Publication number: 20250167043
Abstract: An interconnect structure including a dielectric layer having a trench structure; a conductive wiring including a metal compound represented by Chemical Formula 1 disposed within the trench structure (conductive interconnect), and air gap disposed between the conductive wiring. The trench structure has a line width of less than or equal to about 10 nm and an aspect ratio of greater than or equal to about 3. MXa??Chemical Formula 1 In Chemical Formula 1, M is at least one metal of Zr, Nb, Cu, Ru, Al, Co, W, Mo, Ti, Ta, Ni, Pt, Cr, Rh, Ir, Pd, or Os, X is at least one element of C, N, P, As, S, Se, or Te, and a is a number determined by the stoichiometry of M and X.
Type:
Application
Filed:
November 15, 2024
Publication date:
May 22, 2025
Inventors:
Keun Wook SHIN, Sangwon KIM, Joonseok KIM, Joonyun KIM, Daejin YANG, Chang Seok LEE, Tae Won JEONG, GIYOUNG JO, LUHING HU