Abstract: A circuit board cooling apparatus is disclosed having a heat spreader device to be thermally coupled with a surface of the circuit board to be cooled. Also, a conforming heat transfer device is disclosed that is thermally and physically coupled with the heat spreader device to conform to a surface contour of the heat spreader device on a first side of the heat transfer device. The cooling apparatus also includes a heat transport device physically attached and thermally coupled with a second side of the heat transfer device.

Abstract: Devices, apparatuses, systems, and methods are provided for improved thermal management in networking computing devices. An example thermal management apparatus includes a housing defining a first end and a second end opposite the first end. The apparatus further includes an electronic component supported within the housing, such as a GPU. The apparatus includes a primary inlet that receives a primary airflow having a first temperature and a secondary inlet that receives a secondary airflow having a second temperature where the second temperature is different than the first temperature. The primary airflow and the secondary airflow are collectively configured to dissipate heat generated by the electronic component.

Abstract: Example implementations relate to a cooling module, and a method of cooling an electronic circuit module. The cooling module includes first and second cooling components fluidically connected to each other. The first cooling component includes a first fluid channel having supply, return, and body sections, and a second fluid channel. The second cooling component includes an intermediate fluid channel. The body section is bifurcated into first and second body sections, and the first and second body sections are further merged into a third body section. The supply section is connected to the first and second body sections. The return section is connected to the third body section and the intermediate fluid channel via an inlet fluid-flow path established between the first and second cooling components. The second fluid channel is connected to the intermediate fluid channel via an outlet fluid-flow path established between the first and second cooling components.

Abstract: One aspect described in this application provides an apparatus that includes an external tray hose with an integrated booster pump for cooling a computing device. The booster pump can boost fluid flow and fluid pressure of coolant fluid pumped toward the computing device on a server tray. The booster pump includes a stator mounted around a booster pump housing with a bore. The stator includes one or more C-shaped lamination stacks for supporting coil windings. Energized coil windings generate a varying magnetic field for rotating an impeller within a housing bore to pump fluid along the housing bore of the booster pump. The apparatus includes a monitor module to monitor a set of sensors to obtain information about one or more of fluid temperature, fluid pressure, and device temperature; and a control module to adjust performance of the booster pump based on the information obtained from the set of sensors.

Abstract: A method includes determining, using a processing device, a set of observations from coolant data, the coolant data being received from one or more sensors in an environment associated with a coolant. The method further includes determining, using a machine learning model and the set of observations, a contamination level of the coolant. The method also includes initiating an operation, using the processing device, responsive to determining the coolant contamination level.

Abstract: A system and method for controlling cooling in a server is provided. The method includes receiving one or more server indicators relating to a task to be executed by at least one component of the server. The method also includes determining an expected cooling demand for the at least one component based on the one or more server indicators. The method further includes adjusting a cooling amount provided by a cooling mechanism based on the expected cooling demand of the at least one component. Various embodiments are described herein.

Abstract: A power arrangement and cooling system for electronic devices includes a processing unit electrically interconnected and disposed to a first side of a printed circuit board and a power converter electrically interconnected and disposed on a second side of the printed circuit board. The power converter includes a thermally conductive material layer that transfers heat generated by the power converter during operation away from the power converter toward a heatsink that is disposed adjacent the second side of the printed circuit board. Heat generated by the processing unit is absorbed by a heatsink disposed adjacent the first side of the printed circuit board. Power for the processing unit is provided, by the power converter, through a thickness of the printed circuit board.

Abstract: One aspect described in this application provides an apparatus that includes an external tray hose with an integrated booster pump for cooling a computing device. The booster pump can boost fluid flow and fluid pressure of coolant fluid pumped toward the computing device on a server tray. The booster pump includes a stator mounted around a booster pump housing with a bore. The stator includes one or more C-shaped lamination stacks for supporting coil windings. Energized coil windings generate a varying magnetic field for rotating an impeller within a housing bore to pump fluid along the housing bore of the booster pump. The apparatus includes a monitor module to monitor a set of sensors to obtain information about one or more of fluid temperature, fluid pressure, and device temperature; and a control module to adjust performance of the booster pump based on the information obtained from the set of sensors.

