Abstract: A light-emitting diode (LED) package includes a light-emitting structure, an optical wavelength conversion layer on the light-emitting structure, and an optical filter layer on the optical wavelength conversion layer. The light-emitting structure includes a first-conductivity-type semiconductor layer, an active layer on the first-conductivity-type semiconductor layer, and a second-conductivity-type semiconductor layer on the active layer, and emits first light having a first peak wavelength. The optical wavelength conversion layer absorbs the first light emitted from the light-emitting structure and emits second light having a second peak wavelength different from the first peak wavelength. The optical filter layer reflects the first light emitted from the light-emitting structure and transmits the second light emitted from the optical wavelength conversion layer.

Abstract: A light emitting device package may include: a light emitting structure including a plurality of light emitting regions configured to emit light, respectively; a plurality of light adjusting layers formed above the light emitting regions to change characteristics of the light emitted from the light emitting regions, respectively; a plurality of electrodes configured to control the light emitting regions to emit the light, respectively; and an isolation insulating layer disposed between the light emitting regions to insulate the light emitting regions from one another, the isolation insulating layer forming a continuous structure with respect to the light emitting regions.

Abstract: A cooking apparatus including an enamel coating layer having an improved cleaning efficiency and a manufacturing method therefor are provided. The cooking apparatus includes a cooking compartment configured to accommodate a cooking object, a door configured to open and close the cooking compartment, and an enamel coating layer provided on a surface of the cooking compartment. The enamel coating layer includes, in percent (%) by weight of the entire composition, 5% or less (excluding 0%) of a silicon dioxide (SiO2), 10% to 20% of an aluminum oxide (Al2O3), 10% to 20% of a phosphorous pentoxide (P2O5), 5% to 15% of a rare earth oxide, and 5% to 10% of a ferric oxide (Fe2O3).

Abstract: A light-emitting diode (LED) device configured to provide a multi-color display includes a plurality of light-emitting cells at least partially defined by a partition layer. The LED device may be configured to reduce optical interferences between the light-emitting cells. The LED device includes a plurality of light-emitting structures spaced apart from one another; a plurality of electrode layers on respective first surfaces of the light-emitting structures, a separation layer configured to electrically insulate the light-emitting structures from each other; phosphor layers on respective second surfaces of the light-emitting structures and associated with different colors, and a partition layer between the phosphor layers to separate the phosphor layers from one another. Each light-emitting cell may include a separate light-emitting structure, a separate set of one or more electrodes, and a separate phosphor layer.

Abstract: A semiconductor light emitting device includes: a light emitting structure including a first conductivity-type semiconductor layer and a second conductivity-type semiconductor layer respectively providing a first surface and a second surface, opposite to each other, of the light emitting structure, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer, a region of the first conductivity-type semiconductor layer being open toward the second surface, and the first surface having a concavo-convex portion disposed thereon; a first electrode and a second electrode disposed on the region of the first conductivity-type semiconductor layer and a region of the second conductivity-type semiconductor layer, respectively; a transparent support substrate disposed on the first surface of the light emitting structure; and a transparent adhesive layer disposed between the first surface of the light emitting structure and the transparent sup

Abstract: Disclosed is a scandia-stabilized zirconia electrolyte for a solid oxide fuel cell, which is configured such that at least one oxide selected from among gadolinium oxide (Gd2O3) and samarium oxide (Sm2O3) is co-doped with ytterbium oxide (Yb2O3) to thus improve stability in a reducing atmosphere. The scandia-stabilized zirconia electrolyte of the invention can be stabilized into a cubic crystal structure at room temperature while retaining the inherently high oxygen ionic conductivity of a scandia-stabilized zirconia electrolyte (11ScSZ), and can also ensure stability in a reducing atmosphere by solving the problem with a conventional ceria (CeO2)-doped scandia-stabilized zirconia in which the ionic conductivity continuously deteriorates in a reducing atmosphere.

Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Abstract: Disclosed herein is a dryer having a cabinet, a drum provided inside the cabinet so as to be rotatable about a rotation axis, a rear support plate coupled to the rear of the drum to support the drum and the rear support plate having a hot air supplier configured to supply hot air toward an inner surface of the drum along a circumference of the drum, and a hot air duct configured to introduce air in a region adjacent to the rotation axis of the drum and to guide air to the hot air supplier through a heater disposed therein. With this structure, drying efficiency and stability can be improved.

Abstract: Disclosed herein is a washing machine. The washing machine includes a main body having a laundry inlet on the front portion, a tub provided inside the main body to store water, a drum rotatably installed inside the tub, a pulsator provided inside the drum and configured to be rotatable with respect to the drum, a first driving motor to provide power to the pulsator, and a second driving motor to provide power to the drum.

