Abstract: A bladder lesion diagnosis method using a learned neural network, and a system thereof. The bladder lesion diagnosis method using a neural network includes the steps of: receiving a unit pathological image by a bladder lesion diagnosis system; inputting, by the bladder lesion diagnosis system, the unit pathological image into a first neural network to obtain the diagnosis result of a first bladder lesion among a plurality of bladder lesions in the unit pathological image; and inputting, by the bladder lesion diagnosis system, the unit pathological image into a second neural network to obtain the diagnosis result of a second bladder lesion, other than the first bladder lesion, among the plurality of bladder lesions in the unit pathological image.

Abstract: A touch sensor includes first touch cells disposed in a first touch sensing area, the first touch cells each including a first touch pattern and a first dummy pattern, and second touch cells disposed in a second touch sensing area, the second touch cells each including a second touch pattern and a second dummy pattern. An area of a first dummy pattern area in which the first dummy pattern is disposed is greater than an area of a second dummy pattern area in which the second dummy pattern is disposed.

Abstract: Embodiments of the inventive concept provide a substrate treating apparatus and a substrate treating method for not letting an irradiation region of a laser deviate from a target region, even if a shaking angle of a chemical deviates from an allowable range due to a vibration or an airflow. The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes: a substrate support unit configured to support a substrate having a chemical coated thereon; a laser generation unit configured to irradiate a laser to the substrate; and a light-transmitter positioned along a path at which the laser is irradiated.

Abstract: A display device includes a substrate including a display area and a non-display area, a pixel located in the display area, a pad unit on one side of the non-display area, and a driver connected to the pixel. The pixel includes a first insulating layer, a first light emitting element on the first insulating layer, a second insulating layer on the first light emitting element and exposing one end portion and another end portion of the first light emitting element, a first contact electrode on the second insulating layer and connected to the one end portion of the first light emitting element, and a second contact electrode on the second insulating layer and connected to the other end portion of the first light emitting element. The pad unit includes a pad metal layer, a first pad insulating layer, a second pad insulating layer, and a pad electrode.

Abstract: Disclosed are a method for refining a tissue image by removing, from a slide image of a tissue specimen, a tissue specimen region determined to be another tissue specimen, and a computer system performing same. According to one aspect of the present invention, provided is a method for refining a tissue specimen image, comprising the steps of: extracting a plurality of contours corresponding to a plurality of tissue regions included in a tissue specimen image; calculating the center point coordinates of each of the extracted plurality of contours; determining a main tissue contour from among the plurality of contours, on the basis of the center point coordinates of the tissue specimen image and the center point coordinates of each of the plurality of contours; and removing a region corresponding to at least a part of the contours other than the main tissue contour among the plurality of contours.

Abstract: The present invention discloses a system and method for redesigning treatment prescriptions according to evaluation of treatment effectiveness. In the present invention, when the system receives the treatment prescriptions from the medical staff terminal, sets the treatment device according to the treatment prescriptions, and delivers the treatment device to the patient, the patient performs treatment by himself using the treatment device at home. When the treatment is finished, the patient terminal transmits the treatment history information, the treatment image obtained by photographing the process of self-treatment, and the questionnaire replies to the system. The system calculates compliance from the treatment history information, evaluates the treatment motor/cognitive/emotional functions from the questionnaire reply, and then provides them to the medical staff terminal together with the questionnaire replies, and allows the medical staff to evaluate effect of the treatment prescriptions.

Abstract: A display device includes light transmitting areas including a first light transmitting area and light emitting areas around the light transmitting areas and including a first light emitting area disposed around the first light transmitting area, wherein the first light emitting area includes a first-first light emitting area adjacent to a first portion of each of the light transmitting areas, a first-second light emitting area adjacent to a second portion of each of the light transmitting areas, a first-third light emitting area adjacent to a third portion of each of the light transmitting areas, and a first-fourth light emitting area disposed adjacent to a fourth portion of each of the light transmitting areas. The first-first to first-fourth light emitting areas each include at least one of first to third light emitting portions to emit light of first to third colors, respectively.

Abstract: A wafer bonding apparatus is provided includes a lower support plate configured to structurally support a first wafer on an upper surface of the lower support plate; a lower structure adjacent to the lower support plate and movable in a vertical direction that is perpendicular to the upper surface of the lower support plate, an upper support plate configured to structurally support a second wafer on a lower surface of the lower support plate, and an upper structure adjacent to the upper support plate and movable in the vertical direction.

Abstract: A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substrate susceptor and the substrate holder.

Abstract: A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substrate susceptor and the substrate holder.

Abstract: Provided are an electric stimulation simulation method, a server, and a computer program for determining an optimal stimulation position combination. The electric stimulation simulation method for determining an optimal stimulation position combination according to various embodiments of the present invention is executed by a computing device and includes: filtering stimulation positions corresponding to a preset condition among the plurality of stimulation positions according to a preset guide system; and simulating the electric stimulation for the brain of the subject by using remaining stimulation positions except for the filtered stimulation positions among the plurality of stimulation positions.

