Abstract: A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substrate susceptor and the substrate holder.

Abstract: A semiconductor package includes a first substrate including silicon, a first insulating layer in contact with the first substrate, the first insulating layer including silicon oxide, the first insulating layer having a first concentration of silicon, a second insulating layer in contact with the first insulating layer, the second insulating layer including silicon oxide, the second insulating layer having a second concentration of silicon, the second concentration lower than the first concentration, and a structure on the second insulating layer. The first concentration is a ratio of a weight of silicon in the first insulating layer to a total weight of the first insulating layer, the second concentration is a ratio of a weight of silicon in the second insulating layer to a total weight of the second insulating layer, and the first concentration is in a range from 20 wt % to 50 wt %.

Abstract: A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substrate susceptor and the substrate holder.

Abstract: The present invention discloses a system and method for redesigning treatment prescriptions according to evaluation of treatment effectiveness. In the present invention, when the system receives the treatment prescriptions from the medical staff terminal, sets the treatment device according to the treatment prescriptions, and delivers the treatment device to the patient, the patient performs treatment by himself using the treatment device at home. When the treatment is finished, the patient terminal transmits the treatment history information, the treatment image obtained by photographing the process of self-treatment, and the questionnaire replies to the system. The system calculates compliance from the treatment history information, evaluates the treatment motor/cognitive/emotional functions from the questionnaire reply, and then provides them to the medical staff terminal together with the questionnaire replies, and allows the medical staff to evaluate effect of the treatment prescriptions.

Abstract: A wafer bonding apparatus is provided includes a lower support plate configured to structurally support a first wafer on an upper surface of the lower support plate; a lower structure adjacent to the lower support plate and movable in a vertical direction that is perpendicular to the upper surface of the lower support plate, an upper support plate configured to structurally support a second wafer on a lower surface of the lower support plate, and an upper structure adjacent to the upper support plate and movable in the vertical direction.

Abstract: A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substrate susceptor and the substrate holder.

Abstract: A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substrate susceptor and the substrate holder.

Abstract: Provided are an electric stimulation simulation method, a server, and a computer program for determining an optimal stimulation position combination. The electric stimulation simulation method for determining an optimal stimulation position combination according to various embodiments of the present invention is executed by a computing device and includes: filtering stimulation positions corresponding to a preset condition among the plurality of stimulation positions according to a preset guide system; and simulating the electric stimulation for the brain of the subject by using remaining stimulation positions except for the filtered stimulation positions among the plurality of stimulation positions.

Abstract: Disclosed is a spike spectrum output-type pressure sensor including an electrolyte and a method of manufacturing the same. The pressure includes a first electrode, a pressure sensing unit positioned on the first electrode and including a pattern including an electrolyte, a spacer positioned on the first electrode and configured to partially or fully surround the pressure sensing unit, and a second electrode positioned on the spacer and on the pressure sensing unit and spaced apart from the pressure sensing unit. The pressure sensor of the present invention can provide reliable pressure sensing results even in an environment where noise may occur due to stable signal transmission of a spike spectrum, which is a kind of frequency-based signal.

Abstract: A semiconductor laser device may include a first cladding on a substrate, an optical waveguide on the first cladding, a laser light source chip on the optical waveguide to generate a laser beam, a first adhesive layer between the optical waveguide and the laser light source chip, and a second adhesive layer covering a sidewall of the laser light source chip.

Abstract: The present disclosure relates to a sparse-coded ambient backscatter communication method and a system. According to the sparse-coded ambient backscatter communication method, in an ambient backscatter system including an access point and a plurality of sensor nodes, each sensor node transmits a code word in a non-orthogonal multiple access (NOMA) manner using sparsity of a signal by a duty cycling operation and the access point detects a superimposed signal transmitted in the NOMA manner by an iterative decoding method in which a dyadic channel and intersymbol interference are reflected. The present disclosure may reduce the implementation cost by reducing the number of impedances required to modulate data of a batteryless sensor node in an Internet of Things environment and utilize the dyadic backscatter channel to detect a signal, thereby providing massive connectivity of the access point.

Abstract: A wafer bonding apparatus includes a first bonding chuck to fix a first wafer on a first surface thereof, a second bonding chuck to fix a second wafer on a second surface thereof facing the first surface, a bonding initiation member at a center of the first bonding chuck to push the first wafer towards the second surface, and a membrane member including a protrusion protruding from a center portion of the second surface towards the first surface, and a planar portion defining the protrusion on an outer region surrounding the center portion.

