Abstract: Systems and devices for cooling servers are provided. In one aspect, a cooling device includes a first axial pump including a body having an impeller, the first axial pump coupled to a first pump housing, the first axial pump housing coupled to a chassis, a rack, a row of racks, or one or more racks of the row of racks that are housing one or more servers. The cooling device also includes an inlet pipe coupled to an inlet of the first pump housing, the inlet pipe supplying cooling fluid to the first axial pump. The cooling device also includes an outlet pipe having an outlet coupled to the first pump housing, the outlet pipe receiving the cooling fluid from the first axial pump.

Abstract: A device including a circuit component that dissipates heat and a cooling loop thermally coupled to the circuit component, is provided. The cooling loop includes an inlet port configured to receive a cooling fluid, a first axial pump disposed along a fluid flow channel and configured to move the cooling fluid axially through the fluid flow channel in the cooling loop at a specified flow rate, and an outlet port configured to transfer the cooling fluid out of the cooling loop, wherein the specified flow rate is adjusted according to one or more parameters.

Abstract: In one implementation, a system for hybrid cooling control of a computing system includes a coordinated controller engine to: determine a number of liquid loop set-points and a number of air loop set-points, determine a number of system parameters corresponding to the number of liquid loop set-points and the number of air loop set-points, determine a correlation factor for the number of system parameters; and alter the number of liquid loop set-points and the number of air loop set-points based on the correlation factor to lower an energy consumption or to maximize energy reuse of a number of cooling resources associated with the number of system parameters.

Abstract: An example cooling system is described herein. The cooling system can include a first cold plate including a first heat pipe to couple to a side of a dual in-line memory module (DIMM) where the first heat pipe transfers heat from the DIMM to the first cold plate; and a second cold plate including a second heat pipe to couple to the side of the DIMM, where the second heat pipe transfers heat from the DIMM to the second cold plate.

Abstract: An apparatus is provided herein. The apparatus includes a sensor module and a control module. The sensor module to receive a measured environmental condition. The control module to use the measured environmental condition to determine a fluid temperature to cool a first set of components and determine an air temperature to cool a second set of components.

Abstract: The present disclosure provides a system including a cooling rack for servers, a first enclosure, and a second enclosure. The first enclosure can be coupled to the cooling rack for servers and houses electronics. The second enclosure can be coupled to the cooling rack for servers beneath the first enclosure with a minimal sliding clearance in between the two enclosures. The second enclosure also holds an electronics cartridge and connects to the cooling rack for servers via a slide that enables the second enclosure to slide out from under the first enclosure so that the electronics cartridge can be removed from a top of the enclosure. Further, the second enclosure may contain a fluid to immerse components and absorb heat from the electronics cartridge.

Abstract: An example system is provided herein. The system includes a fuel cell coupled to the set of electronic components. The fuel cell provides power to the set of electronic components when a set of conditions are met.

Abstract: Cold plates are described herein. In one example, a cold plate can include a heat plate bay coupled to a first side and a second side of a coolant channel, a heat plate removably coupled within the heat plate bay, and a gasket coupled to the heat plate to seal the heat plate within the heat plate bay to provide a fluid path between the first side and the second side of the coolant channel.

Abstract: In one implementation, a system for hybrid cooling control of a computing system includes a coordinated controller engine to: determine a number of liquid loop set-points and a number of air loop set-points, determine a number of system parameters corresponding to the number of liquid loop set-points and the number of air loop set-points, determine a correlation factor for the number of system parameters; and alter the number of liquid loop set-points and the number of air loop set-points based on the correlation factor to lower an energy consumption or to maximize energy reuse of a number of cooling resources associated with the number of system parameters.

Abstract: An assembly useable with a cooling system is provided herein. The assembly includes a support member, a channel, and a fluid control mechanism. The support member includes a receiving member formed therein to receive a thermal member. The channel is formed within the support member to carry a fluid therethrough. The fluid control mechanism is along the channel to control the flow of the fluid.

Abstract: Systems and methods are provided for a gasket that allows for a single cooling cold plate to touch one or more devices. These devices may have precise but varying thermal interfaces and mounting pressure requirements; and height and co-planarity tolerances that need to be accommodated. The gasket may be sandwiched in between a top stiffener plate and a floating cold plate along an outer perimeter of the gasket; and a rigid, cold plate base and a bottom stiffener plate along an inner perimeter of the gasket. The resulting seal allows coolant to flow between the rigid and floating cold plates as these plates move (i.e., float) with respect to one another. Thus, the gasket aids in a cooling apparatus achieve an optimum thermal interface with each of the one or more devices simultaneously, while accounting for the individual tolerance variations across each device.

Abstract: A system to cool a module data center including a fluid cooling device to cool a first set of components of the module data center using a fluid cooling loop and an air cooling device to provide an air to cool a second set of components of the module data center. Also, a control apparatus to determine an air cooling temperature for the air cooling loop based on an environmental condition, determine a fluid cooling temperature for the fluid cooling loop based on the environmental condition, transmit an air signal to the air cooling device to set the air cooling temperature, and transmit a fluid signal to the fluid cooling device to set the fluid cooling temperature.

Abstract: Example implementations relate to a server device with a capacitive circuit. For example, a server device with a capacitive circuit can include a capacitive circuit located on a printed circuit assembly (PCA) of the server device and a baseboard management controller unit (BMC) to provide a communication interface between the capacitive circuit and a computing device. A voltage can be applied across the capacitive circuit and a signal can be sent from the capacitive circuit to the computing device using the BMC in response to a change in voltage.

Abstract: Example implementations relate to a magnetic fluid connector. For example, a magnetic fluid connector can include a magnet, an internal fluid path defined by a first portion and a second portion when the first portion and the second portion are coupled together, and a movable member that is movable to seal the internal fluid path, where the magnet provides at least a portion of a force sufficient to seal the internal fluid path.

Abstract: Cold plates are described herein. In one example, a cold plate can include a heat plate bay coupled to a first side and a second side of a coolant channel, a heat plate removably coupled within the heat plate bay, and a gasket coupled to the heat plate to seal the heat plate within the heat plate bay to provide a fluid path between the first side and the second side of the coolant channel.

Abstract: Examples herein relate to an efficient cooling system. Examples disclose a first distribution line that delivers a first cooling fluid across a device. The first cooling fluid flows across the device from a first side to a second side. The examples also disclose a second distribution like that is separate from the first distribution line. The second distribution line delivers a second cooling fluid across the device from the second side to the first side such that the second cooling fluid flows in an opposite direction to the first cooling fluid.

Abstract: An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

Abstract: A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.

Abstract: Example implementations relate to an optical biofilm probe. For example, in an implementation, the optical biofilm probe may include a light source to project light towards a substrate disposed within a bypass and a detector to detect light from the substrate. Properties of light detected by the detector may be affected by biofilm formation on the substrate. The bypass may be connected in parallel to a conduit of a fluid system.

Abstract: Example implementations relate to a magnetic fluid connector. For example, a magnetic fluid connector can include a magnet, an internal fluid path defined by a first portion and a second portion when the first portion and the second portion are coupled together, and a movable member that is movable to seal the internal fluid path, where the magnet provides at least a portion of a force sufficient to seal the internal fluid path.