Abstract: The present invention is related to a method of fabricating a liquid crystal display device which includes etching an attached substrate using an etchant to make the substrate thin and light. A plurality of main seal patterns are formed on a first substrate and auxiliary seal patterns are formed around each main seal pattern. Thereafter, a second substrate is attached to the first substrate by pressure. Then, an anti-etching material is formed around the sidewalls of the attached substrates. Due to the anti-etching material, an etchant etching the surfaces of the attached substrate does not penetrate into the interval between the first and second substrates.

Abstract: A liquid crystal display device includes a first substrate, a second substrate and a liquid crystal layer between the first and second substrates. The liquid crystal display device further includes a gate line on the first substrate, a first insulation film on the gate line, a data line crossing the gate line such that the data line and the gate line define a pixel region with a transmission area and a reflection area, a thin film transistor connected to the gate line and the data line, a storage capacitor including a storage line crossing the data line and an upper storage electrode connected to the thin film transistor, a second insulation film on the thin film transistor with a transmission hole defined through the second insulation film, a reflection electrode disposed on the second insulation film in the reflection area and connected to a portion of the upper storage electrode through the transmission hole, and a pixel electrode disposed in the pixel region and connected to the reflection electrode.

Abstract: A method of forming embossing patterns includes forming a metal layer over a substrate, irradiating a laser beam on the metal layer by using a laser apparatus including an optical scanner, and patterning the metal layer by controlling a scan speed of the optical scanner, thereby forming embossing patterns. The inventive embossing patterns can be formed without using a photoresist patterning step.

Abstract: A method of fabricating a liquid crystal display which prevents breakage of a substrate in a thin liquid crystal display panel. The method includes forming a plurality of sealant patterns defining a liquid layer on a first substrate, a plurality of dummy patterns between the sealant patterns, and a plurality of protective patterns on crossings between the dummy patterns; bonding a second substrate to the first substrate, forming a plurality of scribing lines on a surface of either the first or second substrate; and cutting the first and second substrates along the scribing lines.

Abstract: A liquid crystal display device includes first and second substrates, a plurality of gate lines and data lines on the first substrate, a plurality of switching devices at cross portions of the gate and data lines, a passivation layer on the plurality of switching devices, a plurality of ball spacers on the passivation layer, a color filter layer on the second substrate, and a plurality of column spacers on the color filter layer.

Abstract: A method of forming embossing patterns includes forming a metal layer over a substrate, irradiating a laser beam on the metal layer by using a laser apparatus including an optical scanner, and patterning the metal layer by controlling a scan speed of the optical scanner, thereby forming embossing patterns. The inventive embossing patterns can be formed without using a photoresist patterning step.

Abstract: A liquid crystal display device includes first and second substrates, a plurality of gate lines and data lines on the first substrate, a plurality of switching devices at cross portions of the gate and data lines, a passivation layer on the plurality of switching devices, a plurality of ball spacers on the passivation layer, a color filter layer on the second substrate, and a plurality of column spacers on the color filter layer.

Abstract: A method of fabricating a liquid crystal display which prevents breakage of a substrate in a thin liquid crystal display panel. The method includes forming a plurality of sealant patterns defining a liquid layer on a first substrate, a plurality of dummy patterns between the sealant patterns, and a plurality of protective patterns on crossings between the dummy patterns; bonding a second substrate to the first substrate, forming a plurality of scribing lines on a surface of either the first or second substrate; and cutting the first and second substrates along the scribing lines.

Abstract: A manufacturing method of an array substrate for a transflective liquid crystal display device includes forming a gate insulator on a gate line and a gate electrode formed on a substrate. A data line, source and drain electrodes are formed on an ohmic contact layer formed on an active layer on the gate insulator. A first passivation layer made of a first material is deposited on the data line, source and drain electrodes. A second passivation layer made of a second material is deposited on the first passivation layer. The second passivation layer is patterned, thereby forming a first drain contact hole exposing the first passivation layer over the drain electrode. A reflector is formed on the second passivation layer, the reflector having a first transmissive hole The first passivation layer is patterned thereby forming a second drain contact hole exposing the drain electrode. The second drain contact hole corresponds to the first drain contact hole.

Abstract: The present invention is related to a method of fabricating a liquid crystal display device which includes etching an attached substrate using an etchant to make the substrate thin and light. A plurality of main seal patterns are formed on a first substrate and auxiliary seal patterns are formed around each main seal pattern. Thereafter, a second substrate is attached to the first substrate by pressure. Then, an anti-etching material is formed around the sidewalls of the attached substrates. Due to the anti-etching material, an etchant etching the surfaces of the attached substrate does not penetrate into the interval between the first and second substrates.