Patents by Inventor Taek Jung Lee

Taek Jung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10559425
    Abstract: A multilayer capacitor and a board having the same provide high capacitance and low equivalent series inductance (ESL). The multilayer capacitor includes a capacitor body including an active region, including first and second internal electrodes, and first and second cover regions. Third and fourth internal electrodes are alternately disposed in the cover region adjacent to a mounting surface. First and second external electrodes respectively contact the first and second internal electrodes to provide capacitance. First and second via electrodes are disposed in the cover region, where the first via electrode connects the third internal electrode and a first band portion of the first external electrode to each other, and where the second via electrode connects the fourth internal electrode and a second band portion of the second external electrode to each other.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: February 11, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Pil Lee, Hyo Youn Lee, Sung Kwon An, Seung Woo Song, Taek Jung Lee, Jin Kyung Joo
  • Patent number: 10468190
    Abstract: A capacitor component includes a body with a plurality of first and second internal electrodes alternately stacked with dielectric layers interposed therebetween. First and second connection electrodes extend in a thickness direction of the body and are respectively connected to the first and second internal electrodes. First and second lower electrodes are on a lower surface of the body and are respectively connected to the first and second connection electrodes.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: November 5, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Won Seo, Jin Kyung Joo, Taek Jung Lee, Jin Woo Chun
  • Publication number: 20190326058
    Abstract: A multilayer ceramic electronic component includes: a ceramic body and first and second external electrodes on external surfaces of the ceramic body. The ceramic body includes first and second internal electrodes facing each other with dielectric layers interposed therebetween. The ceramic body includes an active portion in which capacitance is formed and cover portions on upper and lower surfaces of the active portion, respectively. The ratio of the thickness of the first and second external electrodes to the thickness of the cover portion is proportional to the inverse of the cube root of the ratio of the Young's Modulus of each of the first and second external electrodes to the Young's modulus of the cover portion.
    Type: Application
    Filed: October 25, 2018
    Publication date: October 24, 2019
    Inventors: Min Gon LEE, Seung Woo SONG, Jae Yeol CHOI, Jin Kyung JOO, Taek Jung LEE, Jin Man JUNG
  • Patent number: 10373760
    Abstract: A capacitor component includes a plurality of unit laminates, each comprising a body with a stacked structure including a plurality of internal electrodes and connection electrodes that extend in a stacking direction of the body and electrically connect to the plurality of internal electrodes, and pad portions between adjacent unit laminates to electrically connect the respective connection electrodes of the unit laminates above and below the pad portions to each other.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: August 6, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Taek Jung Lee, Jin Kyung Joo, Hyo Youn Lee, Won Young Lee, Sung Kwon An, Jae Yeol Choi, Jin Man Jung
  • Patent number: 10319522
    Abstract: A multilayer ceramic capacitor includes: a capacitance layer including dielectric layers and first and second internal electrodes disposed with respective dielectric layers interposed therebetween; a protection layer disposed on one surface of the capacitance layer; an alpha connection electrode provided in an alpha via penetrating through the protection layer; and a beta connection electrode provided in a beta via penetrating through the capacitance layer and connected to the alpha via. The alpha via has a diameter greater than that of the beta via.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: June 11, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Taek Jung Lee, Hyo Youn Lee, Seung Woo Song, Jong Pil Lee, Sung Kwon An
  • Publication number: 20190172645
    Abstract: A multilayer capacitor and a board having the same provide high capacitance and low equivalent series inductance (ESL). The multilayer capacitor includes a capacitor body including an active region, including first and second internal electrodes, and first and second cover regions. Third and fourth internal electrodes are alternately disposed in the cover region adjacent to a mounting surface. First and second external electrodes respectively contact the first and second internal electrodes to provide capacitance. First and second via electrodes are disposed in the cover region, where the first via electrode connects the third internal electrode and a first band portion of the first external electrode to each other, and where the second via electrode connects the fourth internal electrode and a second band portion of the second external electrode to each other.
    Type: Application
    Filed: February 8, 2019
    Publication date: June 6, 2019
    Inventors: Jong Pil LEE, Hyo Youn LEE, Sung Kwon AN, Seung Woo SONG, Taek Jung LEE, Jin Kyung JOO
  • Publication number: 20190172648
    Abstract: A capacitor component includes a plurality of unit laminates, each comprising a body with a stacked structure including a plurality of internal electrodes and connection electrodes that extend in a stacking direction of the body and electrically connect to the plurality of internal electrodes, and pad portions between adjacent unit laminates to electrically connect the respective connection electrodes of the unit laminates above and below the pad portions to each other.
