Patents by Inventor Tai An

Tai An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11158600
    Abstract: A device includes a molding compound encapsulating a first integrated circuit die and a second integrated circuit die; a dielectric layer over the molding compound, the first integrated circuit die, and the second integrated circuit die; and a metallization pattern over the dielectric layer and electrically connecting the first integrated circuit die to the second integrated circuit die. The metallization pattern comprises a plurality of conductive lines. Each of the plurality of conductive lines extends continuously from a first region of the metallization pattern through a second region of the metallization pattern to a third region of the metallization pattern; and has a same type of manufacturing anomaly in the second region of the metallization pattern.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: October 26, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hung-Jui Kuo, Ming-Tan Lee, Ting-Yang Yu, Shih-Peng Tai, I-Chia Chen
  • Patent number: 11155635
    Abstract: The present invention relates to an antibody specifically bound to a coagulation factor VIII or an antigen binding fragment thereof, and a use thereof. More specifically, the present invention relates to: an antibody which is specifically bound to a coagulation factor VIII including specific sequences of heavy chain CDR and light chain CDR, or an antigen binding fragment thereof; a column in which the antibody or the antigen binding fragment thereof is coupled to a column stationary phase as a ligand for isolating or purifying a recombinant coagulation factor VIII; and a method for purifying a recombinant coagulation factor VIII using the same.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: October 26, 2021
    Assignee: PANGEN BIOTECH INC.
    Inventors: Jaeseung Yoon, Kwanghee Baek, Taeho Byun, Jeong Soo Park, Ji Tai Kim, Hankyu Oh, Jongmin Lee
  • Patent number: 11154330
    Abstract: A dual-trajectory pedicle screw system includes an internally threaded sleeve and including first part and cylindrical second part, the first part being recessed to form a space, and the second part including projections on top; a main screw including a universal head and a first conic member, the universal head including first and second threaded holes, the first threaded hole being inclined at a first angle, the second threaded hole being inclined at a different second angle, bottom of the universal head being a convex and rotatably disposed in the space; and an auxiliary screw including external threads threadedly secured to the first or second threaded hole so that the auxiliary screw is secured to the main screw at the first or second angle with respect to the main screw, a second conic member extending downward from the external threads, and a fitting member on top of the external threads.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: October 26, 2021
    Assignee: CHANG GUNG UNIVERSITY
    Inventors: Yun-Da Li, Ching-Lung Tai, Po-Liang Lai, Tsung-Ting Tsai, Ming-Kai Hsieh, Mu-Yi Liu
  • Patent number: 11154639
    Abstract: Disclosed herein are substrates for cell delivery to target tissues requiring treatment for various diseases that induce cell death, damage or loss of function. The substrates are configured to provide seeded cells, including stem cells, with a structural support that allows interconnection with and transmission of biological signals between the cells and the target tissue.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: October 26, 2021
    Assignees: University of Southern California, California Institute of Technology, The Regents of the University of California
    Inventors: Mark S. Humayun, Ashish Ahuja, Yu-Chong Tai, David R. Hinton, Robert H. Grubbs, Dennis O. Clegg, Lincoln Vallance Johnson, Sherry T. Hikita
  • Patent number: 11156235
    Abstract: The present invention provides a thermal transferring method and a structural device utilizing thermal energy body performing vibration displacement to fluid in which a vibration actuating device is provided for performing vibration driving to a thermal energy body disposed in a fluid thereby allowing the thermal energy body to perform periodic vibration displacement to the fluid for transferring thermal energy and enabling the fluid to circulatively flow, thereby a novel thermal transferring method and a structural device utilizing thermal energy body performing vibration displacement to fluid for the purpose of heating or cooling are provided.