Abstract: A light-emitting diode (LED) device configured to provide a multi-color display includes a plurality of light-emitting cells at least partially defined by a partition layer. The LED device may be configured to reduce optical interferences between the light-emitting cells. The LED device includes a plurality of light-emitting structures spaced apart from one another; a plurality of electrode layers on respective first surfaces of the light-emitting structures, a separation layer configured to electrically insulate the light-emitting structures from each other; phosphor layers on respective second surfaces of the light-emitting structures and associated with different colors, and a partition layer between the phosphor layers to separate the phosphor layers from one another. Each light-emitting cell may include a separate light-emitting structure, a separate set of one or more electrodes, and a separate phosphor layer.

Abstract: Provided are a method for manufacturing an integrated substrate for an organic light emitting diode, an organic light emitting diode, and a method for manufacturing an organic light emitting diode, wherein the method for manufacturing an organic light emitting diode may include forming a sacrificial layer on a release substrate, forming a first electrode on the sacrificial layer, forming on the first electrode an auxiliary electrode pattern having an opening, forming a buffer layer on the auxiliary electrode pattern and in the opening, providing a substrate on the buffer layer, removing the release substrate and the sacrificial layer to expose a first surface of the first electrode, and laminating an organic light emitting layer and a second electrode on the first surface of the first electrode.

Abstract: Provided is a method for manufacturing an electronic device including a transparent conductive structure, the method including preparing a transparent electrode in which, among a first region and a second region, the first region is selectively surface-modified, preparing a mixed composition including a first composition and a second composition having a different polarity from the first composition, and applying the mixed composition onto the transparent electrode, wherein the applied mixed composition is disposed in the surface modified first region, and the mixed composition disposed in the first region is phase-separated into a first composition layer and a second composition layer disposed on the first composition layer.

Abstract: Disclosed are an organic light emitting device and a method of fabricating the same. The method of fabricating an organic light emitting device comprises forming a flexible substrate, and forming an organic light emitting layer on the flexible substrate. The forming the flexible substrate comprises, forming a first polymer pattern on a first metal layer, forming a second metal layer on an exposed portion of the first metal layer through the first polymer pattern, forming a gas barrier layer on the first polymer pattern and the second metal layer, forming a second polymer layer on the gas barrier layer, and removing the first metal layer to expose a surface of the first polymer pattern and a surface of the second metal layer.

Abstract: A transparent conductor includes a base layer, and a conductive layer on an upper surface of the base layer. The conductive layer includes metal nanowires and a matrix. The transparent conductor has a reflective a* value of about ?0.3 to about +0.3 and a reflective b* value of about ?2 to about 0. The transparent conductor exhibits good optical properties and prevents (or reduces) visibility of the etching pattern of the conductive layer.

Abstract: Disclosed is a ceria electrolyte for a solid oxide fuel cell, which is a ceria (CeO2) electrolyte configured such that either gadolinium (Gd) or samarium (Sm) is co-doped with ytterbium (Yb) and bismuth (Bi), wherein Bi is doped in an amount of 0.5 to 5 mol %, thus exhibiting low-temperature sintering properties.

Abstract: A semiconductor light emitting device includes a light-transmissive support having a first surface including a first region and a second region surrounding the first region, and a second surface opposing the first surface, and including a wavelength conversion material, a semiconductor stack disposed above the first region of the first surface of the light-transmissive support, and including first and second conductivity-type semiconductor layers and an active layer disposed therebetween, a light-transmitting bonding layer disposed between the light-transmissive support and the semiconductor stack, a light blocking film disposed above the second region of the light-transmissive support to surround the semiconductor stack, and first and second electrodes respectively disposed on portions of the first and second conductivity-type semiconductor layers.

Abstract: A semiconductor light emitting device includes a plurality of light emitting cells including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer between the first and second conductivity type semiconductor layers, an insulating layer on the plurality of light emitting cells and having a first opening and a second opening defining a first contact region of the first conductivity type semiconductor layer and a second contact region of the second conductivity type semiconductor layer, respectively, in each of the plurality of light emitting cells, a connection electrode on the insulating layer and connecting the first contact region and the second contact region to electrically connect the plurality of light emitting cells to each other, a transparent support substrate on the insulating layer and the connection electrode, and a transparent bonding layer between the insulating layer and the transparent support substrate.

Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Abstract: A light emitting device package includes a cell array including a plurality of semiconductor light emitting units, and having a first surface and a second surface opposite the first surface, each of the plurality of semiconductor light emitting units having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer stacked on each other.

Abstract: A semiconductor light emitting device includes: a light emitting structure including a first conductivity-type semiconductor layer and a second conductivity-type semiconductor layer respectively providing a first surface and a second surface, opposite to each other, of the light emitting structure, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer, a region of the first conductivity-type semiconductor layer being open toward the second surface, and the first surface having a concavo-convex portion disposed thereon; a first electrode and a second electrode disposed on the region of the first conductivity-type semiconductor layer and a region of the second conductivity-type semiconductor layer, respectively; a transparent support substrate disposed on the first surface of the light emitting structure; and a transparent adhesive layer disposed between the first surface of the light emitting structure and the transparent sup