Patents by Inventor Tae-seok Lee
Tae-seok Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240155497Abstract: A method for reducing power consumption of a terminal that communicates with a base station in a mobile communication system using a multi-carrier structure composed of a primary component carrier and at least one secondary component carrier comprises: receiving a discontinuous reception (DRX) parameter group for multi carriers from the base station; and setting the multi carriers to the same parameter value, by using the received parameter group. The method for reducing power consumption of the terminal further comprises: performing a downlink control channel receive operation on each carrier according to a DRX cycle. As the base station in the mobile communication system using the multi-carrier structure simplifies the DRX process for reducing power consumption of a terminal by reducing signaling load for the multi-carrier control of the terminal, it becomes possible to reduce power consumption of the terminal.Type: ApplicationFiled: January 15, 2024Publication date: May 9, 2024Applicant: Electronics and Telecommunications Research InstituteInventors: Kyoung Seok LEE, Jae Heung KIM, Tae Gyun NOH
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Publication number: 20240139850Abstract: An arc welding device for a secondary battery according to an embodiment of the present invention includes an upper fixing portion in which a plurality of welding electrode units connected to one pole of a welding power are disposed and a lower fixing portion disposed to face the upper fixing portion with an object to be welded therebetween and connected to the other pole of the welding power. The upper fixing portion includes a first facing surface facing the object to be welded and formed to be concave toward the object to be welded and the lower fixing portion includes a second facing surface facing the first facing face and formed to be convex to correspond to the concave shape of the first facing surface.Type: ApplicationFiled: February 16, 2022Publication date: May 2, 2024Applicant: LG Energy Solution, Ltd.Inventors: Jung Hyun Park, Tae Su Kim, Beom Seok Lee, Hyuk Soo Lee
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Publication number: 20240129725Abstract: A service identifying and processing method using a wireless terminal message according to an exemplary embodiment of the present invention includes (a) receiving a wireless terminal message by a first entity which is a mobile device; and (b) expressing, by a first agent which is an information processing application program installed on the first entity, entity information of second entity based on the wireless terminal message and service confirmation information related to service provided by the second entity, through an application screen by the first agent.Type: ApplicationFiled: December 23, 2021Publication date: April 18, 2024Applicant: ESTORM CO., LTD.Inventors: Jong Hyun WOO, Tae Il LEE, Il Jin JUNG, Hee Jun SHIN, Hyung Seok JANG, Min Jae SON, Sang Heon BAEK, Seo Bin PARK, Hyo Sang KWON, Mi Ju KIM, Jung Hoon SONG, Rakhmanov DILSHOD, Dong Hee KIM, Jeon Gjin KIM
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Publication number: 20240124765Abstract: A quantum dot, a quantum dot composite, a composition for preparing a quantum dot composite, a display panel including the quantum dot composite, and an electronic device including the display panel, wherein the quantum dot includes a core including a semiconductor nanocrystal including indium and phosphorus, a shell disposed on the core and including a semiconductor nanocrystal, and a compound represented by Chemical Formula 1 and a compound represented by Chemical Formula 2, both of which are present on the surface of the shell:Type: ApplicationFiled: September 27, 2023Publication date: April 18, 2024Inventors: Jong Hoon WON, Deuk Kyu MOON, Shang Hyeun PARK, Tae-Gon KIM, Young Hoon LEE, Deuk Seok CHUNG
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Patent number: 11958131Abstract: Disclosed are an aluminum-coated blank, a manufacturing method thereof, and an apparatus for manufacturing the same. The blank includes two or more aluminum-coated steel sheets connected together by a joint, each of the steel sheets including: a base steel sheet including 0.01-0.5 wt % of carbon, 0.01-1.0 wt % of silicon, 0.5-3.0 wt % of manganese, greater than 0 but not greater than 0.05 wt % of phosphorus, greater than 0 but not greater than 0.01 wt % of sulfur, greater than 0 but not greater than 0.1 wt % of aluminum, greater than 0 but not greater than 0.001 wt % of nitrogen, and the balance of iron and other inevitable impurities; and a coating layer including aluminum and formed on at least one surface of the base steel sheet.Type: GrantFiled: November 4, 2020Date of Patent: April 16, 2024Assignee: Hyundai Steel CompanyInventors: Chang Yong Lee, Jeong Seok Kim, Sung Ryul Kim, Tae Woo Kwon
