Abstract: A shoe care device provided with an accommodation space inside which shoes are accommodated includes a body; a movable body which forms the accommodation space together with the body and is coupled to the body so as to be slidable between a first position and a second position prior to the first position; a blowing part configured to circulate air in the accommodation space; and a frame body coupled to the body so as to support the body, in a form of connecting the upper surface, the lower surface, and the rear surface of the body.

Abstract: A semiconductor circuit includes a first selection circuit which selects a first battery or a first capacitor, a second selection circuit which selects a second battery or a second capacitor, a voltage measuring circuit which measures a first voltage of the first battery or the first capacitor selected by the first selection circuit, and measures a second voltage of the second battery or the second capacitor selected by the second selection circuit, a controller which compares the first voltage and the second voltage to generate a comparison result, and a switching circuit which receives a signal based on a target output voltage, connects the first battery or capacitor selected by the first selection circuit, and the second battery capacitor selected by the second selection circuit in an interconnection relationship based on the comparison result to provide to an output terminal an output voltage responsive to the target output voltage.

Abstract: A semiconductor device including a substrate; a lower structure including a sealing layer on the substrate and a support layer on the sealing layer, the sealing layer and the support layer both including a semiconductor material; a mold structure on the lower structure and having an interlayer insulating film and a conductive film alternately stacked therein; a channel hole penetrating the mold structure; a channel structure extending along sidewalls of the channel hole; an isolation trench penetrating the mold structure and extending into the lower structure; and a poly liner extending along sidewalls of the isolation trench, the poly liner being connected to the lower structure and including the semiconductor material.

Abstract: The present disclosure relates to a method for manufacturing core-shell particles using carbon monoxide, and more particularly, to a method for manufacturing core-shell particles, the method of which a simple and fast one-pot reaction enables particle manufacturing to reduce process costs, facilitate scale-up, change various types of core and shell metals, and form a multi-layered shell by including the steps of adsorbing carbon monoxide on a transition metal for a core, and reacting carbon monoxide adsorbed on the surface of the transition metal for the core, a metal precursor for a shell, and a solvent to form particles with a core-shell structure having a reduced metal shell layer formed on a transition metal core.

Abstract: A surface acoustic wave device with suppressed excitation of spurious waves. The surface acoustic wave device comprises: a support substrate; a piezoelectric layer formed on the support substrate; and an IDT electrode on the piezoelectric layer, wherein when a wavelength of a surface acoustic wave excited at the IDT electrode is ?, thickness of the piezoelectric layer is 2.4? or less.

Abstract: In one example, an electronic device comprises a first substrate comprising a first dielectric structure and a first conductive structure, a first interconnect structure over an inward side of the first substrate and coupled with the first conductive structure, a first encapsulant over the inward side of the first substrate and contacting a lateral side of the first interconnect structure, a second substrate over the first encapsulant and comprising a second dielectric structure and a second conductive structure, wherein the second conductive structure is coupled with the first interconnect structure, and a first electronic component coupled with an outward side of the first substrate. The first electronic component is coupled with the second conductive structure via the first interconnect structure and the first conductive structure. Other examples and related methods are also disclosed herein.

Abstract: In one example, a semiconductor device comprises a first base substrate comprising a first base conductive structure, a first encapsulant contacting a lateral side of the first base substrate, a redistribution structure (RDS) substrate over the base substrate and comprising an RDS conductive structure coupled with the first base conductive structure, a first electronic component over the RDS substrate and over a first component terminal coupled with the RDS conductive structure, and a second encapsulant over the RDS substrate and contacting a lateral side of the first electronic component. Other examples and related methods are also disclosed herein.

Abstract: An electronic device includes a substrate comprising outward terminals. An electronic component is connected to the outward terminals. External interconnects are connected to the outward terminals and include a first external interconnect connected to a first outward terminal. A lower shield is adjacent to the substrate bottom side and is laterally between the external interconnects. The lower shield is electrically isolated from the first external interconnect by one or more of 1) a dielectric buffer interposed between the lower shield and the first external interconnect; or 2) the lower shield including a first part and a second part, the first part being laterally separated from the second part by a first gap, wherein the first part laterally surrounds lateral sides of the first external interconnect; and the second part is vertically interposed between the first outward terminal and the first external interconnect.

