Patents by Inventor Tae Yong Lee
Tae Yong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12262001Abstract: An image encoding/decoding method and apparatus are provided. An image encoding method performed by an image encoding apparatus may comprise determining an intra-prediction mode of a current block, configuring a reference sample of intra prediction by using at least one of a neighbor pixel of the current block in a current picture and a pixel of a reference picture, and performing intra prediction for the current block based on the intra-prediction mode and the reference sample.Type: GrantFiled: October 2, 2023Date of Patent: March 25, 2025Assignees: Electronics and Telecommunications Research Institute, University-Industry Cooperation Group of Kyung Hee UniversityInventors: Jung Won Kang, Hyun Suk Ko, Sung Chang Lim, Jin Ho Lee, Ha Hyun Lee, Dong San Jun, Seung Hyun Cho, Hui Yong Kim, Jin Soo Choi, Gwang Hoon Park, Tae Hyun Kim, Dae Young Lee
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Publication number: 20250096389Abstract: Provided is a battery pack and a vehicle including the same. The battery pack includes a plurality of pouch-type battery cells, a pack case having an inner space in which the plurality of pouch-type battery cells are accommodated, and a cell cover at least partially surrounding and supporting at least some of the plurality of pouch-type battery cells. The cell cover includes a first cover portion covering one side surface of at least one of the plurality of battery cells, a second cover portion covering the other side surface of at least one of the plurality of battery cells, and a third cover portion connecting the first cover portion to the second cover portion and covering an upper end portion of the at least one battery cell. A first venting hole through which gas or flame is discharged is formed in at least one portion of the third cover portion.Type: ApplicationFiled: July 14, 2023Publication date: March 20, 2025Applicant: LG Energy Solution, Ltd.Inventors: Woo-Yong Kwon, Seung-Joon Kim, In-Soo Kim, Jin-Yong Park, Se-Yun Chung, Myung-Woo Lee, Song-Ju Shin, Ho-June Chi, Jong-Mo Kang, Kyung-Woo Kim, Duck-Hee Moon, Hyun-Mo Yoon, Tae-Kyeong Lee, Jong-Ha Jeong, Ji-Soo Hwang
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Patent number: 12254803Abstract: A display device is provided. The display device comprises a display panel including a plurality of signal pads and one or more dummy pads, and at least one flexible wiring board providing signals to the signal pads, wherein a maximum bias period of signals provided to a pair of adjacent signal pads with at least one dummy pad interposed therebetween is longer than a maximum bias period of signals provided to a pair of adjacent signal pads with no dummy pad disposed therebetween.Type: GrantFiled: July 6, 2023Date of Patent: March 18, 2025Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Tae Hoon Kwon, Ji Hyun Ka, Byung Sun Kim, Yang Wan Kim, Hyung Jun Park, Su Jin Lee, Jae Yong Lee, Jin Tae Jeong, Seung Ji Cha
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Publication number: 20250087826Abstract: A battery pack includes a plurality of pouch-type battery cells; a pack case accommodating the pouch-type battery cells in the internal space; and a cell cover. The cell cover includes two unit covers at least partially spaced apart, provided to at least partially surround at least some of the pouch-type battery cells among the plurality of pouch-type battery cells in the internal space of the pack case. The cell cover is configured to allow venting gas to be discharged into the separation space between the two unit covers, thereby ensuring excellent safety when a thermal event occurs. Moreover, the present application discloses a battery module and a vehicle including the same.Type: ApplicationFiled: July 13, 2023Publication date: March 13, 2025Applicant: LG Energy Solution, Ltd.Inventors: Jin-Yong Park, Woo-Yong Kwon, Seung-Joon Kim, In-Soo Kim, Song-Ju Shin, Myung-Woo Lee, Jong-Mo Kang, Kyung-Woo Kim, Duck-Hee Moon, Tae-Kyeong Lee, Se-Yun Chung, Jong-Ha Jeong, Ho-June Chi, Ji-Soo Hwang
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Publication number: 20250080953Abstract: A control method of a mobile terminal includes receiving content information and device information, receiving a content selection signal and a device selection signal from a user, generating a control command for controlling a content corresponding to the content selection signal, and transmitting the control command to a host. The control command includes a change command for switching a selected device to another device to output a selected content continuously.Type: ApplicationFiled: November 17, 2024Publication date: March 6, 2025Inventors: Tae Young LEE, Tae Yong KIM
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Publication number: 20250080721Abstract: Disclosed herein is an image encoding/decoding method. The method of decoding the image includes structuring a motion information candidate list of a current block, selecting a first motion information candidate used for prediction of a first subblock in the current block from the motion information candidate list, selecting a second motion information candidate used for prediction of a second subblock in the current block from the motion information candidate list, generating a prediction sample of the first subblock by performing inter prediction with respect to the first subblock based on the first motion information candidate, and generating a prediction sample of the second subblock by performing inter prediction with the second subblock based on the second motion information candidate. The first and second motion information candidates are any one of candidates in first and second prediction directions in the motion information candidate list, respectively.Type: ApplicationFiled: November 15, 2024Publication date: March 6, 2025Inventors: Jung Won KANG, Ha Hyun LEE, Sung Chang LIM, Jin Ho LEE, Hui Yong KIM, Gwang Hoon PARK, Tae Hyun KIM, Dae Young LEE
