Patents by Inventor Tahir Cader
Tahir Cader has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7032403Abstract: A method of controlling spray distances in a spray unit for efficiently thermally managing one or more electronic devices. The method of controlling spray distances in a spray unit includes a first portion and a second portion positioned with the first portion. The first portion includes at least one first orifice for dispensing a first fluid flow towards at least one electronic device. A second portion is positioned within the first portion, wherein the second portion may be slidably positioned or non-movably positioned within the first portion. The second portion includes at least one second orifice for dispensing a second fluid flow towards at least one electronic device.Type: GrantFiled: November 26, 2003Date of Patent: April 25, 2006Assignee: Isothermal Systems Research, Inc.Inventors: Charles L. Tilton, Tahir Cader, Nathan G. Muoio
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Patent number: 7021067Abstract: A dynamic thermal management spray system for efficiently thermally managing one or more electronic devices. The dynamic thermal management spray system includes one or more spray units having an adjustable spray characteristic. The spray characteristic of at least one spray unit is adjusted based upon the desired thermal management of one or more electronic devices. Adjusting the spray characteristic is preferably comprised of increasing/decreasing the fluid flow rate.Type: GrantFiled: January 30, 2004Date of Patent: April 4, 2006Assignee: Isothermal Systems Research, Inc.Inventors: Charles L. Tilton, Tahir Cader, Nathan G. Muoio
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Patent number: 7013662Abstract: A staggered spray nozzle system for efficiently thermally managing one or more electronic devices. The staggered spray nozzle system includes a first portion and a second portion positioned with the first portion. The first portion includes at least one first orifice for dispensing a first fluid flow towards at least one electronic device. A second portion is positioned within the first portion, wherein the second portion may be slidably positioned or non-movably positioned within the first portion. The second portion includes at least one second orifice for dispensing a second fluid flow towards at least one electronic device.Type: GrantFiled: November 26, 2003Date of Patent: March 21, 2006Assignee: Isothermal Systems Research, Inc.Inventors: Charles L. Tilton, Tahir Cader, Nathan G. Muoio
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Patent number: 6996996Abstract: A sealed spray cooling system for reducing coolant loss within thermal management systems. The sealed spray cooling system includes a spray housing defining a spray chamber having at least one atomizer and a seal member attached to the spray housing about the spray chamber for sealing against a semiconductor forming a sealed spray area. Alternatively, the spray unit is comprised of a first member, a second member having at least one atomizer, the second member pivotally attached to the first member forming an interior cavity between thereof, and a seal member attached to the second member for sealing against a semiconductor within the first member thereby forming a sealed spray area. A vacuum manifold is preferably fluidly connected to the spray cavity thereby reducing the pressure within the spray cavity.Type: GrantFiled: April 2, 2003Date of Patent: February 14, 2006Assignee: Isothermal Systems Research, Inc.Inventor: Tahir Cader
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Publication number: 20050275419Abstract: A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The spray heads and probe head are disposed in a sealed manner inside a spray chamber that, during operation, is urged in a sealing manner onto a sealing plate holding the integrated circuit under test. The atomized mist cools the integrated circuit and then condenses on the spray chamber wall. The condensed fluid is pumped out of the chamber and is circulated in a chiller, so as to be re-circulated and injected again into the micro-spray heads. The pressure inside the spray chamber may be controlled to provide a desired boiling point.Type: ApplicationFiled: August 16, 2005Publication date: December 15, 2005Inventors: Tahir Cader, Charles Tilton, Benjamin Tolman, George Wos, Alan Roberts, Thomas Wong, Jonathan Frank
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Patent number: 6958911Abstract: The present invention is a two-phase liquid cooling system that cools a plurality of electronic components connected in parallel. A pump delivers a cooling fluid, as a liquid, to a supply manifold wherein it splits into distinct branch lines. Preferably, the branch lines feed coolant to individual spray modules. The liquid coolant removes heat from the components to be cooled. The resulting liquid and vapor mixture exit the spray modules via a plurality of return branches. Each individual return branch feeds into a return manifold at an acute angle. The angular transitions between the return branches and the return manifold provides low manifold losses and a more efficient system.Type: GrantFiled: January 30, 2004Date of Patent: October 25, 2005Assignee: Isothermal Systems Research, Inc.Inventors: Tahir Cader, Robert J. Ressa
