Abstract: A semiconductor package may include a redistribution layer structure including a redistribution layer, a semiconductor chip a first surface of the redistribution layer structure, an under-bump structure disposed on a second surface of the redistribution layer structure and including a protective layer having a trench and an under-bump metal layer, an electronic element on the under-bump structure, and an underfill member filling at least a portion of a space between the under-bump structure and the electronic element and filling at least a portion of the trench, wherein, in a plan view, the trench surrounds the electronic element and may include a protrusion portion protruding outward from the electronic element in a region surrounding an edge of the electronic element.

Abstract: A semiconductor package may include a semiconductor chip, a redistribution layer on the semiconductor chip, a protection pattern covering the redistribution layer, and a connection terminal on the redistribution layer. The redistribution layer may include a redistribution pad on a top surface of the redistribution layer, and the redistribution pad may include a first pad and a second pad on the first pad. The second pad may have a side surface that is inclined and that extends to a top surface of the first pad, and the protection pattern may be spaced apart from the side surface of the second pad and may have a side surface that is inclined and that extends to the top surface of the first pad.

Abstract: A semiconductor package may include a first redistribution substrate, a first semiconductor chip disposed on the first redistribution substrate, a second semiconductor chip horizontally spaced apart from the first semiconductor chip, a mold layer provided on the first redistribution substrate to enclose the first and second semiconductor chips, a second redistribution substrate disposed on the mold layer, a connection member, which is provided at a side of the first and second semiconductor chips to connect the first redistribution substrate to the second redistribution substrate, and an antenna substrate attached to the second redistribution substrate using an adhesive layer. The antenna substrate may include a core portion, an antenna pattern provided on a top surface of the core portion, and a wiring pattern provided on a bottom surface of the core portion.

Abstract: Disclosed herein is an electrode lead aligning and masking device. The electrode lead aligning and masking device of the present disclosure can be configured to align electrode leads bent on each of bus bars in a welding process of the electrode leads. The electrode lead aligning and masking device can include a pair of aligning jigs, each inserted into a slot between the bus bars and configured to align positions of the electrode leads. A masking jig can be disposed between the pair of aligning jigs to surround welding portions of the electrode leads.

Abstract: This invention is about a multi-project chip or MP-chip that includes multiple individual units that can be selectively driven by multiple orders, and one or more common units that can be driven by two or more of the orders, respectively. In particular, the MP-chip may be installed inside the MP-chip or may be manufactured as a body separate the MP-chip or installed inside the MP-chip.

Abstract: This invention is about a multi-project chip or MP-chip that includes multiple individual units that can be selectively driven by multiple orders, and one or more common units that can be driven by two or more of the orders, respectively. In particular, the MP-chip may be installed inside the MP-chip or may be manufactured as a body separate the MP-chip or installed inside the MP-chip.

Abstract: A display device may include a substrate including a display area and a non-display area surrounding at least a portion of the display area, a first organic insulating layer disposed on the substrate in the non-display area, a first conductive layer disposed on the first organic insulating layer and including first discharge holes, a second organic insulating layer disposed on the first conductive layer, and a transparent conductive layer disposed on the second organic insulating layer and including second discharge holes that respectively overlap the first discharge holes.

Abstract: A detection device includes a transmitter for outputting an impulse signal and a receiver for receiving and processing a reflected signal obtained by reflecting the impulse signal from a target. The receiver includes a sample and extension unit that samples a received signal and extends a duration of a value obtained by sampling the received signal to form an extended signal extended to a frequency lower than a frequency of the reflected signal.

Abstract: A controller and a display device including the controller are discussed. The display device can perform a compensation based on a stress value for each sub-pixel and update a correction table used for compensation using a sensing value acquired at a preset period. As such, it is possible to improve the accuracy of real-time compensation. In addition, since it is possible to compensate for a sub-pixel for which a sensing value is not acquired using an indirect gain according to the ratio of the stress values of the sub-pixel to a sensing value, the accuracy of compensation can be improved even if sensing for each sub-pixel sharing a sensing line may not be easy.

Abstract: Disclosed are an apparatus and method for transmitting a spatial audio by using multicast that are capable of efficiently transmitting spatial audio data of multiplayer content by using multicast. The spatial audio transmitting apparatus includes a plurality of servers communicatively connected to a plurality of client terminals executing multiplayer real-time content to be separated by a multicast group. A server included in the respective multicast group transmits the first player information to the other servers included in the multicast group in a multicast method so as to be shared when receiving first player information from a client terminal executing the multiplayer real-time content, and mixes spatial audio based on the first player information and the second player information and transmits the mixed spatial audio to the client terminal in a unicast method when receiving second player information from another server included in the multicast group.