Abstract: Provided are a spiral type cell culture vessel and a cell culture system using same. The present invention comprises: a housing having a certain length and having respective ends which are open; first and second caps respectively assembled to one end and the other end of the housing; and at least one spiral type culture support which is disposed in an internal space of the housing and in which a cell culture is performed. The spiral type culture support comprises at least one culture sheet of which one edge is in contact with and is fixed to a support shaft having a certain length, the culture sheet is spirally wound around the support shaft, and a culture medium passes in one direction due to a gap formed between the spirally wound culture sheet and the inner side thereof, and thus, a cell culture space is formed in which the cell culture is performed.

Abstract: In one example, a semiconductor device comprises a first base substrate comprising a first base conductive structure, a first encapsulant contacting a lateral side of the first base substrate, a redistribution structure (RDS) substrate over the base substrate and comprising an RDS conductive structure coupled with the first base conductive structure, a first electronic component over the RDS substrate and over a first component terminal coupled with the RDS conductive structure, and a second encapsulant over the RDS substrate and contacting a lateral side of the first electronic component. Other examples and related methods are also disclosed herein.

Abstract: An embodiment relates to a surface emitting laser device and a light emitting device including the same. The surface emitting laser device according to an embodiment may comprise: a substrate; a first reflective layer arranged on the substrate; an active layer arranged on the first reflective layer; an aperture layer arranged on the active layer and comprising an opening; a second reflective layer arranged on the active layer; a transparent electrode layer arranged on the second reflective layer; and a metal electrode layer arranged on the transparent electrode layer. The transparent electrode layer may comprise a first area perpendicularly overlapping the opening and multiple second areas extending from the first area. The multiple second areas may be arranged outside the opening along the circumferential direction of the opening and spaced apart from each other. The multiple second areas may be arranged and spaced apart from each other so as to correspond to the circumference of the opening.

Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.

Abstract: In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadframe comprising a paddle, wherein the paddle is coupled to the electronic device, and a lead electrically coupled to the electronic device. The semiconductor device further comprises a first protective material contacting the bottom surface of the substrate and a side surface of the electronic device.

Abstract: In one example, a semiconductor device can comprise (a) an electronic device comprising a device top side, a device bottom side opposite the device top side, and a device sidewall between the device top side and the device bottom side, (b) a first conductor comprising, a first conductor side section on the device sidewall, a first conductor top section on the device top side and coupled to the first conductor side section, and a first conductor bottom section coupled to the first conductor side section, and (c) a protective material covering the first conductor and the electronic device. A lower surface of the first conductor top section can be higher than the device top side, and an upper surface of the first conductor bottom section can be lower than the device top side. Other examples and related methods are also disclosed herein.

Abstract: In one example, a semiconductor device can comprise (a) an electronic device comprising a device top side, a device bottom side opposite the device top side, and a device sidewall between the device top side and the device bottom side, (b) a first conductor comprising, a first conductor side section on the device sidewall, a first conductor top section on the device top side and coupled to the first conductor side section, and a first conductor bottom section coupled to the first conductor side section, and (c) a protective material covering the first conductor and the electronic device. A lower surface of the first conductor top section can be higher than the device top side, and an upper surface of the first conductor bottom section can be lower than the device top side. Other examples and related methods are also disclosed herein.

Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.

Abstract: Provided are a negative electrode active material including a three-dimensional composite. The three-dimensional composite includes secondary particles containing a silicon carbide-based (SiCx, 0<x?1) nanosheet having a bent portion and amorphous carbon. Also provided are a method of producing the same, and a negative electrode and a lithium secondary battery including the negative electrode active material.

Abstract: In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadframe comprising a paddle, wherein the paddle is coupled to the electronic device, and a lead electrically coupled to the electronic device. The semiconductor device further comprises a first protective material contacting the bottom surface of the substrate and a side surface of the electronic device.

Abstract: Disclosed is an air cleaner having independent fluid paths and a home appliance having the air cleaner. The air cleaner includes a front panel having a plurality of air inlets formed thereon for air to flow in from outside of the case, first and second blower devices arranged inside the case to allow air to flow in through the plurality of air inlets, first and second filter units arranged to filter the air flowing in by the first and second blower devices, a first outlet located on the case to release the air, a second outlet formed at a different location from that of the first outlet, a first fluid path formed between one of the plurality of air inlets and the first outlet; and a second fluid path formed between another of the plurality of air inlets and the second outlet.