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Publication number: 20050195570Abstract: The present invention is a liquid cooling system that cools a plurality of electronic components connected in parallel. A pump delivers a cooling fluid, as a liquid, to a supply manifold wherein it splits into distinct branch lines. Preferably, the branch lines feed coolant to individual spray modules. The liquid coolant removes heat from the components to be cooled. The resulting fluid mixture exits the spray modules via a plurality of return branches. Each individual return branch feeds into a return manifold at an acute angle. The angular transitions between the return branches and the return manifold provides low manifold losses and a more efficient system.Type: ApplicationFiled: April 27, 2005Publication date: September 8, 2005Applicant: Isothermal Systems ResearchInventors: Tahir Cader, Robert Ressa
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Publication number: 20050183844Abstract: The present invention is a spray cooling thermal management device that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon the surface of the component. In areas of the chip that generate large heat fluxes, typically referred to as the core, the liquid coolant is dispensed as a continuous atomized droplet pattern. The atomized pattern creates a high heat flux evaporative cooling thin-film over the one or more core areas. Rather than optimize the atomized pattern and flow based upon complete thin-film vaporization, the present invention optimizes the atomized pattern for maximum heat removal rates. Any excess, non-vaporized, fluid flowing outward from the hotspot is used to cool the lower heat flux (non-core) areas of the component through the creation of a thick coolant film thereon.Type: ApplicationFiled: February 24, 2004Publication date: August 25, 2005Applicant: Isothermal Systems ResearchInventors: Charles Tilton, Donald Tilton, Thomas Weir, Tahir Cader, Paul Knight
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Publication number: 20050168948Abstract: The present invention is a two-phase liquid cooling system that cools a plurality of electronic components connected in parallel. A pump delivers a cooling fluid, as a liquid, to a supply manifold wherein it splits into distinct branch lines. Preferably, the branch lines feed coolant to individual spray modules. The liquid coolant removes heat from the components to be cooled. The resulting liquid and vapor mixture exit the spray modules via a plurality of return branches. Each individual return branch feeds into a return manifold at an acute angle. The angular transitions between the return branches and the return manifold provides low manifold losses and a more efficient system.Type: ApplicationFiled: January 30, 2004Publication date: August 4, 2005Applicant: Isothermal Systems ResearchInventors: Tahir Cader, Robert Ressa
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Patent number: 6889515Abstract: A spray cooling system for efficiently thermally managing a single or multiple semiconductor chip package. The spray cooling system includes a heat exchanger unit having a pump unit and a reservoir, a coaxial tube fluidly connected to the heat exchanger unit, a coupler unit attached to the coaxial tube, and a spray module where the coupler unit is removably connected to the spray module. The heat exchanger unit has an air tolerant design that allows for the entry and release of air without interfering with the operation thereof.Type: GrantFiled: February 14, 2003Date of Patent: May 10, 2005Assignee: Isothermal Systems Research, Inc.Inventors: Charles L. Tilton, Donald E. Tilton, Ryan J. Baddeley, Tahir Cader, George J. Wos
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Patent number: 6889509Abstract: A coolant recovery system for reducing coolant loss within thermal management systems. The coolant recovery system includes a thermal management unit having a spray chamber and a coolant recovery chamber, a first cooling coil within the coolant recovery chamber, and a chilled water supply fluidly connected to the first cooling coil. The coolant is sprayed upon the electronic device within the spray chamber and then is collected into the coolant recovery chamber for thermal conditioning. A removable chamber may be removably positioned within the spray chamber. In an alternative embodiment, a central unit may be connected to a plurality of thermal management units.Type: GrantFiled: February 19, 2003Date of Patent: May 10, 2005Assignee: Isothermal Systems Research Inc.Inventors: Tahir Cader, Charles L. Tilton, Donald D. Tilton, George J. Wos
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Patent number: 6857283Abstract: A semiconductor burn-in thermal management system for providing an effective thermal management system capable of maintaining a desired semiconductor temperature during a burn-in cycle. The semiconductor burn-in thermal management system includes a reservoir for storing a volume of fluid, a pump fluidly connected to the reservoir, and a plurality of spray units fluidly connected to the pump. The spray units dispense the fluid upon the surface of the semiconductor during burn-in thereby maintaining a relatively constant surface temperature. Each of the spray units preferably includes a stationary first portion with a second portion movably positioned within the first portion in a biased manner. When burning in semiconductors without an integrated heat sink that are deeply recessed within the sockets of a burn-in board, the fluid pressure to the second portion is increased thereby extending the second portion from the first portion thereby reducing the effective distance from the surface of the semiconductor.Type: GrantFiled: September 13, 2002Date of Patent: February 22, 2005Assignee: Isothermal Systems Research, Inc.Inventors: Charles L. Tilton, Tahir Cader, Benjamin H. Tolman, Nathan G. Muoio