Abstract: A wafer bonding apparatus including: a lower chuck to which a lower wafer is secured at a peripheral portion of the lower chuck; an upper chuck to which an upper wafer is secured; a bonding initiator for pressuring a central portion of the upper wafer until the central portion of the upper wafer reaches a central portion of the lower wafer, thereby initiating a bonding process of the upper and the lower wafers by deforming the upper wafer; and a bonding controller for controlling a bonding speed between a peripheral portion of the upper wafer and a peripheral portion of the lower wafer such that the upper wafer becomes un-deformed prior to bonding the peripheral portion of the upper wafer and the peripheral portion of the lower wafer.

Abstract: A wafer bonding apparatus is provided includes a lower support plate configured to structurally support a first wafer on an upper surface of the lower support plate; a lower structure adjacent to the lower support plate and movable in a vertical direction that is perpendicular to the upper surface of the lower support plate, an upper support plate configured to structurally support a second wafer on a lower surface of the lower support plate, and an upper structure adjacent to the upper support plate and movable in the vertical direction.

Abstract: A substrate bonding apparatus includes a lower chuck, an upper chuck, an electric actuator on a central portion of the upper chuck, a pressure sensor, and a controller. The lower chuck may support a lower substrate, the upper chuck may face the lower chuck such that a lower surface of the upper chuck faces the upper surface of the lower chuck, and the upper chuck may support an upper substrate. The electric actuator may lower a bonding pin through the upper chuck to apply a pressure to the upper substrate supported on the upper chuck. The pressure sensor may be below the lower substrate supported on the lower chuck. The pressure sensor may sense a lowering pressure applied by the bonding pin to the pressure sensor in real time. The controller may control the lowering pressure applied by the bonding pin.

Abstract: A substrate bonding apparatus and a method of bonding substrates, the apparatus including an upper chuck securing a first substrate onto a lower surface thereof such that the first substrate is downwardly deformed into a concave surface profile; a lower chuck arranged under the upper chuck and securing a second substrate onto an upper surface thereof such that the second substrate is upwardly deformed into a convex surface profile; and a chuck controller controlling the upper chuck and the lower chuck to secure the first substrate and the second substrate, respectively, and generating a shape parameter for changing a shape of the second substrate to the convex surface profile from a flat surface profile.

Abstract: A substrate bonding apparatus includes a lower chuck, an upper chuck, an electric actuator on a central portion of the upper chuck, a pressure sensor, and a controller. The lower chuck may support a lower substrate, the upper chuck may face the lower chuck such that a lower surface of the upper chuck faces the upper surface of the lower chuck, and the upper chuck may support an upper substrate. The electric actuator may lower a bonding pin through the upper chuck to apply a pressure to the upper substrate supported on the upper chuck. The pressure sensor may be below the lower substrate supported on the lower chuck. The pressure sensor may sense a lowering pressure applied by the bonding pin to the pressure sensor in real time. The controller may control the lowering pressure applied by the bonding pin.

Abstract: Provided are a wafer bonding apparatus for accurately detecting a bonding state of wafers in a wafer bonding process and/or in a wafer bonding system including the wafer bonding apparatus. The wafer bonding apparatus includes a first supporting plate including a first surface and vacuum grooves for vacuum-absorption of a first wafer disposed on the first surface, a second supporting plate including a second surface facing the first surface. A second wafer is on the second surface. The wafer bonding apparatus and/or the wafer bonding system include a bonding initiator at a center portion of the first supporting plate, and an area sensor on the first supporting plate and configured to detect a propagation state of bonding between the first wafer and the second wafer.

Abstract: A semiconductor laser device may include a first cladding on a substrate, an optical waveguide on the first cladding, a laser light source chip on the optical waveguide to generate a laser beam, a first adhesive layer between the optical waveguide and the laser light source chip, and a second adhesive layer covering a sidewall of the laser light source chip.

Abstract: The present disclosure relates to a sparse-coded ambient backscatter communication method and a system. According to the sparse-coded ambient backscatter communication method, in an ambient backscatter system including an access point and a plurality of sensor nodes, each sensor node transmits a code word in a non-orthogonal multiple access (NOMA) manner using sparsity of a signal by a duty cycling operation and the access point detects a superimposed signal transmitted in the NOMA manner by an iterative decoding method in which a dyadic channel and intersymbol interference are reflected. The present disclosure may reduce the implementation cost by reducing the number of impedances required to modulate data of a batteryless sensor node in an Internet of Things environment and utilize the dyadic backscatter channel to detect a signal, thereby providing massive connectivity of the access point.