Patents by Inventor Tae-Sung Lee
Tae-Sung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220285415Abstract: An image sensor that provides a uniform sensitivity for pixels having color filters of the same color to increase the image quality is provided. The image sensor includes a substrate, a first grid pattern disposed on the substrate and including a first side wall and a second side wall opposite to the first side wall, a first pixel including a first photoelectric conversion element and a first color filter, and a second pixel including a second photoelectric conversion element and a second color filter. The first color filter contacts the first side wall and the second color filter contacts the second side wall. The first color filter and the second color filter are color filters of same color, and a first thickness of the first color filter is greater than a second thickness of the second color filter.Type: ApplicationFiled: November 2, 2021Publication date: September 8, 2022Inventors: Dong Min Keum, Yun Ki Lee, Jun Sung Park, Dong Kyu Lee, Bum Suk Kim, Kwang Hee Lee, Tae Sung Lee
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Publication number: 20220263938Abstract: The present disclosure provides a terminal set comprising an extended display and, more specifically, a terminal set having a main body and a sub body fastened to each other in order to solve the problem that multiple displays are output in different directions because a device inclination value measured by a sensor is in a range that has no influence. The terminal set comprises: an inclination sensor mounted on the main body so as to sense the inclination of the main body; and a controller for executing an application and thereby controlling a first display of the main body or a second display of the sub body so as to output the application. If the controller receives a new output signal regarding a first application in a state in which the sensed inclination of the main body is within a screen rotation nonactivation range, the controller retrieves an output rotation value allocated to the first display and an output rotation value allocated to the second display.Type: ApplicationFiled: July 18, 2019Publication date: August 18, 2022Applicant: LG ELECTRONICS INC.Inventors: Joo Hyun PARK, Tae Sung LEE
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Publication number: 20220216257Abstract: An image sensor includes a substrate including a first surface on which light is incident and a second surface opposite to the first surface, unit pixels in the substrate, each including a photoelectric conversion layer, color filters on the first surface of the substrate, a grid pattern on the first surface of the substrate defining a respective light receiving area of each of the unit pixels, and microlenses on the color filters, each of the microlenses corresponding to a respective one of the unit pixels, wherein the unit pixels include a first pixel and a second pixel sharing a first color filter which is one of the color filters, and a first light receiving area of the first pixel is different from a second light receiving area of the second pixel.Type: ApplicationFiled: September 23, 2021Publication date: July 7, 2022Applicant: SAMSUNG ELECTRONICS CO.,LTD.Inventors: Dong Kyu LEE, Dong Min Keum, Jun Sung Park, Bum Suk Kim, Tae Han Kim, Kwang Hee Lee, Tae Sung Lee
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Publication number: 20220190017Abstract: An image sensor in which a shading phenomenon is decreased and the quality is increased is provided. The image sensor includes a light-receiving region including a plurality of unit pixels. The image sensor further includes a first region with unit pixels adjacent to a center of the light-receiving region, and a second region with the unit pixels spaced apart from the center of the light-receiving region. In both regions, a plurality of color filters corresponding to the plurality of unit pixels is disposed on a first face of the substrate, as well as a grid pattern interposed between the plurality of color filters defining boundaries between the unit pixels. A width of the grid pattern in the second region is greater than a width of the grid pattern in the first region, thereby adjusting light receiving areas near the edge of the image sensor to correct for a shading phenomenon.Type: ApplicationFiled: September 1, 2021Publication date: June 16, 2022Inventors: Jun Sung Park, Jin Ho Kim, Yun Ki Lee, Bum Suk Kim, Jung-Saeng Kim, Dong Kyu Lee, Tae Sung Lee
