Abstract: Devices, apparatuses, and systems for thermal management in networking and computing systems are provided. An example in-rack thermal management system includes a cooling distribution unit (CDU) that includes a housing that defines a fluid inlet and a fluid outlet, thermal management components supported by the housing, and direct mechanical connections coupled with the fluid inlet and the fluid outlet. The in-rack thermal management system includes a fluid distribution system that includes a primary fluid channel directly coupled with the direct mechanical connection of the fluid inlet, and a secondary fluid channel directly coupled with the direct mechanical connection of the fluid outlet. In operation, the thermal management components dissipate heat of a fluid received by the CDU via the fluid inlet. The direct mechanical connections directly interface with the fluid distribution system to provide fluid communication between the CDU and the fluid distribution system to maximize dimensions of the housing.

Abstract: Devices, apparatuses, systems, and methods are provided for improved thermal management in networking computing devices. An example thermal management apparatus includes a housing defining a first end and a second end opposite the first end. The apparatus further includes an electronic component supported within the housing, such as a GPU. The apparatus includes a primary inlet that receives a primary airflow having a first temperature and a secondary inlet that receives a secondary airflow having a second temperature where the second temperature is different than the first temperature. The primary airflow and the secondary airflow are collectively configured to dissipate heat generated by the electronic component.

Abstract: Devices, apparatuses, systems, and methods are provided for hybrid thermal management in computing modules. An example computing module includes a first computing component having a first operating temperature and a second computing component having a second operating temperature. The first operating temperature is greater than the second operating temperature. The example computing module further includes a hybrid thermal management system including a cooling delivery device configured to receive a cooling fluid. The cooling delivery device defines a first section configured to dissipate heat generated by the first computing component and a second section configured to dissipate heat generated by the second computing component. The first section of the cooling delivery device may be fluidically isolated from the second section of the cooling delivery device or the second section may be in fluid communication with the first section.

Abstract: A power arrangement and cooling system for electronic devices includes a processing unit electrically interconnected and disposed to a first side of a printed circuit board and a power converter electrically interconnected and disposed on a second side of the printed circuit board. The power converter includes a thermally conductive material layer that transfers heat generated by the power converter during operation away from the power converter toward a heatsink that is disposed adjacent the second side of the printed circuit board. Heat generated by the processing unit is absorbed by a heatsink disposed adjacent the first side of the printed circuit board. Power for the processing unit is provided, by the power converter, through a thickness of the printed circuit board.

Abstract: Systems and methods are provided for utilizing a bidirectional intermediate data transport layer to connect multiple customers to a shared, cloud-based AIOps service. As a feature of the intermediate data transport layer, each customer (and their data) may be isolated from other customers. In various examples, the cloud-based AIOps service may receive sensor data from customer systems via the intermediate data transport layer. The cloud-based AIOps service may analyze this sensor data (e.g. detect anomalies, perform root cause analyses, find optimal conditions, etc.), and modify the operation of one or more of the customer systems (e.g. modify the settings/configuration of a sensor on a piece of connected infrastructure) via the intermediate data transport layer. In certain examples, in addition to (or instead of) modifying the operation of one or more of the customer systems, the cloud-based AIOps service may provide an on-premises notification to a customer.

Abstract: Methods are described herein for manufacturing multi-component objects using artificial intelligence. The present invention may be directed to a method that includes determining an actual value of a first attribute of a first component of an object and determining, using a machine learning model and based on the actual value of the first attribute, an optimized value for a second attribute of a second component that is functionally interrelated to the first component in the object. The method may include selecting, from a plurality of second components each having a value for the second attribute within a tolerance range, a second component having the optimized value for the second attribute. The method may further include manufacturing the object using the first component and the selected second component.

Abstract: In the examples provided herein, a system includes an electrochemical sensor having two electrodes inserted in a fluid to be tested, where an alternative current (AC) voltage is applied across the two electrodes; an electrochemical sensor having two electrodes inserted in a fluid to be tested, wherein an alternative current (AC) voltage across the two electrodes; and a frequency response analyzer to analyze the measured the electrical response across multiple frequencies. The system also includes a memory to store a baseline of the electrical response across multiple frequencies, and a processor to determine from the stored baseline and the measured electrical response whether the electrical response is outside a predetermined range.

Abstract: Example implementations relate to a cooling module, and a method of cooling an electronic circuit module. The cooling module includes first and second cooling components fluidically connected to each other. The first cooling component includes a first fluid channel having supply, return, and body sections, and a second fluid channel. The second cooling component includes an intermediate fluid channel. The body section is bifurcated into first and second body sections, and the first and second body sections are further merged into a third body section. The supply section is connected to the first and second body sections. The return section is connected to the third body section and the intermediate fluid channel via an inlet fluid-flow path established between the first and second cooling components. The second fluid channel is connected to the intermediate fluid channel via an outlet fluid-flow path established between the first and second cooling components.

Abstract: Example implementations relate to a cooling module, and a method of cooling an electronic circuit module. The cooling module includes first and second cooling components fluidically connected to each other. The first cooling component includes a first fluid channel having supply, return, and body sections, and a second fluid channel. The second cooling component includes an intermediate fluid channel. The body section is bifurcated into first and second body sections, and the first and second body sections are further merged into a third body section. The supply section is connected to the first and second body sections. The return section is connected to the third body section and the intermediate fluid channel via an inlet fluid-flow path established between the first and second cooling components. The second fluid channel is connected to the intermediate fluid channel via an outlet fluid-flow path established between the first and second cooling components.

