Patents by Inventor Tae-Sung Lee

Tae-Sung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220204407
    Abstract: A dielectric material includes a main component represented by (Ba1-xCax)(Ti1-y(Zr, Sn, Hf)y)O3 (0?x?1 and 0?y?0.5); a first subcomponent including at least one of elements among Y, Dy, Ho, Er, Gd, Ce, Nd, Nb, Sm, Tb, Eu, Tm, La, Lu, and Yb; a second subcomponent including Si and/or Al; and a third subcomponent including Ba and/or Ca.
    Type: Application
    Filed: November 10, 2021
    Publication date: June 30, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Sung PARK, Hee Sun CHUN, In Tae SEO, Hyung Joon JEON, Chung Eun LEE, Jong Han KIM
  • Publication number: 20220207935
    Abstract: A method of generating a tire slip sound is capable of producing a virtual tire slip sound in a driving situation in which tire slip may occur during vehicle driving. The method includes collecting vehicle driving information while a vehicle is traveling; determining a characteristic of a virtual tire slip sound based on the collected vehicle driving information; generating and outputting a tire slip signal for generating and outputting the virtual tire slip sound according to the determined characteristic; and operating sound equipment of the vehicle according to the tire slip signal output from the controller to generate and output the virtual tire slip sound according to a vehicle driving state.
    Type: Application
    Filed: August 25, 2021
    Publication date: June 30, 2022
    Inventors: Ki Chang Kim, Jin Sung Lee, Dong Chul Park, Tae Kun Yun, Sang Jin Hong
  • Publication number: 20220208454
    Abstract: A multilayer electronic component according to some embodiments of the present disclosure includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein a ratio of the number of dielectric grains having a size of 100 to 250 nm included in the dielectric layer is 55% or more with respect to a total number of the dielectric grains included in the dielectric layer.
    Type: Application
    Filed: May 12, 2021
    Publication date: June 30, 2022
    Inventors: Kyung Sik Kim, Jong Hwan Lee, Jeong Yun Park, TAE YOUNG HAM, IN TAE SEO, Jae Sung Park
  • Publication number: 20220190017
    Abstract: An image sensor in which a shading phenomenon is decreased and the quality is increased is provided. The image sensor includes a light-receiving region including a plurality of unit pixels. The image sensor further includes a first region with unit pixels adjacent to a center of the light-receiving region, and a second region with the unit pixels spaced apart from the center of the light-receiving region. In both regions, a plurality of color filters corresponding to the plurality of unit pixels is disposed on a first face of the substrate, as well as a grid pattern interposed between the plurality of color filters defining boundaries between the unit pixels. A width of the grid pattern in the second region is greater than a width of the grid pattern in the first region, thereby adjusting light receiving areas near the edge of the image sensor to correct for a shading phenomenon.
    Type: Application
    Filed: September 1, 2021
    Publication date: June 16, 2022
    Inventors: Jun Sung Park, Jin Ho Kim, Yun Ki Lee, Bum Suk Kim, Jung-Saeng Kim, Dong Kyu Lee, Tae Sung Lee
  • Patent number: 11300854
    Abstract: An embodiment relates to a light emitting module, a flash module, and a terminal including the same. The light emitting module according to an embodiment comprises: a semiconductor layer; a phosphor layer arranged on one surface of the semiconductor layer; a plurality of light emitting chips including a plurality of electrodes arranged on a surface facing one surface of the semiconductor layer; a first partition arranged at one side of the plurality of light emitting chips, and a second partition arranged at the other side of the plurality of light emitting chips so as to face the first partition; and an opaque molding part, which encompasses the plurality of light emitting chips such that the upper surface of the phosphor layer and the bottom surfaces of the plurality of electrodes are exposed to the outside, and is arranged on the inner side of the first and second partitions.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: April 12, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Tae Sung Lee, Jang Hoon Jeong, Min Ji Jin, Young Kyu Jeong
  • Publication number: 20210320039
    Abstract: A semiconductor device includes a semiconductor die, a defect detection structure and an input-output circuit. The semiconductor die includes a central region and a peripheral region surrounding the central region. The peripheral region includes a left-bottom corner region, a left-upper corner region, a right-upper corner region and a right-bottom corner region. The defect detection structure is formed in the peripheral region. The defect detection structure includes a first conduction loop in the left-bottom corner region, a second conduction loop in the right-bottom corner region, a third conduction loop in the left-bottom corner region and the left-upper corner region and a fourth conduction loop in the right-bottom corner region and the right-upper corner region. The input-output circuit is electrically connected to end nodes of the first conduction loop, the second conduction loop, the third conduction loop and the fourth conduction loop.