    Type: Application
    Filed: February 12, 2019
    Publication date: June 6, 2019
    Inventors: Taek Jung LEE, Jin Kyung JOO, Hyo Youn LEE, Won Young LEE, Sung Kwon AN, Jae Yeol CHOI, Jin Man JUNG
  • Publication number: 20190148068
    Abstract: A multilayer capacitor includes: a first internal electrode layer including first and second internal electrodes spaced apart from each other with an insulating portion interposed therebetween; a second internal electrode layer including a third internal electrode; a body including the first and second internal electrode layers alternately disposed with respective dielectric layers interposed therebetween; first and second external electrodes disposed on the body to be electrically connected to the first and second internal electrodes, respectively; a connection electrode penetrating through the body to thereby be electrically connected to the third internal electrode; and a third external electrode disposed on the body to be electrically connected to the connection electrode.
    Type: Application
    Filed: June 26, 2018
    Publication date: May 16, 2019
    Inventors: Jong Pil LEE, Jin Kyung JOO, Young Key KIM, Taek Jung LEE
  • Patent number: 10269496
    Abstract: A multilayer capacitor includes a body including dielectric layers, and first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween, first and second groove parts formed in external surfaces of the body in a first direction in which the dielectric layers are stacked, having at least one corner, and contacting the first and second internal electrodes, respectively, and first and second connection electrodes disposed in the first and second groove parts, respectively, and electrically connected to the first and second internal electrodes, respectively.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: April 23, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Young Lee, Sung Kwon An, Taek Jung Lee, Jin Kyung Joo, Hyo Youn Lee
  • Publication number: 20190074138
    Abstract: A multilayer ceramic capacitor includes a body a first internal electrode and a second internal electrode disposed with a dielectric layer interposed therebetween, a first connecting electrode connected to the first internal electrode through the body, a second connecting electrode connected to the second internal electrode through the body, a first external electrode disposed on one surface of the body and connected to the first connecting electrode, and a second external electrode disposed on one surface of the body, spaced apart from the first external electrode, and connected to the second connecting electrode, wherein the first and second external electrodes each include a first electrode layer disposed on the body and including ceramics, and a second electrode layer disposed on the first electrode layer and having the content of ceramics smaller than that of the first electrode layer.
    Type: Application
    Filed: June 14, 2018
    Publication date: March 7, 2019
    Inventors: Seung Woo SONG, Taek Jung LEE, Jin Kyung JOO, Hyo Youn LEE, Sung Kwon AN
  • Publication number: 20190074137
    Abstract: A multilayer capacitor and a board having the same provide high capacitance and low equivalent series inductance (ESL). The multilayer capacitor includes a capacitor body including an active region, including first and second internal electrodes, and first and second cover regions. Third and fourth internal electrodes are alternately disposed in the cover region adjacent to amounting surface. First and second external electrodes respectively contact the first and second internal electrodes to provide capacitance. First and second via electrodes are disposed in the cover region, where the first via electrode connects the third internal electrode and a first band portion of the first external electrode to each other, and where the second via electrode connects the fourth internal electrode and a second band portion of the second external electrode to each other.
    Type: Application
    Filed: June 11, 2018
    Publication date: March 7, 2019
    Applicants: SAMSUNG ELECTRO-MECHANICS CO., LTD., SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Pil LEE, Hyo Youn LEE, Sung Kwon AN, Seung Woo SONG, Taek Jung LEE, Jin Kyung JOO
  • Publication number: 20190066924
    Abstract: A multilayer ceramic capacitor includes a capacitive portion, a protective part, and first and second connecting electrodes. The capacitive portion includes a first dielectric layer and first and second internal electrodes disposed with the first dielectric layer interposed therebetween. The protective part is disposed on one surface of the capacitive portion and includes a second dielectric layer and first and second electrode patterns disposed to be spaced apart from each other. The first connecting electrode penetrates through the protective part and the capacitive portion and is connected to the first internal electrode and the first electrode pattern, and the second connecting electrode penetrates through the protective part and the capacitive portion and is connected to the second internal electrode and the second electrode pattern.
    Type: Application
    Filed: June 8, 2018
    Publication date: February 28, 2019
    Inventors: Seung Woo SONG, Jin Kyung JOO, Hyo Youn LEE, Taek Jung LEE, Sung Kwon AN
  • Publication number: 20190066922
    Abstract: A capacitor component includes a body including an active layer and an upper cover and a lower cover disposed on an upper part and a lower part of the active layer, respectively; first internal electrodes and second internal electrodes disposed inside the active layer; a first active via and a second active via extending in a thickness direction of the active layer to be connected to the first and second internal electrodes, respectively; first and second cover vias extending in a thickness direction of the lower cover to be electrically connected to the first and second active vias and disposed at an interval narrower than an interval between the first and second active vias; and first and second lower electrodes disposed in a lower surface of the lower cover to be connected to the first and second cover vias, respectively.