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Patent number: 12243834Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.Type: GrantFiled: April 22, 2024Date of Patent: March 4, 2025Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Doo Soub Shin, Tae Yong Lee, Kyoung Yeon Lee, Sung Gyu Kim
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Publication number: 20250071271Abstract: An image encoding/decoding method and apparatus is provided. The method of decoding an image includes decoding at least one of prediction mode information of a neighbor block of a current block and length information of the current block, deriving an intra prediction mode of the current block into a predetermined mode using the decoded information, and reconstructing the current block based on the intra prediction mode of the current block.Type: ApplicationFiled: October 28, 2024Publication date: February 27, 2025Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITYInventors: Jung Won KANG, Ha Hyun LEE, Sung Chang LIM, Jin Ho LEE, Hui Yong KIM, Gwang Hoon PARK, Tae Hyun KIM, Dae Young LEE, Woo Woen GWUN, Won Jun LEE
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Publication number: 20250070365Abstract: A cell assembly according to the present disclosure includes a cell stack including one pouch-type battery cell or two or more pouch-type battery cells stacked; and a cell cover covering two side portions of the cell stack along a widthwise direction of the cell stack and a top portion of the cell stack, wherein the cell cover is configured to adjust a width of the cell cover according to a width of the cell stack.Type: ApplicationFiled: August 7, 2023Publication date: February 27, 2025Applicant: LG Energy Solution, Ltd.Inventors: Jin-Yong Park, Woo-Yong Kwon, Seung-Joon Kim, In-Soo Kim, Song-Ju Shin, Myung-Woo Lee, Jong-Mo Kang, Kyung-Woo Kim, Duck-Hee Moon, Tae-Kyeong Lee, Se-Yun Chung, Jong-Ha Jeong, Ho-June Chi, Ji-Soo Hwang
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Patent number: 12236013Abstract: A mobility device may include a drive for driving the mobility device, a projector for outputting a visual stimulus, an electroencephalogram device for detecting a brainwave of a user, and a controller for controlling the drive and/or the projector. The controller may be connected to the EEG device, and may be configured to control the projector to output the visual stimulus to a surface at a position spaced by a specified distance from the mobility device.Type: GrantFiled: November 16, 2022Date of Patent: February 25, 2025Assignees: Hyundai Motor Company, Kia Corporation, IUCF-HYU (Industry-University Cooperation Foundation Hanyang University)Inventors: Seung Kyu Nam, Il Yong Yoon, Tae Jun Lee, Chang Hwan Im, Jin Uk Kwon, Hye Rin Nam, Ji Hun Hwang
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Patent number: 12237239Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.Type: GrantFiled: December 20, 2021Date of Patent: February 25, 2025Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee, Jae Min Bae
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Publication number: 20250040733Abstract: A shoe care device provided with an accommodation space inside which shoes are accommodated includes a body; a movable body which forms the accommodation space together with the body and is coupled to the body so as to be slidable between a first position and a second position prior to the first position; a blowing part configured to circulate air in the accommodation space; and a frame body coupled to the body so as to support the body, in a form of connecting the upper surface, the lower surface, and the rear surface of the body.Type: ApplicationFiled: December 2, 2022Publication date: February 6, 2025Applicant: LG ELECTRONICS INC.Inventors: Kyoung Min CHOI, Young Jae LEE, Tae Yong JUNG
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Patent number: 12218534Abstract: A semiconductor circuit includes a first selection circuit which selects a first battery or a first capacitor, a second selection circuit which selects a second battery or a second capacitor, a voltage measuring circuit which measures a first voltage of the first battery or the first capacitor selected by the first selection circuit, and measures a second voltage of the second battery or the second capacitor selected by the second selection circuit, a controller which compares the first voltage and the second voltage to generate a comparison result, and a switching circuit which receives a signal based on a target output voltage, connects the first battery or capacitor selected by the first selection circuit, and the second battery capacitor selected by the second selection circuit in an interconnection relationship based on the comparison result to provide to an output terminal an output voltage responsive to the target output voltage.Type: GrantFiled: September 25, 2020Date of Patent: February 4, 2025Assignees: SAMSUNG ELECTRONICS CO., LTD., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Sung Yong Lee, Gyu Hyeong Cho, Min Woo Ko, Tae-Hwang Kong, Sang Ho Kim