    Type: Application
    Filed: June 23, 2021
    Publication date: October 14, 2021
    Inventors: Min-Jae LEE, Sang-Lok KIM, Byung-Hoon JEONG, Tae-Sung LEE, Jeong-Don IHM, Jae-Yong JEONG, Young-Don CHOI
  • Publication number: 20210286235
    Abstract: An embodiment relates to a light emitting module, a flash module, and a terminal including the same. The light emitting module according to an embodiment comprises: a semiconductor layer; a phosphor layer arranged on one surface of the semiconductor layer; a plurality of light emitting chips including a plurality of electrodes arranged on a surface facing one surface of the semiconductor layer; a first partition arranged at one side of the plurality of light emitting chips, and a second partition arranged at the other side of the plurality of light emitting chips so as to face the first partition; and an opaque molding part, which encompasses the plurality of light emitting chips such that the upper surface of the phosphor layer and the bottom surfaces of the plurality of electrodes are exposed to the outside, and is arranged on the inner side of the first and second partitions.
    Type: Application
    Filed: August 8, 2017
    Publication date: September 16, 2021
    Applicant: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Tae Sung LEE, Jang Hoon JEONG, Min Ji JIN, Young Kyu JEONG
  • Patent number: 11062966
    Abstract: A semiconductor device includes a semiconductor die, a defect detection structure and an input-output circuit. The semiconductor die includes a central region and a peripheral region surrounding the central region. The peripheral region includes a left-bottom corner region, a left-upper corner region, a right-upper corner region and a right-bottom corner region. The defect detection structure is formed in the peripheral region. The defect detection structure includes a first conduction loop in the left-bottom corner region, a second conduction loop in the right-bottom corner region, a third conduction loop in the left-bottom corner region and the left-upper corner region and a fourth conduction loop in the right-bottom corner region and the right-upper corner region. The input-output circuit is electrically connected to end nodes of the first conduction loop, the second conduction loop, the third conduction loop and the fourth conduction loop.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: July 13, 2021
    Inventors: Min-Jae Lee, Sang-Lok Kim, Byung-Hoon Jeong, Tae-Sung Lee, Jeong-Don Ihm, Jae-Yong Jeong, Young-Don Choi
  • Patent number: 11038087
    Abstract: A light emitting device package can include a package body; a light emitting device disposed on the package body and including first and second electrode pads on a bottom surface of the light emitting device; a first through hole in the package body; a second through hole in the package body, in which the first through hole is separated from the second through hole, the first electrode pad of the light emitting device directly overlaps with the first through hole in the package body, and the second electrode pad of the light emitting device directly overlaps with the second through hole in the package body.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: June 15, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Tae Sung Lee, June O Song, Chang Man Lim
  • Patent number: 10809596
    Abstract: An embodiment may have a substrate (110) including a predetermined cavity (C); a plurality of light emitting chips (120) spaced apart from the cavity (C) of the substrate (110); a frame (130), disposed on the substrate (110) including a support portion (132) and a guide portion (134) including a predetermined through hole (H1); and a lens unit (140) disposed in the through hole (H1) of the guide portion (134).
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: October 20, 2020
    Assignee: LG Innotek Co., Ltd.
    Inventors: Jong Beom Choi, Tae Sung Lee, Min Ji Jin
  • Publication number: 20200274042
    Abstract: A light emitting device package can include a package body; a light emitting device disposed on the package body and including first and second electrode pads on a bottom surface of the light emitting device; a first through hole in the package body; a second through hole in the package body, in which the first through hole is separated from the second through hole, the first electrode pad of the light emitting device directly overlaps with the first through hole in the package body, and the second electrode pad of the light emitting device directly overlaps with the second through hole in the package body.
    Type: Application
    Filed: September 29, 2017
    Publication date: August 27, 2020
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Tae Sung LEE, June O SONG, Chang Man LIM
  • Patent number: 10749089
    Abstract: A light emitting device package according to an embodiment includes: a package body; a light emitting device disposed on the package body; and an adhesive disposed between the package body and the light emitting device. The package body includes first and second openings passing through the package body on an upper surface of the package body and a recess provided to concave in a direction of a lower surface of the package body from the upper surface of the package body. The light emitting device includes a first bonding part disposed on the first opening and a second bonding part disposed on the second opening. The adhesive is provided at the recess.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: August 18, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Tae Sung Lee, Won Jung Kim, June O Song, Chang Man Lim
  • Publication number: 20200203566
    Abstract: A semiconductor device according to an embodiment may include: a light emitting structure; a light transmitting electrode layer disposed on the light emitting structure; and a reflective layer disposed on the light transmitting electrode layer and including a plurality of first openings and a plurality of second openings. The semiconductor device according to the embodiment may include: a first electrode in contact with a first conductivity type semiconductor layer of the light emitting structure; and a second electrode in contact with the light transmitting electrode layer through the plurality of first openings.
