Abstract: Example implementations relate to an optical biofilm probe. For example, in an implementation, the optical biofilm probe may include a light source to project light towards a substrate disposed within a bypass and a detector to detect light from the substrate. Properties of light detected by the detector may be affected by biofilm formation on the substrate. The bypass may be connected in parallel to a conduit of a fluid system.

Abstract: An example device in accordance with an aspect of the present disclosure includes a sensor, a controller, and an injector. The sensor is to provide sensor output regarding fluid chemistry of a fluid of a cooling system. The controller is to identify attributes of the fluid. The injector is to inject at least one additive into the fluid to bring at least one attribute into a threshold range.

Abstract: Example implementations relate to an integrated liquid cooling of a server system. For example, a method for integrated liquid cooling of a server system can include creating a liquid cooling component that includes creating a three dimensional (3D) design based on a server system, where the 3D design includes customized angle geometry. Further, the method for integrated liquid cooling of a server system can include forming the liquid cooling component based on the 3D design, where the liquid cooling component includes a plurality of liquid flow passages for delivering cooling resources to the server system, and delivering the cooling resources to the server system via the liquid cooling component.

Abstract: In one implementation, a system for scalable coolant distribution unit includes a parameters engine to determine real time pump parameters of a first CDU, wherein the real time pump parameters correspond to a functionality of the first CDU, a pump engine to alter pump parameters of the first CDU based on the real time pump parameters, a communication engine to send the altered pump parameters of the first CDU to a second CDU, the pump engine to alter pump parameters of the second CDU based on the altered pump parameters of the first CDU and determined real time pump parameters of the second CDU, a functionality engine to determine a functionality of the first CDU and the second CDU based on the real time pump parameters and altered pump parameters.

Abstract: Example implementations relate to an adaptive cooling assembly. For example, an adaptive cooling assembly includes a removable shelf installed in the adaptive cooling assembly, an adaptive cooling bay located in a slot formed by the removable shelf, and a removable thermal bus bar installed in the adaptive cooling bay and connected to a pair of connectors. The adaptive cooling bay includes the pair of connectors and the removable thermal bus bar provides liquid cooling to an electronic device.

Abstract: The present disclosure provides a system including a cooling rack for servers, a first enclosure, and a second enclosure. The first enclosure can be coupled to the cooling rack for servers and houses electronics. The second enclosure can be coupled to the cooling rack for servers beneath the first enclosure with a minimal sliding clearance in between the two enclosures. The second enclosure also holds an electronics cartridge and connects to the cooling rack for servers via a slide that enables the second enclosure to slide out from under the first enclosure so that the electronics cartridge can be removed from a top of the enclosure. Further, the second enclosure may contain a fluid to immerse components and absorb heat from the electronics cartridge.

Abstract: Example implementations relate to a server device with a capacitive circuit. For example, a server device with a capacitive circuit can include a capacitive circuit located on a printed circuit assembly (PCA) of the server device and a baseboard management controller unit (BMC) to provide a communication interface between the capacitive circuit and a computing device. A voltage can be applied across the capacitive circuit and a signal can be sent from the capacitive circuit to the computing device using the BMC in response to a change in voltage.

Abstract: An assembly for liquid cooling is provided herein. The assembly includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

Abstract: A modular utility assembly is provided herein. The modular utility assembly includes a power module, a network module, and a cooling module. The power module includes a power connector to mate with and provide power to an electronic module. The network module includes a network connector to mate with and provide a network connection between the network module and the electronic module. The cooling module includes a cooling connector to mate with and connect to a cooling component on the electronic module.

Abstract: A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.

Abstract: In one implementation of a modular rack system, a rack module (22, 24, 222, 522, 722, 724) comprises a bay (30, 730) comprising a first side wall (32, 732), a second side wall (32, 732) and floor (36, 736) and an intermediate wall positioning mechanism (280, 380, 390, 392, 790, 792) to support a wall (282, 782) at different spacings with respect to the first side wall (32, 732). In another implementation of the modular rack system, a utility bay (148) extends across rack modules (22, 24, 222, 522, 722, 724).

Abstract: An apparatus is provided herein. The apparatus includes a sensor module and a control module. The sensor module to receive a measured environmental condition. The control module to use the measured environmental condition to determine a fluid temperature to cool a first set of components and determine an air temperature to cool a second set of components.

Abstract: An assembly to connect two electronic components is provided herein. The assembly includes a lever unit with a lever and a base. The lever includes a primary cam member and a secondary cam member connected thereto. The lever also includes a hook member extending therefrom. The base includes a guide structure to engage with a drive pin. Rotation of the lever to move a first electronic component along a y-axis towards, a backplane. The secondary cam member to move the drive pin along the guide structure, and the hook member to engage with a second electronic component and mate the first electronic component and the second electronic component along the second axis.

Abstract: According to an example, a cooling system includes a cooling fluid reservoir, a cooling apparatus in fluid communication with the cooling fluid reservoir, a chamber having a side in thermal contact with a portion of the heat generating component, in which cooling fluid delivered by the cooling apparatus is to be heated through receipt of heat from the heat generating component, a cooling plate positioned at a distance and separated from the chamber, and a cooling fluid tube connecting the chamber and the cooling plate, in which the heated cooling fluid is to flow through the cooling fluid tube to the cooling plate. The cooling plate is also to be in thermal contact with a heat exchanger that that is to remove heat from the cooling fluid.

Abstract: An apparatus to cool an electronic module is provided herein. The apparatus includes a support member and a retaining member. The support member to receive the cooling module. The support member includes a cooling module alignment member to align the cooling module therein. The retaining member to secure the cooling module.

Abstract: Resource management for data centers is disclosed. In an exemplary embodiment, a method includes determining electrical power usage for the data center, and determining cooling fluid usage for the data center. The method also includes processing a resource utilization cap for the data center, and adjust ng at least one of the electrical power and the cooling fluid for the data center based on the resource utilization cap.

Abstract: Examples described herein relate to adiabatic cooling units. For example, a method for mixing gases within an adiabatic cooling unit includes allowing a first gas at a first temperature to enter a mixing chamber on a non-exposed side of an adiabatic cooling media and utilizing a first baffle to direct the first gas in a direction away from the adiabatic cooling media. The method includes allowing a second gas at a second temperature to enter the mixing chamber on an exposed side of the adiabatic cooling media and allowing the first gas and the second gas to mix in the mixing chamber creating a mixed gas. The method also includes creating an inlet with the first baffle and a second baffle to direct the mixed gas away from the adiabatic cooling media and allowing the mixed gas to enter through the exposed side of the adiabatic cooling media.

Abstract: An example device in accordance with an aspect of the present disclosure includes a substrate that may be disposed in a housing. The substrate includes a sprayer to spray coolant.

Abstract: Apparatuses associated with liquid coolant supply are disclosed. One example apparatus is a computing cartridge which includes a first electronic device and a liquid-cooled cold plate. The computing cartridge also includes a first thermal couple between the first electronic device and the cold plate. The computing cartridge also includes an inlet fluid connector. The inlet fluid connector may supply a liquid coolant to the cold plate The computing cartridge also includes an outlet fluid connector. The outlet fluid connector may facilitate return of the coolant from the cold plate.

Abstract: Examples provide data center canopies, data center housings, and data centers including turning vanes to facilitate air flow. In some examples, a data center canopy may include turning vanes to direct portions of an exhaust flow from an exhaust inlet toward floor sections to be output via exhaust outlets opposite the floor sections. Other examples are described and claimed.