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Patent number: 12207467Abstract: A semiconductor device including a substrate; a lower structure including a sealing layer on the substrate and a support layer on the sealing layer, the sealing layer and the support layer both including a semiconductor material; a mold structure on the lower structure and having an interlayer insulating film and a conductive film alternately stacked therein; a channel hole penetrating the mold structure; a channel structure extending along sidewalls of the channel hole; an isolation trench penetrating the mold structure and extending into the lower structure; and a poly liner extending along sidewalls of the isolation trench, the poly liner being connected to the lower structure and including the semiconductor material.Type: GrantFiled: February 11, 2022Date of Patent: January 21, 2025Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Bong Yong Lee, Tae Hun Kim, Min Kyung Bae
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Patent number: 12206117Abstract: The present disclosure relates to a method for manufacturing core-shell particles using carbon monoxide, and more particularly, to a method for manufacturing core-shell particles, the method of which a simple and fast one-pot reaction enables particle manufacturing to reduce process costs, facilitate scale-up, change various types of core and shell metals, and form a multi-layered shell by including the steps of adsorbing carbon monoxide on a transition metal for a core, and reacting carbon monoxide adsorbed on the surface of the transition metal for the core, a metal precursor for a shell, and a solvent to form particles with a core-shell structure having a reduced metal shell layer formed on a transition metal core.Type: GrantFiled: September 12, 2023Date of Patent: January 21, 2025Assignee: Korea Institute of Energy ResearchInventors: Gu-gon Park, Eun Jik Lee, Kyunghee Kim, Sung-dae Yim, Seok-hee Park, Min-ji Kim, Young-jun Sohn, Byungchan Bae, Seung-gon Kim, Dongwon Shin, Hwanyeong Oh, Seung Hee Woo, So Jeong Lee, Hyejin Lee, Yoon Young Choi, Won-yong Lee, Tae-hyun Yang
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Publication number: 20250023544Abstract: A surface acoustic wave device with suppressed excitation of spurious waves. The surface acoustic wave device comprises: a support substrate; a piezoelectric layer formed on the support substrate; and an IDT electrode on the piezoelectric layer, wherein when a wavelength of a surface acoustic wave excited at the IDT electrode is ?, thickness of the piezoelectric layer is 2.4? or less.Type: ApplicationFiled: July 1, 2024Publication date: January 16, 2025Inventors: Yoshikazu KIHARA, Hun Yong LEE, Tae Hyun KIM
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Publication number: 20240429183Abstract: In one example, an electronic device comprises a first substrate comprising a first dielectric structure and a first conductive structure, a first interconnect structure over an inward side of the first substrate and coupled with the first conductive structure, a first encapsulant over the inward side of the first substrate and contacting a lateral side of the first interconnect structure, a second substrate over the first encapsulant and comprising a second dielectric structure and a second conductive structure, wherein the second conductive structure is coupled with the first interconnect structure, and a first electronic component coupled with an outward side of the first substrate. The first electronic component is coupled with the second conductive structure via the first interconnect structure and the first conductive structure. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: June 22, 2023Publication date: December 26, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Tae Yong Lee, Min Won Park, Jeong Hyun Yang, Bo Yoon Yoo
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Publication number: 20240421127Abstract: In one example, a semiconductor device comprises a first base substrate comprising a first base conductive structure, a first encapsulant contacting a lateral side of the first base substrate, a redistribution structure (RDS) substrate over the base substrate and comprising an RDS conductive structure coupled with the first base conductive structure, a first electronic component over the RDS substrate and over a first component terminal coupled with the RDS conductive structure, and a second encapsulant over the RDS substrate and contacting a lateral side of the first electronic component. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: August 30, 2024Publication date: December 19, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Yi Seul Han, Tae Yong Lee, Ji Yeon Ryu, Won Chul Do, Jin Young Khim, Shaun Bowers, Ron Huemoeller
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Patent number: 12165988Abstract: An electronic device includes a substrate comprising outward terminals. An electronic component is connected to the outward terminals. External interconnects are connected to the outward terminals and include a first external interconnect connected to a first outward terminal. A lower shield is adjacent to the substrate bottom side and is laterally between the external interconnects. The lower shield is electrically isolated from the first external interconnect by one or more of 1) a dielectric buffer interposed between the lower shield and the first external interconnect; or 2) the lower shield including a first part and a second part, the first part being laterally separated from the second part by a first gap, wherein the first part laterally surrounds lateral sides of the first external interconnect; and the second part is vertically interposed between the first outward terminal and the first external interconnect.Type: GrantFiled: June 16, 2023Date of Patent: December 10, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Min Won Park, Tae Yong Lee, Ji Hun Yi, Cheol Ho Lee
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Patent number: D1058623Type: GrantFiled: June 23, 2023Date of Patent: January 21, 2025Inventors: Tae Kyun Kim, Nam Seon Lee, Min Seok Oh, Sang Yong Lee, Young Heum Kim