Abstract: A communication apparatus for inter-vehicular communication according to the present invention includes: a network state estimating unit configured to estimate network state information indicating a current network state based on driving information and channel state information of neighboring vehicles; a network access controller configured to control whether to transmit a message based on the network state information; a transmission scheduler configured to control a transmission time point of the message based on the network state information; and a transmission buffer unit configured to delay transmission of the message according to the control of the transmission time point of the transmission scheduler.

Abstract: Systems and methods may be used to produce coated components. Exemplary chamber components may include an aluminum, stainless steel, or nickel plate defining a plurality of apertures. The plate may include a hybrid coating, and the hybrid coating may include a first layer comprising a corrosion resistant coating. The first layer may extend conformally through each aperture of the plurality of apertures. The hybrid coating may also include a second layer comprising an erosion resistant coating extending across a plasma-facing surface of the semiconductor chamber component.

Abstract: A communication apparatus for inter-vehicular communication according to the present invention includes: a network state estimating unit configured to estimate network state information indicating a current network state based on driving information and channel state information of neighboring vehicles; a network access controller configured to control whether to transmit a message based on the network state information; a transmission scheduler configured to control a transmission time point of the message based on the network state information; and a transmission buffer unit configured to delay transmission of the message according to the control of the transmission time point of the transmission scheduler.

Abstract: A flexible Ti—In—Zn—O transparent electrode for a dye-sensitized solar cell includes a flexible transparent substrate, and a Ti—In—Zn—O thin-film on the flexible transparent substrate. The Ti—In—Zn—O thin-film has an amorphous structure. The flexible transparent electrode, despite being deposited at room or low temperature, has low surface resistance, high conductivity and transmittance, superior resistance against external bending, improved surface characteristics and better surface roughness performance.

Abstract: A method of determining an angle by an encoder includes generating a first angle data based on a rotation of a bipolar magnet and a second angle data based on a rotation of the multipolar magnet; determining a first waveform signal based on the first angle data and a second waveform signal based on the second angle data; converting the first waveform signal into a third waveform signal having a cycle similar to the second waveform signal; calculating an angle result value as a function of the second angle data and a determined value about a location of a rotation cycle of the multipolar magnet based on a difference between the second waveform signal and the third waveform signal; and determining an absolute angle corresponding to the calculated angle result value based on stored angle data.

Abstract: Disclosed herein are a semiconductor package and a method of manufacturing the same. The semiconductor package according to embodiments of the present disclosure includes a wiring including a plurality of layers including an insulating layer and a wiring layer, a semiconductor chip mounted on the wiring and electrically connected to the wiring layer through a bonding pad, a cover member configured to cover side surfaces of the semiconductor chip and the wiring and be in contact with at least one wiring layer, and an encapsulant configured to seal the cover member. Accordingly, the cover member covers the semiconductor chip and is in contact with the wiring formed under the semiconductor chip, thereby reducing electromagnetic interference, minimizing noise between operations of the semiconductor package, and improving a signal speed.

Abstract: The method for manufacturing a solid electrolyte using an LLZ material for a lithium-ion battery comprises the steps of: providing a starting material in which lanthanum nitrate [La(NO3)3.6H2O] and zirconium nitrate [ZrO(NO3)2.6H2O] are mixed at a mole ratio of 3:2; forming an aqueous solution by dissolving the starting material; forming a precipitate by putting ammonia, which is a complex agent, and sodium hydroxide, which adjusts the pH of a reactor, into the aqueous solution, mixing the same, and then co-precipitating the mixture; forming a primary precursor powder by cleaning, drying and pulverizing the precipitate; forming a secondary precursor powder by mixing lithium powder [LiOH.H2O] with the primary precursor powder and ball-milling the mixture so as to solidify the lithium; and forming a solid electrolyte powder by heat-treating the secondary precursor powder.

Abstract: The present disclosure relates to a new biomarker for predicting susceptibility to an EGFR-targeted agent and a use thereof, and more particularly, provides a biomarker for predicting susceptibility to an EGFR (Epidermal Growth Factor Receptor)-targeted agent, comprising a RON (Recepteur d'Origine Nantais) gene; a composition for predicting susceptibility to the EGFR-targeted agent, comprising an agent which measures a gene expression level of the biomarker; or an expression or activity level of a protein thereof; a composition for enhancing the susceptibility to the EGFR-targeted agent, comprising an inhibitor of the expression of the gene or the expression or activity of the protein of the gene as active ingredients; a kit for predicting the susceptibility to the EGFR-targeted agent, comprising the composition; and a method for predicting the susceptibility to the EGFR-targeted agent.

Abstract: A semiconductor package comprising a fan-out structure and a manufacturing method therefor are disclosed. A semiconductor package according to an embodiment of the present invention comprises: a wiring unit comprising an insulation layer and a wiring layer; a semiconductor chip mounted on the wiring unit and coupled to the wiring layer by flip-chip bonding; a filling member for filling a gap between the semiconductor chip and the wiring unit; and a film member for performing coating so as to cover one surface of each of the semiconductor chip, the filling member, and the wiring unit.