Abstract: According to embodiments of the present disclosure, there may be provided a controller, a display device and a driving method. In consideration of that a hysteresis by an image data voltage supplied to a subpixel during an active time may exert an influence on a real-time sensing process, by correcting a reference sensing driving data voltage on the basis of an offset voltage, it is possible to correct the influence of a hysteresis exerted on sensing of the characteristic value of a driving transistor.

Abstract: The present invention relates to a drying apparatus in which objects to be dried are loaded and dried by wind and lamp heat, and has the specific features in which: the drying apparatus is divided into an upper machine room and a lower drying room by a partition plate that is parallel to the ground and installed inside a cylindrical case having closed upper and lower surfaces; an inner case, which is installed spaced apart from the inner surface of the case and has a plurality of through-holes, is installed inside the drying room; and an object loading device, in which the objects to be dried by heat from a lamp are loaded, is rotatably installed in a cylindrical space formed by the inner case.

Abstract: An impulse wireless communication system includes an oscillation signal generator that generates a plurality of oscillation signals having a delay interval with each other and having the same phase and amplitude or different phases and amplitudes, an envelope signal generator that extracts a sync signal and a data signal making up communication signal data and generates an envelope signal for the sync signal and an envelope signal for the data signal, a signal synthesizer that synthesizes the plurality of oscillation signals with the envelope signals, an envelope signal extractor that extracts a plurality of modulation envelope signals from the impulse signal, an amplitude phase determiner that determines the phase and the amplitude in the plurality of modulation envelope signals based on the plurality of oscillation signals, and a calculator that extracts the envelope signals from the plurality of modulation envelope signals based on the phase and the amplitude.

Abstract: A distance measuring apparatus includes: a DTC generator unit that generates DTC signals having edges delayed to define time segments; a template generator unit that generates template signals consecutively in a pre-designated number within the time segments in response to the DTC signals; a coarse time determiner unit that determines the time segment in which a delayed signal is received by calculating correlations with the consecutively generated template signals; a fine time measurer unit that determines the time at which the delayed signal is received within the time segment determined at the coarse time determiner unit from the results of calculating correlations between multiple template signals within the determined time segment and the delayed signal; and a distance calculator unit that calculates the total delay duration of the delayed signal and calculates the distance to the measurement target object from the calculated delay duration.

Abstract: A display device may include a substrate including a display area and a non-display area surrounding at least a portion of the display area, a first organic insulating layer disposed on the substrate in the non-display area, a first conductive layer disposed on the first organic insulating layer and including first discharge holes, a second organic insulating layer disposed on the first conductive layer, and a transparent conductive layer disposed on the second organic insulating layer and including second discharge holes that respectively overlap the first discharge holes.

Abstract: This invention is about a multi-project chip or MP-chip that includes multiple individual units that can be selectively driven by multiple orders, and one or more common units that can be driven by two or more of the orders, respectively. In particular, the MP-chip may be installed inside the MP-chip or may be manufactured as a body separate the MP-chip or installed inside the MP-chip.

Abstract: Electroluminescent display devices and a method for driving the same are disclosed. An electroluminescent display device according to an embodiment of the present disclosure includes a display panel including a plurality of pixels emitting light according to image data, a first memory storing a stress accumulation value corresponding to the image data, and a compensation gain calculation circuit configured to increase a compensation gain for compensating for the image data on the basis of the stress accumulation value, wherein the stress accumulation value in the first memory is reset whenever the compensation gain increases.

Abstract: Disclosed is a modulation method for modulating n-bit data (n=p+q+r). The modulation method includes forming a time difference between a data impulse and a sync impulse to correspond to p-bit data, modulating the amplitude of the sync impulse to correspond to q-bit data and modulating the amplitude of the data impulse to correspond to r-bit data, and combining the sync impulse and the data impulse. As an example, n may be equal to p+q+r.

Abstract: A battery module includes a battery cell stack formed by stacking a plurality of battery cells, a module frame for housing the battery cell stack, and an insulating sheet layer located between the battery cell stack and the upper surface of the module frame, wherein an opening is formed in the upper surface of the module frame, and a protrusion inserted into the opening is formed in the insulating sheet layer.

Abstract: A display device may include a substrate including a display area and a non-display area surrounding at least a portion of the display area, a first organic insulating layer disposed on the substrate in the non-display area, a first conductive layer disposed on the first organic insulating layer and including first discharge holes, a second organic insulating layer disposed on the first conductive layer, and a transparent conductive layer disposed on the second organic insulating layer and including second discharge holes that respectively overlap the first discharge holes.