    Type: Application
    Filed: August 24, 2018
    Publication date: June 25, 2020
    Inventors: Chang Hyeong LEE, June O SONG, Tae Sung LEE, Chang Man LIM, Se Yeon JUNG, Byung Yeon CHOI, Sung Min HWANG
  • Patent number: 10676665
    Abstract: Disclosed is an outdoor color-changeable film with self-recovering properties that includes a transparent base film; a hard-coating pearl layer formed on an outer surface of the transparent base film and includes pearl particles dispersed in a hard-coating agent; a first adhesive layer disposed on another surface of the transparent base layer; a color base film disposed on the first adhesive layer to laminate the color base film onto a surface of the hard-coating pearl layer; a second adhesive layer coated on a surface of the color base film; and a release film detachably laminated onto the second adhesive layer. The self-recovering properties include water repellency, anti-fouling, and antibacterial functions, ultraviolet ray blocking ability, and use in various fields due to a long-lasting film property and an insecticidal effect.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: June 9, 2020
    Assignee: E and B Co., Ltd.
    Inventors: Sang-tae Kim, Tae-sung Lee
  • Patent number: 10672959
    Abstract: A light emitting device package can include first and second frames spaced apart from each other; a package body including a body portion between the first and second frames; a light emitting device including first and second electrode pads; first and second through holes in the first and second frames, respectively; a first resin between the body portion and the light emitting device; and a conductive material in the first and second through holes, in which the first and second electrode pads of the light emitting device respectively overlap with the first and second through holes, the first and second electrode pads are spaced apart from each other, and the conductive material in the first and second through holes respectively contacts the first and second electrode pads, and a first side surface of the first electrode pad and a second side surface of the second electrode pad facing the first side surface both contact the first resin.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: June 2, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Tae Sung Lee, June O Song, Chang Man Lim
  • Patent number: 10600945
    Abstract: The light emitting device package disclosed in the embodiment includes: first and second frames having first and second through holes; a body disposed between the first and second frames; a light emitting device including a first bonding pad and a second bonding pad; and a conductive part in the first and second through holes. wherein at least one of the first and second bonding pads faces the first and second frames and overlaps with the first and second through holes and includes a contact region contacting the conductive part and a first non-contact non-contacting the conducive part.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: March 24, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Chang Man Lim, Ki Seok Kim, Young Shin Kim, June O Song, Ju Hyeon Oh, Chang Hyeong Lee, Tae Sung Lee, Se Yeon Jung, Byung Yeon Choi, Sung Min Hwang
  • Publication number: 20200091021
    Abstract: A semiconductor device includes a semiconductor die, a defect detection structure and an input-output circuit. The semiconductor die includes a central region and a peripheral region surrounding the central region. The peripheral region includes a left-bottom corner region, a left-upper corner region, a right-upper corner region and a right-bottom corner region. The defect detection structure is formed in the peripheral region. The defect detection structure includes a first conduction loop in the left-bottom corner region, a second conduction loop in the right-bottom corner region, a third conduction loop in the left-bottom corner region and the left-upper corner region and a fourth conduction loop in the right-bottom corner region and the right-upper corner region. The input-output circuit is electrically connected to end nodes of the first conduction loop, the second conduction loop, the third conduction loop and the fourth conduction loop.
    Type: Application
    Filed: March 19, 2019
    Publication date: March 19, 2020
    Inventors: Min-Jae Lee, Sang-Lok Kim, Byung-Hoon Jeong, Tae-Sung Lee, Jeong-Don Ihm, Jae-Yong Jeong, Young-Don Choi
  • Patent number: 10497846
    Abstract: A light emitting device package according to an embodiment includes: a body including first and second openings passing through an upper surface of the body and a lower surface of the body; a light emitting device disposed on the body and including first and second bonding parts; and first and second conductive layers disposed under the body and electrically connected to the first and second bonding parts, respectively, wherein each of the first and second bonding parts includes a protrusion portion protruding and extending in a downwards direction within the first and second openings, respectively.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: December 3, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Tae Sung Lee, Chang Man Lim, June O Song
  • Patent number: 10497827
    Abstract: A light emitting device package includes a first frame and a second frame disposed to be spaced apart from each other; a body disposed between the first and second frames and comprising a recess; a first adhesive on the recess; a light emitting device on the first adhesive; a second adhesive disposed between the first and second frames and the light emitting device; and a resin portion disposed to surround the second adhesive and a partial region of the light emitting device.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: December 3, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Tae Sung Lee, June O Song, Ki Seok Kim, Young Shin Kim, Chang Man Lim
  • Publication number: 20190302573
    Abstract: An embodiment may have a substrate (110) including a predetermined cavity (C); a plurality of light emitting chips (120) spaced apart from the cavity (C) of the substrate (110); a frame (130), disposed on the substrate (110) including a support portion (132) and a guide portion (134) including a predetermined through hole (H1); and a lens unit (140) disposed in the through hole (H1) of the guide portion (134).
    Type: Application
    Filed: May 19, 2017
    Publication date: October 3, 2019
    Inventors: Jong Beom CHOI, Tae Sung LEE, Min Ji JIN