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Patent number: 11300854Abstract: An embodiment relates to a light emitting module, a flash module, and a terminal including the same. The light emitting module according to an embodiment comprises: a semiconductor layer; a phosphor layer arranged on one surface of the semiconductor layer; a plurality of light emitting chips including a plurality of electrodes arranged on a surface facing one surface of the semiconductor layer; a first partition arranged at one side of the plurality of light emitting chips, and a second partition arranged at the other side of the plurality of light emitting chips so as to face the first partition; and an opaque molding part, which encompasses the plurality of light emitting chips such that the upper surface of the phosphor layer and the bottom surfaces of the plurality of electrodes are exposed to the outside, and is arranged on the inner side of the first and second partitions.Type: GrantFiled: August 8, 2017Date of Patent: April 12, 2022Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.Inventors: Tae Sung Lee, Jang Hoon Jeong, Min Ji Jin, Young Kyu Jeong
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Publication number: 20210320039Abstract: A semiconductor device includes a semiconductor die, a defect detection structure and an input-output circuit. The semiconductor die includes a central region and a peripheral region surrounding the central region. The peripheral region includes a left-bottom corner region, a left-upper corner region, a right-upper corner region and a right-bottom corner region. The defect detection structure is formed in the peripheral region. The defect detection structure includes a first conduction loop in the left-bottom corner region, a second conduction loop in the right-bottom corner region, a third conduction loop in the left-bottom corner region and the left-upper corner region and a fourth conduction loop in the right-bottom corner region and the right-upper corner region. The input-output circuit is electrically connected to end nodes of the first conduction loop, the second conduction loop, the third conduction loop and the fourth conduction loop.Type: ApplicationFiled: June 23, 2021Publication date: October 14, 2021Inventors: Min-Jae LEE, Sang-Lok KIM, Byung-Hoon JEONG, Tae-Sung LEE, Jeong-Don IHM, Jae-Yong JEONG, Young-Don CHOI
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Publication number: 20210286235Abstract: An embodiment relates to a light emitting module, a flash module, and a terminal including the same. The light emitting module according to an embodiment comprises: a semiconductor layer; a phosphor layer arranged on one surface of the semiconductor layer; a plurality of light emitting chips including a plurality of electrodes arranged on a surface facing one surface of the semiconductor layer; a first partition arranged at one side of the plurality of light emitting chips, and a second partition arranged at the other side of the plurality of light emitting chips so as to face the first partition; and an opaque molding part, which encompasses the plurality of light emitting chips such that the upper surface of the phosphor layer and the bottom surfaces of the plurality of electrodes are exposed to the outside, and is arranged on the inner side of the first and second partitions.Type: ApplicationFiled: August 8, 2017Publication date: September 16, 2021Applicant: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.Inventors: Tae Sung LEE, Jang Hoon JEONG, Min Ji JIN, Young Kyu JEONG
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Patent number: 11062966Abstract: A semiconductor device includes a semiconductor die, a defect detection structure and an input-output circuit. The semiconductor die includes a central region and a peripheral region surrounding the central region. The peripheral region includes a left-bottom corner region, a left-upper corner region, a right-upper corner region and a right-bottom corner region. The defect detection structure is formed in the peripheral region. The defect detection structure includes a first conduction loop in the left-bottom corner region, a second conduction loop in the right-bottom corner region, a third conduction loop in the left-bottom corner region and the left-upper corner region and a fourth conduction loop in the right-bottom corner region and the right-upper corner region. The input-output circuit is electrically connected to end nodes of the first conduction loop, the second conduction loop, the third conduction loop and the fourth conduction loop.Type: GrantFiled: March 19, 2019Date of Patent: July 13, 2021Inventors: Min-Jae Lee, Sang-Lok Kim, Byung-Hoon Jeong, Tae-Sung Lee, Jeong-Don Ihm, Jae-Yong Jeong, Young-Don Choi
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Patent number: 11038087Abstract: A light emitting device package can include a package body; a light emitting device disposed on the package body and including first and second electrode pads on a bottom surface of the light emitting device; a first through hole in the package body; a second through hole in the package body, in which the first through hole is separated from the second through hole, the first electrode pad of the light emitting device directly overlaps with the first through hole in the package body, and the second electrode pad of the light emitting device directly overlaps with the second through hole in the package body.Type: GrantFiled: September 29, 2017Date of Patent: June 15, 2021Assignee: LG INNOTEK CO., LTD.Inventors: Tae Sung Lee, June O Song, Chang Man Lim