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Publication number: 20240120323Abstract: The present disclosure relates to an apparatus for fabricating a display panel including: an attachment member having a fixing portion in a pressurization direction to which a pressurization header is fixed, an attachment driving member configured to move the attachment member and the pressurization header in the pressurization direction or a detachment direction through a fixing frame of the attachment member, a first pressure sensing module between the pressurization header and the attachment member and configured to generate first pressure detection signals according to pressure applied to the pressurization header, a gradient setting module configured to set a gradient of the pressurization header based on magnitudes of the first pressure detection signals, and a gradient control module configured to adjust gradients of the pressurization header, the attachment member, and the fixing frame according to control of the gradient setting module.Type: ApplicationFiled: September 6, 2023Publication date: April 11, 2024Inventors: Tae Hee LEE, Sung Kook PARK, Kyung Ho KIM, Young Seok SEO, Jae Gwang UM, Sang Hyun LEE, Hyung Suk HWANG
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Publication number: 20240120214Abstract: An apparatus for fabricating a display panel, the apparatus including: a loading module configured to accommodate a large-area fabricating substrate, the loading module being configured to adjust an inclination of the large-area fabricating substrate from a rear surface of the large-area fabricating substrate and to press the large-area fabricating substrate; and an element transfer module configured to transfer a plurality of light emitting elements or an integrated circuit onto the large-area fabricating substrate and configured to bond and press a wafer on which the plurality of light emitting elements or the at least one integrated circuit is located onto the large-area fabricating substrate.Type: ApplicationFiled: September 18, 2023Publication date: April 11, 2024Inventors: Tae Hee LEE, Kyung Ho KIM, Young Seok SEO, Joo Woan CHO, Byeong Hwa CHOI
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Publication number: 20240120324Abstract: An apparatus for fabricating a display panel, including a film fixing module configured to fix a stretched film on which a plurality of light emitting elements are arranged, a film pressurizing module configured to pressurize the stretched film, a first thickness detection module configured to detect, at each pressurization step, a modulus of elasticity and a change in thickness of the stretched film that is pressurized and stretched by the film pressurizing module, a second thickness detection module configured to detect, at each pressurization step, a change in thickness of an adhesive applied in a front direction of the stretched film, an image detection module configured to photograph the plurality of light emitting elements arranged on the stretched film for each pressurization step and to detect a change in arrangement information of the light emitting elements, and a main processor configured to database feature change information.Type: ApplicationFiled: September 6, 2023Publication date: April 11, 2024Inventors: Tae Hee LEE, Kyung Ho KIM, Young Seok SEO, Joo Woan CHO, Byeong Hwa CHO
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Patent number: 11950522Abstract: A method for manufacturing an electronic device including a semiconductor memory may include forming a first carbon electrode material, surface-treating the first carbon electrode material to decrease a surface roughness of the first carbon electrode material, and forming a second carbon electrode material on the treated surface of the first carbon electrode material. The second carbon electrode material may have a thickness that is greater than a thickness of the first carbon electrode material.Type: GrantFiled: June 22, 2022Date of Patent: April 2, 2024Assignee: SK hynix Inc.Inventors: Myoung Sub Kim, Tae Hoon Kim, Beom Seok Lee, Seung Yun Lee, Hwan Jun Zang, Byung Jick Cho, Ji Sun Han