Abstract: A memory cooler includes a unitary thermal transfer device and a pair of endcaps. The unitary thermal transfer device includes heat transfer tubes, a first end block, a second end block, an inlet chamber, an outlet chamber, an inlet, and an outlet. The first and second end blocks are structurally integrated with each of the heat transfer tubes. The inlet and outlet chambers are partially defined by either the first end block or the second end block. Each of the inlet and outlet chambers are fluidly coupled with the respective liquid flow channel of the at least one heat transfer tube. The respective flow channels to which the inlet and outlet chambers are coupled may be the same or different to define either a direct or a serpentine flow path. Each endcap is affixed to a respective one of the first end block and the second end block to define, in conjunction with the first end block and second end block, the inlet chamber and the outlet chamber.

Abstract: Methods, apparatuses, systems, computing devices, and/or the like are provided. An example system for heat dissipation may include a memory. The example system may also include a processor configured to receive at least one visual representation of at least a portion of the sky, determine, based on the at least one visual representation (e.g., using artificial intelligence), a mask distinguishing between clouded and cloudless portions of the sky, based on the mask, determine a direction in which to point a heat dissipation panel toward one or more aim portions of the sky, and generate a signal to cause one or more heat dissipation surfaces or panels to be moved (e.g., using a robotic arm) such that heat is radiated toward the one or more aim portions of the sky.

Abstract: Systems and methods for datacenter are disclosed. In at least one embodiment, a system or method herein causes a process for a structure that includes a component tracking system, where such a system includes individual components within individual servers or individual racks, the process being based in part on at least location information and configuration information from one or more of an optical sensor or a radio sensor associated with a motile-support that is adapted for at least three dimensional (3D) movement in a space having the individual servers or the individual racks.

Abstract: An example device includes processing circuitry and a memory. The memory includes instructions that cause the device to perform various functions. The functions include receiving datastreams from a plurality of sensors of a high performance computing system, classifying each datastream of the each sensor to one of a plurality of datastream models, selecting an anomaly detection algorithm from a plurality of anomaly detection algorithms for each datastream, determining parameters of the each anomaly detection algorithm, determining an anomaly threshold for each datastream, and generating an indication that the sensor associated with the datastream is acting anomalously.

Abstract: Example implementations relate to a cooling module of a circuit assembly having a frame and an electronic circuit module including first and second chipsets, and a method of assembling the cooling module. The cooling module includes first and second cooling components. The first cooling component is connectable to the frame to establish a first thermal interface between the first cooling component and the first chipset. The first cooling component is positioned within a recess portion of the second cooling component, and each connector of a pair of second fluid connectors in the second cooling component is movably connected to a respective connector of a pair of first fluid connectors in the first cooling component to establish a fluid-flow path between the first and second cooling components. The second cooling component is connectable to the frame to establish a second thermal interface between the second cooling component and the second chipset.

Abstract: Multi-metric artificial intelligence (AI)/machine learning (ML) models for detection of anomalous behavior of a machine/system are disclosed. The multi-metric AI/ML models are configured to detect anomalous behavior of systems having multiple sensors that measure correlated sensor metrics such as coolant distribution units (CDUs). The multi-metric AI/ML models perform the anomalous system behavior detection in a manner that enables both a reduction in the amount of sensor instrumentation needed to monitor the system's operational behavior as well as a corresponding reduction in the complexity of the firmware that controls the sensor instrumentation. As such, AI-enabled systems and corresponding methods for anomalous behavior detection disclosed herein offer a technical solution to the technical problem of increased failure rates of existing multi-sensor systems, which is caused by the presence of redundant sensor instrumentation that necessitates complex firmware for controlling the sensor instrumentation.