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Patent number: 10809596Abstract: An embodiment may have a substrate (110) including a predetermined cavity (C); a plurality of light emitting chips (120) spaced apart from the cavity (C) of the substrate (110); a frame (130), disposed on the substrate (110) including a support portion (132) and a guide portion (134) including a predetermined through hole (H1); and a lens unit (140) disposed in the through hole (H1) of the guide portion (134).Type: GrantFiled: May 19, 2017Date of Patent: October 20, 2020Assignee: LG Innotek Co., Ltd.Inventors: Jong Beom Choi, Tae Sung Lee, Min Ji Jin
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Publication number: 20200274042Abstract: A light emitting device package can include a package body; a light emitting device disposed on the package body and including first and second electrode pads on a bottom surface of the light emitting device; a first through hole in the package body; a second through hole in the package body, in which the first through hole is separated from the second through hole, the first electrode pad of the light emitting device directly overlaps with the first through hole in the package body, and the second electrode pad of the light emitting device directly overlaps with the second through hole in the package body.Type: ApplicationFiled: September 29, 2017Publication date: August 27, 2020Applicant: LG INNOTEK CO., LTD.Inventors: Tae Sung LEE, June O SONG, Chang Man LIM
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Patent number: 10749089Abstract: A light emitting device package according to an embodiment includes: a package body; a light emitting device disposed on the package body; and an adhesive disposed between the package body and the light emitting device. The package body includes first and second openings passing through the package body on an upper surface of the package body and a recess provided to concave in a direction of a lower surface of the package body from the upper surface of the package body. The light emitting device includes a first bonding part disposed on the first opening and a second bonding part disposed on the second opening. The adhesive is provided at the recess.Type: GrantFiled: August 1, 2018Date of Patent: August 18, 2020Assignee: LG INNOTEK CO., LTD.Inventors: Tae Sung Lee, Won Jung Kim, June O Song, Chang Man Lim
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Publication number: 20200203566Abstract: A semiconductor device according to an embodiment may include: a light emitting structure; a light transmitting electrode layer disposed on the light emitting structure; and a reflective layer disposed on the light transmitting electrode layer and including a plurality of first openings and a plurality of second openings. The semiconductor device according to the embodiment may include: a first electrode in contact with a first conductivity type semiconductor layer of the light emitting structure; and a second electrode in contact with the light transmitting electrode layer through the plurality of first openings.Type: ApplicationFiled: August 24, 2018Publication date: June 25, 2020Inventors: Chang Hyeong LEE, June O SONG, Tae Sung LEE, Chang Man LIM, Se Yeon JUNG, Byung Yeon CHOI, Sung Min HWANG
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Patent number: 10676665Abstract: Disclosed is an outdoor color-changeable film with self-recovering properties that includes a transparent base film; a hard-coating pearl layer formed on an outer surface of the transparent base film and includes pearl particles dispersed in a hard-coating agent; a first adhesive layer disposed on another surface of the transparent base layer; a color base film disposed on the first adhesive layer to laminate the color base film onto a surface of the hard-coating pearl layer; a second adhesive layer coated on a surface of the color base film; and a release film detachably laminated onto the second adhesive layer. The self-recovering properties include water repellency, anti-fouling, and antibacterial functions, ultraviolet ray blocking ability, and use in various fields due to a long-lasting film property and an insecticidal effect.Type: GrantFiled: March 23, 2018Date of Patent: June 9, 2020Assignee: E and B Co., Ltd.Inventors: Sang-tae Kim, Tae-sung Lee