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Publication number: 20240106048Abstract: An eco-friendly power source, such as a battery module for a transportation vehicle includes a plurality of battery cells each including an electrode assembly and an electrode tab protruding from the electrode assembly, and a bus bar assembly coupled to the electrode tabs and connecting the plurality of battery cells. The bus bar assembly includes a main frame having a slit into which the electrode tab is inserted, a bus bar positioned on an outer surface of the main frame and electrically connected to the electrode tab, a plurality of inner frames facing an inner surface of the main frame and spaced apart from each other in a direction in which the battery cells are stacked, and a venting induction portion formed in a concave shape toward the electrode assembly and formed at an upper end portion of at least one of the plurality of inner frames.Type: ApplicationFiled: May 17, 2023Publication date: March 28, 2024Inventors: Bon Seok KU, Tae Gu LEE
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Publication number: 20240097860Abstract: Provided is a data transmission system using a carrier aggregation. The data transmission system may assign a radio resource based on a correspondence relationship between a downlink and an uplink, and may transmit data using the assigned radio resource.Type: ApplicationFiled: October 26, 2023Publication date: March 21, 2024Applicant: Electronics and Telecommunications Research InstituteInventors: Young Jo KO, Tae Gyun NOH, Kyoung Seok LEE, Bang Won SEO, Byung Jang JEONG, Heesoo LEE
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Patent number: 11935984Abstract: A quantum dot including a core that includes a first semiconductor nanocrystal including zinc and selenium, and optionally sulfur and/or tellurium, and a shell that includes a second semiconductor nanocrystal including zinc, and at least one of sulfur or selenium is disclosed. The quantum dot has an average particle diameter of greater than or equal to about 13 nm, an emission peak wavelength in a range of about 440 nm to about 470 nm, and a full width at half maximum (FWHM) of an emission wavelength of less than about 25 nm. A method for preparing the quantum dot, a quantum dot-polymer composite including the quantum dot, and an electronic device including the quantum dot is also disclosed.Type: GrantFiled: December 14, 2022Date of Patent: March 19, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yong Seok Han, Sung Woo Kim, Jin A Kim, Tae Hyung Kim, Kun Su Park, Yuho Won, Jeong Hee Lee, Eun Joo Jang, Hyo Sook Jang
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Publication number: 20240081670Abstract: The present disclosure relates to a technique for estimating the inter-beat interval (IBI) of a ballistocardiograph (BCG) signal measured using a non-contact sensor, filtering and correcting inaccurate information in the inter-beat interval estimated through clustering, and outputting a heart rate measurement result based on the filtered and corrected inter-beat interval.Type: ApplicationFiled: November 30, 2022Publication date: March 14, 2024Applicant: HONEYNAPS CO., LTDInventors: Myeoung Seok KIM, Young Jun LEE, Tae Kyoung HA
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Publication number: 20240088059Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent to the package body, which is electrically connected to the conductive spaced-apart pillar structures.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Young Woo LEE, Jae Ung LEE, Byong Jin KIM, EunNaRa CHO, Ji Hoon OH, Young Seok KIM, Jin Young KHIM, Tae Kyeong HWANG, Jin Seong KIM, Gi Jung KIM
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Publication number: 20240075318Abstract: The present disclosure relates to a method for carrying out dose delivery quality assurance for high-precision radiation treatment, in which parameters affecting a pass rate of dose delivery quality assurance can be derived through regression analysis, which is a known statistical analysis method, and a pass rate prediction model capable of predicting each parameter and the pass rate of dose delivery quality assurance can be derived, and accordingly, it can be predicted in advance whether dose delivery quality assurance will be passed according to the parameters through the above prediction model, without repeatedly carrying out dose delivery quality assurance according to a patient's treatment plan, and as a result, the efficiency of dose delivery quality assurance can be enhanced, and the time or capacity required for such quality assurance is reduced, such that radiation treatment for an actual patient can be quickly and precisely carried out.Type: ApplicationFiled: December 22, 2021Publication date: March 7, 2024Inventors: Young Nam KANG, Ji Na KIM, Hong Seok JANG, Byung Ock CHOI, Yun Ji SEOL, Tae Geon OH, Na Young AN, Jae Hyeon LEE, Kyu Min HAN, Ye Rim SHIN