Abstract: Disclosed is a spike spectrum output-type pressure sensor including an electrolyte and a method of manufacturing the same. The pressure includes a first electrode, a pressure sensing unit positioned on the first electrode and including a pattern including an electrolyte, a spacer positioned on the first electrode and configured to partially or fully surround the pressure sensing unit, and a second electrode positioned on the spacer and on the pressure sensing unit and spaced apart from the pressure sensing unit. The pressure sensor of the present invention can provide reliable pressure sensing results even in an environment where noise may occur due to stable signal transmission of a spike spectrum, which is a kind of frequency-based signal.

Abstract: A semiconductor laser device may include a first cladding on a substrate, an optical waveguide on the first cladding, a laser light source chip on the optical waveguide to generate a laser beam, a first adhesive layer between the optical waveguide and the laser light source chip, and a second adhesive layer covering a sidewall of the laser light source chip.

Abstract: The present disclosure relates to a sparse-coded ambient backscatter communication method and a system. According to the sparse-coded ambient backscatter communication method, in an ambient backscatter system including an access point and a plurality of sensor nodes, each sensor node transmits a code word in a non-orthogonal multiple access (NOMA) manner using sparsity of a signal by a duty cycling operation and the access point detects a superimposed signal transmitted in the NOMA manner by an iterative decoding method in which a dyadic channel and intersymbol interference are reflected. The present disclosure may reduce the implementation cost by reducing the number of impedances required to modulate data of a batteryless sensor node in an Internet of Things environment and utilize the dyadic backscatter channel to detect a signal, thereby providing massive connectivity of the access point.

Abstract: A wafer bonding apparatus includes a first bonding chuck to fix a first wafer on a first surface thereof, a second bonding chuck to fix a second wafer on a second surface thereof facing the first surface, a bonding initiation member at a center of the first bonding chuck to push the first wafer towards the second surface, and a membrane member including a protrusion protruding from a center portion of the second surface towards the first surface, and a planar portion defining the protrusion on an outer region surrounding the center portion.

Abstract: A wafer bonding apparatus including: a lower chuck to which a lower wafer is secured at a peripheral portion of the lower chuck; an upper chuck to which an upper wafer is secured; a bonding initiator for pressuring a central portion of the upper wafer until the central portion of the upper wafer reaches a central portion of the lower wafer, thereby initiating a bonding process of the upper and the lower wafers by deforming the upper wafer; and a bonding controller for controlling a bonding speed between a peripheral portion of the upper wafer and a peripheral portion of the lower wafer such that the upper wafer becomes un-deformed prior to bonding the peripheral portion of the upper wafer and the peripheral portion of the lower wafer.

Abstract: A wafer bonding apparatus is provided includes a lower support plate configured to structurally support a first wafer on an upper surface of the lower support plate; a lower structure adjacent to the lower support plate and movable in a vertical direction that is perpendicular to the upper surface of the lower support plate, an upper support plate configured to structurally support a second wafer on a lower surface of the lower support plate, and an upper structure adjacent to the upper support plate and movable in the vertical direction.

Abstract: A substrate bonding apparatus includes a lower chuck, an upper chuck, an electric actuator on a central portion of the upper chuck, a pressure sensor, and a controller. The lower chuck may support a lower substrate, the upper chuck may face the lower chuck such that a lower surface of the upper chuck faces the upper surface of the lower chuck, and the upper chuck may support an upper substrate. The electric actuator may lower a bonding pin through the upper chuck to apply a pressure to the upper substrate supported on the upper chuck. The pressure sensor may be below the lower substrate supported on the lower chuck. The pressure sensor may sense a lowering pressure applied by the bonding pin to the pressure sensor in real time. The controller may control the lowering pressure applied by the bonding pin.

Abstract: A substrate bonding apparatus and a method of bonding substrates, the apparatus including an upper chuck securing a first substrate onto a lower surface thereof such that the first substrate is downwardly deformed into a concave surface profile; a lower chuck arranged under the upper chuck and securing a second substrate onto an upper surface thereof such that the second substrate is upwardly deformed into a convex surface profile; and a chuck controller controlling the upper chuck and the lower chuck to secure the first substrate and the second substrate, respectively, and generating a shape parameter for changing a shape of the second substrate to the convex surface profile from a flat surface profile.

Abstract: A substrate bonding apparatus includes a lower chuck, an upper chuck, an electric actuator on a central portion of the upper chuck, a pressure sensor, and a controller. The lower chuck may support a lower substrate, the upper chuck may face the lower chuck such that a lower surface of the upper chuck faces the upper surface of the lower chuck, and the upper chuck may support an upper substrate. The electric actuator may lower a bonding pin through the upper chuck to apply a pressure to the upper substrate supported on the upper chuck. The pressure sensor may be below the lower substrate supported on the lower chuck. The pressure sensor may sense a lowering pressure applied by the bonding pin to the pressure sensor in real time. The controller may control the lowering pressure applied by the bonding pin.