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Patent number: 10672959Abstract: A light emitting device package can include first and second frames spaced apart from each other; a package body including a body portion between the first and second frames; a light emitting device including first and second electrode pads; first and second through holes in the first and second frames, respectively; a first resin between the body portion and the light emitting device; and a conductive material in the first and second through holes, in which the first and second electrode pads of the light emitting device respectively overlap with the first and second through holes, the first and second electrode pads are spaced apart from each other, and the conductive material in the first and second through holes respectively contacts the first and second electrode pads, and a first side surface of the first electrode pad and a second side surface of the second electrode pad facing the first side surface both contact the first resin.Type: GrantFiled: September 29, 2017Date of Patent: June 2, 2020Assignee: LG INNOTEK CO., LTD.Inventors: Tae Sung Lee, June O Song, Chang Man Lim
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Patent number: 10600945Abstract: The light emitting device package disclosed in the embodiment includes: first and second frames having first and second through holes; a body disposed between the first and second frames; a light emitting device including a first bonding pad and a second bonding pad; and a conductive part in the first and second through holes. wherein at least one of the first and second bonding pads faces the first and second frames and overlaps with the first and second through holes and includes a contact region contacting the conductive part and a first non-contact non-contacting the conducive part.Type: GrantFiled: July 13, 2018Date of Patent: March 24, 2020Assignee: LG INNOTEK CO., LTD.Inventors: Chang Man Lim, Ki Seok Kim, Young Shin Kim, June O Song, Ju Hyeon Oh, Chang Hyeong Lee, Tae Sung Lee, Se Yeon Jung, Byung Yeon Choi, Sung Min Hwang
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Publication number: 20200091021Abstract: A semiconductor device includes a semiconductor die, a defect detection structure and an input-output circuit. The semiconductor die includes a central region and a peripheral region surrounding the central region. The peripheral region includes a left-bottom corner region, a left-upper corner region, a right-upper corner region and a right-bottom corner region. The defect detection structure is formed in the peripheral region. The defect detection structure includes a first conduction loop in the left-bottom corner region, a second conduction loop in the right-bottom corner region, a third conduction loop in the left-bottom corner region and the left-upper corner region and a fourth conduction loop in the right-bottom corner region and the right-upper corner region. The input-output circuit is electrically connected to end nodes of the first conduction loop, the second conduction loop, the third conduction loop and the fourth conduction loop.Type: ApplicationFiled: March 19, 2019Publication date: March 19, 2020Inventors: Min-Jae Lee, Sang-Lok Kim, Byung-Hoon Jeong, Tae-Sung Lee, Jeong-Don Ihm, Jae-Yong Jeong, Young-Don Choi
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Patent number: 10497827Abstract: A light emitting device package includes a first frame and a second frame disposed to be spaced apart from each other; a body disposed between the first and second frames and comprising a recess; a first adhesive on the recess; a light emitting device on the first adhesive; a second adhesive disposed between the first and second frames and the light emitting device; and a resin portion disposed to surround the second adhesive and a partial region of the light emitting device.Type: GrantFiled: July 20, 2018Date of Patent: December 3, 2019Assignee: LG INNOTEK CO., LTD.Inventors: Tae Sung Lee, June O Song, Ki Seok Kim, Young Shin Kim, Chang Man Lim
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Patent number: 10497846Abstract: A light emitting device package according to an embodiment includes: a body including first and second openings passing through an upper surface of the body and a lower surface of the body; a light emitting device disposed on the body and including first and second bonding parts; and first and second conductive layers disposed under the body and electrically connected to the first and second bonding parts, respectively, wherein each of the first and second bonding parts includes a protrusion portion protruding and extending in a downwards direction within the first and second openings, respectively.Type: GrantFiled: July 10, 2018Date of Patent: December 3, 2019Assignee: LG INNOTEK CO., LTD.Inventors: Tae Sung Lee, Chang Man Lim, June O Song
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Publication number: 20190302573Abstract: An embodiment may have a substrate (110) including a predetermined cavity (C); a plurality of light emitting chips (120) spaced apart from the cavity (C) of the substrate (110); a frame (130), disposed on the substrate (110) including a support portion (132) and a guide portion (134) including a predetermined through hole (H1); and a lens unit (140) disposed in the through hole (H1) of the guide portion (134).Type: ApplicationFiled: May 19, 2017Publication date: October 3, 2019Inventors: Jong Beom CHOI, Tae Sung LEE, Min Ji JIN