    Type: Grant
    Filed: July 5, 2012
    Date of Patent: October 26, 2021
    Inventor: Tai-Her Yang
  • Patent number: 11158762
    Abstract: A light-emitting device includes a substrate having a top surface, wherein the top surface includes a first portion and a second portion; a first semiconductor stack on the first portion, including a first upper surface and a first side wall; and a second semiconductor stack on the first upper surface, including a second upper surface and a second side wall, and wherein the second side wall connects the first upper surface; wherein the first semiconductor stack includes a dislocation stop layer; and wherein the first side wall and the second portion of the top surface form an acute angle ? between thereof.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: October 26, 2021
    Assignee: EPISTAR CORPORATION
    Inventors: Yen-Tai Chao, Sen-Jung Hsu, Tao-Chi Chang, Wei-Chih Wen, Ou Chen, Yu-Shou Wang, Chun-Hsiang Tu, Jing-Feng Huang
  • Patent number: 11156803
    Abstract: An imaging optical system includes six lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. Each of the six lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. At least one lens element of the imaging optical system has at least one aspheric surface having at least one inflection point.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: October 26, 2021
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Chun-Che Hsueh, Hung-Shuo Chen, Yu-Tai Tseng, Tzu-Chieh Kuo
  • Patent number: 11155483
    Abstract: A method for efficiently producing PHA comprising: inoculating PHA fermentation strains into a fermentation medium for fermentation under the condition of being capable of producing PHA through fermentation; subjecting the fermentation broth to a solid-liquid separation to obtain fermentation supernatant and thallus precipitate; breaking the cell walls of the thallus precipitate, and subjecting the wall-broken products to a plate and frame filtration to prepare PHA; pre-coating a filter cloth for the plate and frame filtration with a PHA layer; at least part of the water of the fermentation medium is PHA process wastewater. The method utilizes the PHA process wastewater as at least part of the water of the fermentation medium, and filters and separates the broken thallus with the plate and frame filtration equipment pre-coated with PHA layer to prepare PHA, thereby recycling the high-salt wastewater, reducing costs, and potentially separating PHA on a large scale for industrial production.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: October 26, 2021
    Assignees: Nutrition & Health Research Institute, COFCO Corporation, COFCO (jilin) Bio-Chemical Technology CO., Ltd, COFCO Biotechnology Co., Ltd., Tsinghua University
    Inventors: Yi Tong, Yi Li, Fang Tian, Weiqiang Zhou, Yuanheng Guo, Guoqiang Chen, Dayong Li, Haijun Liu, Kejia Xu, Anni Liu, Bo Chen, Tai An, Xiaoyan Wang, Chao Peng, Xuemei Shen, Jin Tao, Lida Wu, Kai Yang, Qiong Wu
  • Patent number: 11158555
    Abstract: A package structure including a semiconductor die, an insulating encapsulant, and a redistribution layer is provided. The semiconductor die includes a semiconductor substrate, a plurality of metallization layers disposed on the semiconductor substrate, and a passivation layer disposed on the plurality of metallization layers. The passivation layer has a first opening that partially expose a topmost layer of the plurality of metallization layers. The insulating encapsulant is encapsulating the semiconductor die. The redistribution layer includes at least a first dielectric layer and a first conductive layer stacked on the first dielectric layer. The first dielectric layer has a second opening that overlaps with the first opening, and a width ratio of the second opening to the first opening is in a range of 2.3:1 to 12:1. The first conductive layer is electrically connected to the topmost layer of the plurality of metallization layers through the first and second openings.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: October 26, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Ting Kuo, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Chih-Hsuan Tai, Ying-Cheng Tseng
  • Patent number: 11158797
    Abstract: The present disclosure relates to a resistive random access memory (RRAM) device architecture, that includes a thin single layer of a conductive etch-stop layer between a lower metal interconnect and a bottom electrode of an RRAM cell. The conductive etch-stop layer provides simplicity in structure and the etch-selectivity of this layer provides protection to the underlying layers. The conductive etch stop layer can be etched using a dry or wet etch to land on the lower metal interconnect. In instances where the lower metal interconnect is copper, etching the conductive etch stop layer to expose the copper does not produce as much non-volatile copper etching by-products as in traditional methods. Compared to traditional methods, some embodiments of the disclosed techniques reduce the number of mask step and also reduce chemical mechanical polishing during the formation of the bottom electrode.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: October 26, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming Chyi Liu, Yuan-Tai Tseng, Chern-Yow Hsu, Shih-Chang Liu, Chia-Shiung Tsai