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Patent number: 6836131Abstract: A combination cooling plate and micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes a transparent heat spreader and micro-spray heads disposed about the heat spreader. The spray heads spray cooling liquid onto a periphery of said heat spreader so as to remove heat from the chip. Alternatively, and micro-spray heads are provided inside the cooling plate holder so as to spray cooling liquid inside the interior of the holder so that the holder is cooled. The holder is in physical contact with the heat spreader, so that as the holder is cooled by the spray, heat is removed from the heat spreader, and thereby from the chip.Type: GrantFiled: March 4, 2003Date of Patent: December 28, 2004Assignee: Credence Systems Corp.Inventors: Tahir Cader, Nathan Stoddard, Donald Tilton, Nader Pakdaman, Steven Kasapi
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Publication number: 20040089008Abstract: A spray cooling system for efficiently thermally managing a single or multiple semiconductor chip package. The spray cooling system includes a heat exchanger unit having a pump unit and a reservoir, a coaxial tube fluidly connected to the heat exchanger unit, a coupler unit attached to the coaxial tube, and a spray module where the coupler unit is removably connected to the spray module. The heat exchanger unit has an air tolerant design that allows for the entry and release of air without interfering with the operation thereof.Type: ApplicationFiled: February 14, 2003Publication date: May 13, 2004Inventors: Charles L. Tilton, Donald E. Tilton, Ryan J. Baddeley, Tahir Cader, George J. Wos
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Publication number: 20040051545Abstract: A semiconductor burn-in thermal management system for providing an effective thermal management system capable of maintaining a desired semiconductor temperature during a burn-in cycle. The semiconductor burn-in thermal management system includes a reservoir for storing a volume of fluid, a pump fluidly connected to the reservoir, and a plurality of spray units fluidly connected to the pump. The spray units dispense the fluid upon the surface of the semiconductor during burn-in thereby maintaining a relatively constant surface temperature. Each of the spray units preferably includes a stationary first portion with a second portion movably positioned within the first portion in a biased manner. When burning in semiconductors without an integrated heat sink that are deeply recessed within the sockets of a burn-in board, the fluid pressure to the second portion is increased thereby extending the second portion from the first portion thereby reducing the effective distance from the surface of the semiconductor.Type: ApplicationFiled: September 13, 2002Publication date: March 18, 2004Inventors: Charles L. Tilton, Tahir Cader, Benjamin H. Tolman, Nathan G. Muoio
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Publication number: 20040032275Abstract: A combination cooling plate and micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes a transparent heat spreader and micro-spray heads disposed about the heat spreader. The spray heads spray cooling liquid onto a periphery of said heat spreader so as to remove heat from the chip. Alternatively, and micro-spray heads are provided inside the cooling plate holder so as to spray cooling liquid inside the interior of the holder so that the holder is cooled. The holder is in physical contact with the heat spreader, so that as the holder is cooled by the spray, heat is removed from the heat spreader, and thereby from the chip.Type: ApplicationFiled: March 4, 2003Publication date: February 19, 2004Inventors: Tahir Cader, Nathan Stoddard, Donald Tilton, Nader Pakdaman, Steven Kasapi
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Publication number: 20040032274Abstract: A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The spray heads and probe head are disposed in a sealed manner inside a spray chamber that, during operation, is urged in a sealing manner onto a sealing plate holding the integrated circuit under test. The atomized mist cools the integrated circuit and then condenses on the spray chamber wall. The condensed fluid is pumped out of the chamber and is circulated in a chiller, so as to be re-circulated and injected again into the micro-spray heads. The pressure inside the spray chamber may be controlled to provide a desired boiling point.Type: ApplicationFiled: August 16, 2002Publication date: February 19, 2004Inventors: Tahir Cader, Charles Lester Tilton, Benjamin Hewett Tolman, George Joseph Wos, Alan Brent Roberts, Thomas Wong, Jonathan D. Frank
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Patent number: 5898353Abstract: Convective cooling of a distribution transformer is enhanced by use of magnetic fluid which has a magnetically driven flow pattern in the form of a plurality of vertically stacked magnetic circulation cells with convective heat transfer being enhanced by modifying the configuration of a proximate transformer wall to facilitate the transfer of heat from the magnetic fluid to the wall and then to the ambient air.Type: GrantFiled: June 17, 1997Date of Patent: April 27, 1999Assignee: Electric Power Research InstituteInventors: Tahir Cader, Samuel Bernstein, Clayton Crowe
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Patent number: 5661983Abstract: An air conditioning system utilizes parallel fluidized bed desiccators for reducing the temperature and humidity of supply air. While one fluidized bed removes moisture from the supply air, the other is regenerated by a heated air flow. Use of the two beds is cycled back and forth between moisture removal and regeneration during operation of the system.Type: GrantFiled: June 2, 1995Date of Patent: September 2, 1997Assignee: Energy International, Inc.Inventors: Barney Groten, Tahir Cader, Richard Tidball