Abstract: One aspect described in this application provides an apparatus that includes an external tray hose with an integrated booster pump for cooling a computing device. The booster pump can boost fluid flow and fluid pressure of coolant fluid pumped toward the computing device on a server tray. The booster pump includes a stator mounted around a booster pump housing with a bore. The stator includes one or more C-shaped lamination stacks for supporting coil windings. Energized coil windings generate a varying magnetic field for rotating an impeller within a housing bore to pump fluid along the housing bore of the booster pump. The apparatus includes a monitor module to monitor a set of sensors to obtain information about one or more of fluid temperature, fluid pressure, and device temperature; and a control module to adjust performance of the booster pump based on the information obtained from the set of sensors.

Abstract: An example device includes processing circuitry and a memory. The memory includes instructions that cause the device to perform various functions. The functions include receiving datastreams from a plurality of sensors of a high performance computing system, classifying each datastream of the each sensor to one of a plurality of datastream models, selecting an anomaly detection algorithm from a plurality of anomaly detection algorithms for each datastream, determining parameters of the each anomaly detection algorithm, determining an anomaly threshold for each datastream, and generating an indication that the sensor associated with the datastream is acting anomalously.

Abstract: Systems and methods are provided for utilizing a bidirectional intermediate data transport layer to connect multiple customers to a shared, cloud-based AIOps service. As a feature of the intermediate data transport layer, each customer (and their data) may be isolated from other customers. In various examples, the cloud-based AIOps service may receive sensor data from customer systems via the intermediate data transport layer. The cloud-based AIOps service may analyze this sensor data (e.g. detect anomalies, perform root cause analyses, find optimal conditions, etc.), and modify the operation of one or more of the customer systems (e.g. modify the settings/configuration of a sensor on a piece of connected infrastructure) via the intermediate data transport layer. In certain examples, in addition to (or instead of) modifying the operation of one or more of the customer systems, the cloud-based AIOps service may provide an on-premises notification to a customer.

Abstract: Example implementations relate to a cooling module of a circuit assembly having a frame and an electronic circuit module including first and second chipsets, and a method of assembling the cooling module. The cooling module includes first and second cooling components. The first cooling component is connectable to the frame to establish a first thermal interface between the first cooling component and the first chipset. The first cooling component is positioned within a recess portion of the second cooling component, and each connector of a pair of second fluid connectors in the second cooling component is movably connected to a respective connector of a pair of first fluid connectors in the first cooling component to establish a fluid-flow path between the first and second cooling components. The second cooling component is connectable to the frame to establish a second thermal interface between the second cooling component and the second chipset.

Abstract: Example implementations relate to a cooling module, and a method of cooling an electronic circuit module. The cooling module includes first and second cooling components fluidically connected to each other. The first cooling component includes a first fluid channel having supply, return, and body sections, and a second fluid channel. The second cooling component includes an intermediate fluid channel. The body section is bifurcated into first and second body sections, and the first and second body sections are further merged into a third body section. The supply section is connected to the first and second body sections. The return section is connected to the third body section and the intermediate fluid channel via an inlet fluid-flow path established between the first and second cooling components. The second fluid channel is connected to the intermediate fluid channel via an outlet fluid-flow path established between the first and second cooling components.

Abstract: Methods and systems for creating cold plates are disclosed. For example, in one example method for manufacturing a cold plate made of a thermally-conductive plastic includes performing a first injection-molding process using the thermally-conductive plastic to produce a first unitary body, the first unitary body including one or more elongated sections forming a unitary body, performing a second injection-molding process using the thermally-conductive plastic to produce a second unitary body, the second unitary body incorporating the first unitary body so as to cover a majority of the first unitary body and form a respective coolant pipe body corresponding to each elongated section, and performing a machining process on the second unitary body so as to create a conduit in each respective coolant pipe body suitable for a fluid to pass through to create respective coolant pipes.