  • Patent number: 11159237
    Abstract: A data transmission system is provided in the invention. The data transmission system includes a transmitting device and a receiving device. The transmitting device encodes data into a color pattern, and displays the color pattern. The receiving device extracts the color pattern and decodes the color pattern to obtain the data.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: October 26, 2021
    Assignee: ACER INCORPORATED
    Inventors: Yen-Shuo Huang, Chih-Wen Huang, Wen-Cheng Hsu, Chao-Kuang Yang, Ling-Fan Tsao, Chueh-Pin Ko, Chih-Chiang Chen, Tai Ju, Yu-Shan Ruan
  • Patent number: 11158301
    Abstract: A method for eliminating a specific object voice and an ear-wearing audio device using the same are provided. The ear-wearing audio device includes a plurality of voice receiving units, a voice direction tracking unit, a direction enhancement unit, a window cutting unit, a voiceprint recognition unit, a voice cancellation unit and two speakers. The voice receiving units are arranged in an array to obtain a sound signal. The voice direction tracking unit is configured to track a plurality of sound sources to obtain a plurality of sound source directions. The voiceprint recognition unit determines whether the sound signal contains a specific object voice in each of the sound source directions. If the sound signal contains the specific object voice in one of the sound source directions, the voice cancellation adjusts a field pattern using a beamforming technique to eliminate the specific object voice.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: October 26, 2021
    Assignee: ACER INCORPORATED
    Inventors: Po-Jen Tu, Jia-Ren Chang, Kai-Meng Tzeng, Kuei-Ting Tai, Chih-Ta Lin
  • Publication number: 20210329099
    Abstract: An electronic apparatus and a data transmission method thereof are provided. The data transmission method is adapted to an electronic apparatus including a screen, and the data transmission method includes the following steps. An image frame is displayed through the screen. A selection marquee is displayed on the image frame through the screen, and the selection marquee is configured for selecting a partial image frame from the image frame. Connection information is displayed within the selection marquee through the screen, and feature information of data to be transmitted is recognized from the partial image frame selected by the selection marquee. A connection with another electronic apparatus is established according to the connection information. The data to be transmitted is sent to the another electronic apparatus via the connection according to the feature information.
    Type: Application
    Filed: September 25, 2020
    Publication date: October 21, 2021
    Applicant: Acer Incorporated
    Inventors: Yu-Chieh Huang, Chih-Wen Huang, Wen-Cheng Hsu, Chao-Kuang Yang, Ling-Fan Tsao, Chueh-Pin Ko, Chih-Chiang Chen, Tai Ju, Yu-Shan Ruan
  • Publication number: 20210322625
    Abstract: The present disclosure provides a method for manufacturing a porous film, including: preparing a polymer mixture solution, wherein the polymer mixture solution includes polycaprolactone and at least one hydrophobic polymer; adding solid particles as a dispersing agent to the polymer mixture solution and mixing the solid particles with the polymer mixture solution, wherein the amount of solid particles added is enough to convert the polymer mixture solution into a solid mixture; drying the solid mixture to form a film; and washing the film with a washing fluid to remove the solid particles from the film to form the porous film, wherein the weight ratio of the polycaprolactone to the at least one hydrophobic polymer is about 1:0.1-10, and wherein the weight ratio of the polycaprolactone and the at least one hydrophobic polymer to the solid particles is about 1:0.01-250.
    Type: Application
    Filed: May 5, 2021
    Publication date: October 21, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsin-Hsin SHEN, Ming-Chia YANG, Chia-Chi HO, Fang-Jie JANG, Che-Yu OU, Chi-Hsiang LIAO, Brian HSU, Tai-Horng YOUNG
  • Publication number: 20210327749
    Abstract: A method includes forming a first protruding fin and a second protruding fin over a base structure, with a trench located between the first protruding fin and the second protruding fin, depositing a trench-filling material extending into the trench, and performing a laser reflow process on the trench-filling material. In the reflow process, the trench-filling material has a temperature higher than a first melting point of the trench-filling material, and lower than a second melting point of the first protruding fin and the second protruding fin. After the laser reflow process, the trench-filling material is solidified. The method further includes patterning the trench-filling material, with a remaining portion of the trench-filling material forming a part of a gate stack, and forming a source/drain region on a side of the gate stack.