Abstract: An electronic device according to the present disclosure includes: a housing including a first plate directed in a first direction, a second plate facing a second direction opposite the first direction, and a side member that encloses at least a portion of a space between the first plate and the second plate; a display disposed to be exposed through a first region of the first plate; a first opening formed in a second region of the first plate that is located adjacent to the display; a button structure disposed through the first opening, in which the button structure includes a cover layer exposed to an outside of the housing, an annular structure that encloses at least a portion of the cover layer when viewed from above the cover layer, and a fingerprint recognizing member enclosed by the annular structure and including a fingerprint recognizing pad including a plurality of conductive lines formed to recognize a fingerprint when a user's finger comes in contact with the cover layer, and a circuit region incl

Abstract: A method of applying a multi-layer plasma resistant coating on an article comprises performing plating or ALD to form a conformal first plasma resistant layer on an article, wherein the conformal first plasma resistant layer is formed on a surface of the article and on walls of high aspect ratio features in the article. The conformal first plasma resistant coating has a porosity of approximately 0% and a thickness of approximately 200 nm to approximately 1 micron. One of electron beam ion assisted deposition (EB-IAD), plasma enhanced chemical vapor deposition (PECVD), aerosol deposition or plasma spraying is then performed to form a second plasma resistant layer that covers the conformal first plasma resistant layer at a region of the surface but not at the walls of the high aspect ratio features.

Abstract: An external preparation for skin and an aerogel paste are provided. The external preparation for skin comprises aerogel powder and a solvent. The aerogel powder includes a mixture of aerogel particles having a hydrophilic functional group on a surface thereof and aerogel particles having a hydrophobic functional group on a surface thereof. The hydrophilic functional group is a hydroxy group, and the hydrophobic functional group is hydrogen, a C1 to C18 alkyl group, a silyloxy group represented by the following Chemical Formula 1, or a combination thereof: [Chemical Formula 1] *—OSiH(3-n)R1n wherein R1 is a C1 to C18 alkyl group, n is an integer ranging from 0 to 3, and * denotes a bond.

Abstract: A mobile device and a method thereof are provided. The mobile device includes a display configured to display an image; a metal bezel surrounding an outer perimeter of the display; a temperature sensor configured to measure a temperature of an object via the metal bezel; and a controller configured to control the display to output the temperature measured using the temperature sensor.

Abstract: The present disclosure generally relates to apparatuses and methods for reducing particle contamination on substrate surfaces. In one example, the apparatus is embodied as a load lock chamber including a top heater liner disposed over and coupled to a heater pedestal. The top heater liner generally includes a top plate and one or more walls, which support the top heater liner over the heater pedestal. Since the top heater liner is in contact with the heater pedestal, the top heater liner is generally heated to a temperature at which contaminating particles are volatile, such as greater than about 100° C. In operation, volatile fluorine passing through or adjacent to the hot top heater liner remains in gaseous form and thus are pumped out of the load lock chamber. The top heater liner thus advantageously reduces the potential for contaminating particles depositing on the substrate surface and improves overall production yield.

Abstract: A method of purifying an organic material using an ionic liquid according to the present invention includes a sublimation step (S510) of sublimating the organic material containing an impurity, a capturing step (S520) of bringing a sublimated gas of the organic material into contact with the flowing ionic liquid to capture the sublimated gas, and a recrystallization step (S530) of preferentially oversaturating the organic material, which is to be purified, of the sublimated gas, which is captured in the ionic liquid to be dissolved, to thus generate the recrystallized organic material. In the present invention, it is not necessary to perform a process of carrying the sublimated gas, which is generated during the sublimation step, to implement reverse sublimation. Accordingly, there is a merit in that the contamination of a purified sample by an inert carrier gas, which is used in a conventional sublimation purification method, is fundamentally avoided.

Abstract: This disclosure synthesizes an anodic composite material Li(LixNiyCozMnwO2+?) of Li2MnO3 series whose theoretical capacity is a level of about 460 mAh/g, and to produce an electrode of a high capacity using the synthesized anodic composite material. Also provided is a method for charging and discharging the electrode. Here, the method for producing an anodic composite material for a lithium secondary battery includes the steps of: mixing a nickel nitrate solution, a manganese nitrate solution, and a cobalt nitrate solution to produce a starting material solution; and mixing the starting material solution with a complexing agent so as to produce an anodic composite material Li(LixNiyCozMnwO2+?) of Li2MnO3 series by means of coprecipitation.

Abstract: A communication apparatus for inter-vehicular communication according to the present invention includes: a network state estimating unit configured to estimate network state information indicating a current network state based on driving information and channel state information of neighboring vehicles; a network access controller configured to control whether to transmit a message based on the network state information; a transmission scheduler configured to control a transmission time point of the message based on the network state information; and a transmission buffer unit configured to delay transmission of the message according to the control of the transmission time point of the transmission scheduler.

Abstract: The present disclosure relates to a biomarker for predicting the sensitivity to a protein kinase inhibitor and a use thereof. The present disclosure provides a marker, a composition, and a kit for predicting the sensitivity to a protein kinase inhibitor, and a prediction method thereof. According to the present disclosure, the marker has an excellent effect of predicting the sensitivity to a protein kinase inhibitor, and thus the present disclosure can be useful for cancer treatment.

Abstract: A communication apparatus for inter-vehicular communication according to the present invention includes: a network state estimating unit configured to estimate network state information indicating a current network state based on driving information and channel state information of neighboring vehicles; a network access controller configured to control whether to transmit a message based on the network state information; a transmission scheduler configured to control a transmission time point of the message based on the network state information; and a transmission buffer unit configured to delay transmission of the message according to the control of the transmission time point of the transmission scheduler.

Abstract: Disclosed herein are a semiconductor package and a method of manufacturing the same. The semiconductor package according to embodiments of the present disclosure includes a wiring including a plurality of layers including an insulating layer and a wiring layer, a semiconductor chip mounted on the wiring and electrically connected to the wiring layer through a bonding pad, a cover member configured to cover side surfaces of the semiconductor chip and the wiring and be in contact with at least one wiring layer, and an encapsulant configured to seal the cover member.