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Patent number: 11918781Abstract: An infusion flow regulator includes: a main body having an inlet through which fluid is introduced and an outlet through which the fluid is discharged; and a rotary dial rotatably coupled to the main body, with a sealing member interposed therebetween, so as to regulate a flow rate of the fluid, in which the rotary dial includes a regulating flow path having a shape of a recessed groove in cross section with a first width and a first height, and the regulating flow path includes a first region in which the first width is constant and the first height is decreased, and a second region in which both the first width and the first height are decreased. By the aforementioned configuration, the infusion flow regulator for the fluid can accurately regulate the flow rate even in a region where the flow rate of the fluid is very small.Type: GrantFiled: May 27, 2019Date of Patent: March 5, 2024Assignee: Korea Aerospace Research InstituteInventors: Poo Min Park, Hyung Mo Kim, Tae Choon Park, Young Seok Kang, Jae Sung Huh, Doo Yong Lee
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Patent number: 11916831Abstract: A reference signal (RS) transmission system to transmit a channel state information (CSI) RS for extraction of CSI to a relay and a macro terminal is disclosed. The base station transmits information on a sub frame containing the CSI RS to the relay or the macro terminal. The macro terminal and the relay receive the CSI RS using the information on the sub frame. The macro terminal and the relay extract the CSI using the CSI RS and transmit the extracted CSI to the base station.Type: GrantFiled: February 2, 2023Date of Patent: February 27, 2024Assignee: Electronics and Telecommunications Research InstituteInventors: Hee Soo Lee, Tae Gyun Noh, Jae Young Ahn, Kyoung Seok Lee, Young Jo Ko
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Patent number: 11913133Abstract: The present invention relates to a method of manufacturing polycrystalline silicon ingot using a crucible in which an oxygen exhaust passage is formed by single crystal or polycrystalline rods, the method including the steps of: manufacturing the single crystal or polycrystalline silicon rods each having the shape of a quadrilateral pillar; putting the single crystal or polycrystalline quadrilateral pillar-shaped silicon rods into the crucible in such a manner as to be arranged close to one another along the inner peripheral surface of the crucible to thus form a space portion inside the single crystal or polycrystalline silicon rods, into which silicon chunks are put, and the oxygen exhaust passages between the inner peripheral surface of the crucible and the respective surfaces of the single crystal or polycrystalline silicon rods oriented toward the inner peripheral surface of the crucible; putting the silicon chunks into the space portion of the crucible; and melting and crystallizing the silicon chunks.Type: GrantFiled: July 6, 2022Date of Patent: February 27, 2024Assignee: Lintech CorporationInventors: Ho Jung You, Dong Nam Shin, Sei Kwang Oh, Jun Seok Lee, Sun Bin Yum, Tae-Woo Kang
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Patent number: 11731467Abstract: An insert rubber for improving aerodynamics of a tire and an installation method thereof, and provides an insert rubber for improving aerodynamics of a tire and an installation method thereof, in which, by eliminating a space which is located between a bead of a tire and a flange of a rim, airflow is prevented from being introduced between the bead and the flange while a vehicle travels, and the space between the bead and the flange is filled with the insert rubber, thereby preventing turbulence from being generated in the space between the bead and the flange.Type: GrantFiled: May 11, 2020Date of Patent: August 22, 2023Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATIONInventors: Hyo-Sik Kim, Tae-Seok Lee, Dae-Chul Jang, Jae-Hun Lee
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Patent number: 11492519Abstract: Disclosed is a semiconductor package polyimide film, which may prevent the stripping of a thermoplastic polyimide layer by reducing a difference in the average coefficient of linear thermal expansion between a substrate film and the thermoplastic polyimide layer, and may be readily detached after a reflow process is completed since the thermoplastic polyimide layer to be attached to a lead frame has a glass transition temperature less than or equal to a reflow process temperature.Type: GrantFiled: June 18, 2019Date of Patent: November 8, 2022Assignee: IPI TECH INCInventors: Kye Ung Lee, Ju Hwan Chun, Ho Young Park, Tae Seok Lee