Abstract: A heat transfer apparatus including a housing and a wick structure is provided that is configured to dissipate heat from a heat source. The housing defines a chamber that holds working fluid. The wick structure includes a body and pores defined by the body. The heat transfer apparatus defines an evaporator section configured to evaporate the working fluid using heat from a heat source and a condenser section configured to dissipate heat carried by the evaporated working fluid through condensation of the evaporated working fluid. The wick structure has a repeatable, configurable, and controlled geometry optimized to move the working fluid from the condenser section to the evaporator section via capillary action. The body of the wick structure may have a gyroidal geometry. Associated methods are also provided.

Abstract: Thermal management systems and associated methods are provided with acoustic isolation. An example system includes a computing device that defines a first housing supporting one or more processing units and a thermal management system. The thermal management system includes a pressure generation mechanism and one or more cooling conduits operably coupled with the pressure generation mechanism, and the one or more cooling conduits provide fluid communication between the computing device and the pressure generation mechanism. The pressure generation mechanism causes circulation of cooling fluid to the computing device via the one or more cooling conduits so as to dissipate heat generated by the one or more processing units, and the pressure generation mechanism is acoustically isolated from the computing device.

Abstract: Some embodiments described herein provide intelligent movable racks for a data center and a central system for monitoring and directing the positioning of such racks within the data center. For example, a rack may include computing equipment as well as a power system, a cooling system, and a cabling system (e.g., for data communication). The rack may include a controller in communication with the computing equipment, the power system, the cooling system, and the cabling system. The rack may also include a rack interface for physically supporting the rack and operatively connecting the systems of the rack to power, cooling, and cabling infrastructure of the data center. The rack interface may receive an autonomous robot for moving the rack within the data center. The controller may control the power system and the cooling system based in part on the autonomous movement of the rack.

Abstract: Example implementations relate to a chassis cooling resource. In some examples, a chassis cooling resource includes a controller, comprising instructions to detect a failure corresponding to a first cooling system of a first chassis coupled to a server rack, and alter settings of a second cooling system of a second chassis coupled the server rack to provide additional cooling resources to the first cooling system in response to the detected failure.

Abstract: Assemblies, systems, and methods are provided for dissipating heat from a PCB assembly. The PCB assembly may include a PCB comprising a first thermally conductive structure. A first heat generating component may be connected to the PCB and may be vertically disposed with respect to the PCB. The PCB may be disposed on a first side of the first heat generating component. The first thermally conductive structure may be configured to conduct heat laterally and cross-sectionally through the first thermally conductive structure toward a heat sink. A second thermally conductive structure may be disposed on a second side of the first heat generating component. The second thermally conductive structure may be configured to conduct heat laterally and cross-sectionally through the second thermally conductive structure into a heat sink. A heat sink configured to dissipate heat may be disposed between the first thermally conductive structure and the second thermally conductive structure.

Abstract: Methods, apparatuses, and computer program products for proactive thermal management and processing core selection are provided. An example method includes receiving a job packet that is associated with a packet profile and determining one or more performance parameters associated with a performance of the job packet as defined by the packet profile. The method further includes generating a proactive thermal management procedure based upon the one or more performance parameters and associating the proactive thermal management procedure with the job packet. The method may further include determining a selected processing core from amongst a plurality of processing cores for the performance of the job packet based upon one or more operating characteristics of the processing cores and/or one or more performance parameters of the job packet.

Abstract: A circuit board cooling apparatus is disclosed having a heat spreader device to be thermally coupled with a surface of the circuit board to be cooled. Also, a conforming heat transfer device is disclosed that is thermally and physically coupled with the heat spreader device to conform to a surface contour of the heat spreader device on a first side of the heat transfer device. The cooling apparatus also includes a heat transport device physically attached and thermally coupled with a second side of the heat transfer device.

Abstract: Example implementations relate to a chassis cooling resource. In some examples, a chassis cooling resource includes a controller, comprising instructions to detect a failure corresponding to a first cooling system of a first chassis coupled to a server rack, and alter settings of a second cooling system of a second chassis coupled the server rack to provide additional cooling resources to the first cooling system in response to the detected failure.

Abstract: A circuit board cooling apparatus is disclosed having a heat spreader device to be thermally coupled with a surface of the circuit board to be cooled. Also, a conforming heat transfer device is disclosed that is thermally and physically coupled with the heat spreader device to conform to a surface contour of the heat spreader device on a first side of the heat transfer device. The cooling apparatus also includes a heat transport device physically attached and thermally coupled with a second side of the heat transfer device.

Abstract: Devices, apparatuses, systems, and methods are provided for improved thermal management in networking computing devices. An example thermal management apparatus includes a housing defining a first end and a second end opposite the first end. The apparatus further includes an electronic component supported within the housing, such as a GPU. The apparatus includes a primary inlet that receives a primary airflow having a first temperature and a secondary inlet that receives a secondary airflow having a second temperature where the second temperature is different than the first temperature. The primary airflow and the secondary airflow are collectively configured to dissipate heat generated by the electronic component.

Abstract: Example implementations relate to a cooling module, and a method of cooling an electronic circuit module. The cooling module includes first and second cooling components fluidically connected to each other. The first cooling component includes a first fluid channel having supply, return, and body sections, and a second fluid channel. The second cooling component includes an intermediate fluid channel. The body section is bifurcated into first and second body sections, and the first and second body sections are further merged into a third body section. The supply section is connected to the first and second body sections. The return section is connected to the third body section and the intermediate fluid channel via an inlet fluid-flow path established between the first and second cooling components. The second fluid channel is connected to the intermediate fluid channel via an outlet fluid-flow path established between the first and second cooling components.