    Type: Application
    Filed: July 27, 2020
    Publication date: October 21, 2021
    Inventors: Wen-Yen Chen, Li-Ting Wang, Wan-Chen Hsieh, Bo-Cyuan Lu, Tai-Chun Huang, Huicheng Chang, Yee-Chia Yeo
  • Publication number: 20210321778
    Abstract: A chair comprises a seat pan member, a seat back member having a lumbar support member, a lumbar support assembly operatively connected to the lumbar support member and configured for moving the lumbar support member, with respect to the seat pan member and the seat back member, between at least a first position and a second position, and an actuator configured to operate the lumbar support assembly for movement of the lumbar support member between at least the first position and the second position. When the lumbar support member is in the second position, the lumbar support member is positioned forwardly, in a direction toward the seated user's lower back, relative to the seat back member so as to enable the user to be seated forwardly on the seat pan member while being engaged with the lumbar support member.
    Type: Application
    Filed: June 23, 2021
    Publication date: October 21, 2021
    Inventors: Tai Hoon K. Matlin, James Waring, Shawn Applegate, Steven James Barnaby, JR., Peter Maletich, John Fellowes
  • Publication number: 20210321718
    Abstract: A shoe heel protector includes a sheet body including a heel portion and two wing portions connected to opposing left and right ends of the heel portion and facing each other, and a plurality of elastic bumps bilaterally symmetrically arranged on the inner circumferential surface of the sheet body to provide a stable elastic support effect on the heel, so as to achieve the effect of improving wearing comfort.
    Type: Application
    Filed: June 5, 2020
    Publication date: October 21, 2021
    Inventor: Heng-Tai CHANG
  • Publication number: 20210324185
    Abstract: Embodiments relate to polyolefin compositions containing one or more high-density polyethylenes (HDPEs) and linear low-density polyethylenes (LLDPEs) and methods for forming the same. The polyolefin composition contains about 40 wt % to about 60 wt % of HDPE and about 40 wt % to about 60 wt % of LLDPE, by weight of the polyolefin composition. The HDPE has a density of greater than 0.93 g/cm3 and a melt index of about 0.2 dg/min to about 10 dg/min. The LLDPE has a density of less than 0.915 g/cm3 and a melt index of about 0.2 dg/min to about 10 dg/min. The polyolefin composition has a density of about 0.91 g/cm3 or greater, a melt index of about 0.5 dg/min to about 6 dg/min, and a Tw1?Tw2 value of about ?25° C. or less.
    Type: Application
    Filed: April 12, 2021
    Publication date: October 21, 2021
    Inventors: Dongming LI, Ching-Tai Lue, Qingyun Qian, Ling Ge, Gang Huang
  • Publication number: 20210327731
    Abstract: A mass transfer method, a mass transfer device and a buffer carrier are provided. The mass transfer method includes: (a) providing a plurality of electronic components disposed on a source carrier; (b) providing a buffer carrier including a plurality of adjusting cavities; and (c) transferring the electronic components from the source carrier to the buffer carrier, wherein the electronic components are placed in the adjusting cavities of the buffer carrier to adjust positions of the electronic components from shifted positions to correct positions.
    Type: Application
    Filed: April 15, 2020
    Publication date: October 21, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chih-Wen CHANG, Yu-Ho HSU, Tai-Yuan HUANG, Ping-Feng YANG, Fu-Ting CHANG, Chin-Feng WANG
  • Patent number: D934039
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: October 26, 2021
    Assignee: KAI R&D CENTER CO., LTD.
    Inventors: Wong Hung Tai, Pun Cheuk Wa