    Type: Application
    Filed: April 17, 2018
    Publication date: February 28, 2019
    Inventors: Taek Jung LEE, Jin Kyung JOO, Seung Woo SONG, Hyo Youn LEE, Sung Kwon AN
  • Publication number: 20190066928
    Abstract: A capacitor component includes a multilayer structure including unit laminates. Each unit laminate has a plurality of internal electrodes and a first connecting electrode extending in a stacking direction of the plurality of internal electrodes and connected to portions of the plurality of internal electrodes. First connecting electrodes of unit laminates adjacent to each other among the unit laminates are connected to each other. A diameter of a first connecting electrode of at least one of the unit laminates is different from diameters of first connecting electrodes of other unit laminates.
    Type: Application
    Filed: June 15, 2018
    Publication date: February 28, 2019
    Inventors: Sung Kwon AN, Jin Kyung JOO, Hyo Youn LEE, Seung Woo SONG, Taek Jung LEE
  • Patent number: 10186380
    Abstract: A capacitor component includes a body, a plurality of internal electrodes disposed in the body, connection electrodes extended in a thickness direction of the body and electrically connected to the plurality of internal electrodes, upper electrodes disposed on an upper surface of the body and electrically connected to the connection electrodes, and lower electrodes disposed on a lower surface of the body and electrically connected to the connection electrodes A thickness of the upper electrodes is different from that of the lower electrodes, and an area of contact between the upper electrodes and the body is different from an area of contact between the lower electrodes and the body.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: January 22, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Taek Jung Lee, Hyo Youn Lee, Won Young Lee, Sung Kwon An, Jae Yeol Choi, Jin Kyung Joo
  • Publication number: 20180368264
    Abstract: A capacitor includes a body including a plurality of dielectric layers, first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween, and first and second insulating regions. The first insulating region is disposed in each of the first internal electrodes and includes a first connection electrode disposed therein. The second insulating region is disposed in each of the second internal electrodes and includes a second connection electrode disposed therein. The products D1×Td and D2×Td are greater than 20 ?m2, where Td is a thickness of the dielectric layer, and D1 and D2 are widths of the first and second insulating regions, respectively.
    Type: Application
    Filed: August 22, 2018
    Publication date: December 20, 2018
    Inventors: Jin Man JUNG, Jin Kyung JOO, Ik Hwan CHANG, Taek Jung LEE, Won Young LEE, Yong Won SEO, Jin Woo CHUN
  • Publication number: 20180342351
    Abstract: A multilayer ceramic capacitor includes: a capacitance layer including dielectric layers and first and second internal electrodes disposed with respective dielectric layers interposed therebetween; a protection layer disposed on one surface of the capacitance layer; an alpha connection electrode provided in an alpha via penetrating through the protection layer; and a beta connection electrode provided in a beta via penetrating through the capacitance layer and connected to the alpha via. The alpha via has a diameter greater than that of the beta via.
    Type: Application
    Filed: December 1, 2017
    Publication date: November 29, 2018
    Inventors: Taek Jung LEE, Hyo Youn LEE, Seung Woo SONG, Jong Pil LEE, Sung Kwon AN
  • Publication number: 20180233287
    Abstract: A capacitor component includes a body with a plurality of first and second internal electrodes alternately stacked with dielectric layers interposed therebetween. First and second connection electrodes extend in a thickness direction of the body and are respectively connected to the first and second internal electrodes. First and second lower electrodes are on a lower surface of the body and are respectively connected to the first and second connection electrodes.
    Type: Application
    Filed: September 25, 2017
    Publication date: August 16, 2018
    Inventors: Yong Won SEO, Jin Kyung JOO, Taek Jung LEE, Jin Woo CHUN
  • Patent number: 10026558
    Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a first internal electrode and a second internal electrode; a first via electrode exposed through first and second surfaces of the capacitor body, connected to the first internal electrode and spaced apart from the second internal electrode, a second via electrode exposed through the first and second surfaces of the capacitor body, and connected to the second internal electrode and spaced apart from the first internal electrode, a first and second external electrodes disposed on the first surface of the capacitor body to be spaced apart from each other, and connected to the first and the second via electrodes, respectively, and first and second covers disposed in sequence from a bottom in the second surface of the capacitor body, wherein the first and second cover are formed of different materials.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: July 17, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyo Youn Lee, Taek Jung Lee, Won Young Lee, Sung Kwon An, Jin Kyung Joo, Jin Man Jung
  • Patent number: 9974173
    Abstract: A multilayer ceramic substrate includes stacked ceramic layers, and external electrodes including first conductive layers penetrating through one region of an outermost layer of the stacked ceramic layers to thereby be embedded therein, and second and third conductive layers sequentially stacked on the first conductive layers. Each of the first and second conductive layers is formed of a ceramic powder and a metal powder.
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: May 15, 2018
    Assignee: SEMCNS CO., LTD.
    Inventors: Taek Jung Lee, Yong Suk Kim