remove microorganisms contained in treatment water to thus minimize the consumption of power, which is required to remove the microorganisms, prevent secondary pollution, and ensure the durability of an electrode.

Abstract: There are provided peptide tags derived from bacteriophytochrome (BphP) that is photoreceptor protein of Deinococcus radiodurans, an antibody capable of specifically recognizing the peptide tags, hybridoma cell lines capable of producing the antibody, and uses thereof. The novel peptide tag has advantages in that it has a short length and can remove a non-specific reaction of the conventional c-myc tag and FLAG tag. Therefore, in the case of using the novel peptide tag and antibody thereto, the fusion protein expressed in a recombinant cell can be very effectively detected or purified. In addition, an epitope tagging system including the novel peptide tag and antibody thereto can be applied in various fields such as a determination of an intracellular site, a confirmation of functionality, detection and purification of specific protein, and researches on interaction between proteins.

Abstract: A light-emitting diode (LED) device configured to provide a multi-color display includes a plurality of light-emitting cells at least partially defined by a partition layer. The LED device may be configured to reduce optical interferences between the light-emitting cells. The LED device includes a plurality of light-emitting structures spaced apart from one another; a plurality of electrode layers on respective first surfaces of the light-emitting structures, a separation layer configured to electrically insulate the light-emitting structures from each other; phosphor layers on respective second surfaces of the light-emitting structures and associated with different colors, and a partition layer between the phosphor layers to separate the phosphor layers from one another. Each light-emitting cell may include a separate light-emitting structure, a separate set of one or more electrodes, and a separate phosphor layer.

Abstract: A method of manufacturing a light emitting device package is provided. The method includes preparing a film strip including one or more light blocking regions and one or more wavelength conversion regions, preparing light emitting devices, each including one or more light emitting regions, bonding the film strip to the light emitting devices so as to dispose the one or more wavelength conversion regions on the one or more light emitting regions of each of the light emitting devices, and cutting the film strip and the light emitting devices into individual device units.

Abstract: Provided are a method for manufacturing an integrated substrate for an organic light emitting diode, an organic light emitting diode, and a method for manufacturing an organic light emitting diode, wherein the method for manufacturing an organic light emitting diode may include forming a sacrificial layer on a release substrate, forming a first electrode on the sacrificial layer, forming on the first electrode an auxiliary electrode pattern having an opening, forming a buffer layer on the auxiliary electrode pattern and in the opening, providing a substrate on the buffer layer, removing the release substrate and the sacrificial layer to expose a first surface of the first electrode, and laminating an organic light emitting layer and a second electrode on the first surface of the first electrode.

Abstract: Provided is an apparatus for manufacturing a flexible integrated substrate. The apparatus for manufacturing the flexible integrated substrate includes a substrate transfer unit configured to transfer a substrate which a functional film is disposed on one surface thereof, a unwinding unit configured to unwind a flexible support film wound in a roll shape, a winding unit configured to wind the support film provided from the unwinding unit in the roll shape, and a pressing unit configured to press the support film being transferred from the unwinding unit to the winding unit to the substrate being transferred to attach the functional film to the support film.

Abstract: Provided is a method of fabricating a light functional substrate. The method includes applying particles onto a surface of water contained in a container to form a monolayer constituted by the particles, immersing a substrate into the container, drawing the substrate out of the container to form patterns constituted by the particles on the substrate in a first direction, and forming a planarization film covering the patterns on the substrate.

Abstract: A light source module includes a circuit board having a plurality of chip mounting regions, the plurality of chip mounting regions respectively having at least one connection pad; at least one alignment component respectively disposed on the plurality of chip mounting regions, and having a convex or concave shape; and a plurality of LED chips respectively mounted on the plurality of chip mounting regions, respectively having at least one electrode electrically connected to the at least one connection pad, and respectively coupled to the at least one alignment component.

Abstract: Provided is a method of manufacturing an organic light emitting device, the method including forming a lower electrode on a lower substrate, forming an organic layer on the lower electrode, forming a light extraction layer including an adhesion layer and nanoparticles on an upper substrate, forming an upper electrode on the light extraction layer, and coupling the lower substrate to the upper substrate so that the upper electrode contacts the organic layer. The forming of the light extraction layer includes providing an adhesive between a first sacrificial substrate and the upper substrate, curing the adhesive to form the adhesion layer to form the adhesion layer, and removing the first sacrificial substrate to expose the adhesion layer. The first sacrificial substrate and the upper substrate are coupled to each other by the adhesion layer.

Abstract: A light emitting device package may include: a light emitting structure including a plurality of light emitting regions configured to emit light, respectively; a plurality of light adjusting layers formed above the light emitting regions to change characteristics of the light emitted from the light emitting regions, respectively; a plurality of electrodes configured to control the light emitting regions to emit the light, respectively; and an isolation insulating layer disposed between the light emitting regions to insulate the light emitting regions from one another, the isolation insulating layer forming a continuous structure with respect to the light emitting regions.

Abstract: A semiconductor light-emitting device includes a light-emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, and a magnetic layer on the light-emitting structure. The magnetic layer may have at least one magnetization direction that is parallel to an upper surface of the active layer. The magnetic layer may generate a magnetic field that is parallel to the upper surface of the active layer. The magnetic layer may include multiple structures that may have different magnetization directions. Multiple magnetic layers may be included on the light-emitting structure. A magnetic layer may be on a contact electrode. A magnetic layer may be isolated from a pad electrode.