Abstract: An adapter engagable in a hole of a driving end of a tool includes a body receivable in the hole. The body includes a cavity in which an elastic member and a cover can be received. The elastic element can provide a force for pushing the cover to abut against the wall of the hole such that the adapter is securely retained in the hole.

Abstract: An adapter engagable in a hole of a driving end of a tool includes a body receivable in the hole. The body includes a cavity in which an elastic member and a cover can be received. The elastic element can provide a force for pushing the cover to abut against the wall of the hole such that the adapter is securely retained in the hole.

Abstract: A wafer level package structure of optical-electronic device and method for making the same are disclosed. The wafer level package structure of optical-electronic device is provided by employing a substrate whose surfaces have several optical sensitive areas and divided into individual package devices. The manufacture steps first involve providing a substrate with several chips whose surfaces have an optical sensitive area and bonding pads, and providing transparent layer whose surfaces have conductive circuits and scribe lines. Then the bonding pads bond to conductive circuits and a protection layer is formed on the chip to expose partly conductive circuits. Forming a conductive film on the protection layer and the conductive film contacts with the extending conductive circuits to form the wafer level package structure of optical-electronic device. At last, the transparent layer is diced according to scribe lines to form the individual package devices.

Abstract: A wafer level package structure of optical-electronic device and method for making the same are disclosed. The wafer level package structure of optical-electronic device is provided by employing a substrate whose surfaces have several optical sensitive areas and divided into individual package devices. The manufacture steps first involve providing a substrate with several chips whose surfaces have an optical sensitive area and bonding pads, and providing transparent layer whose surfaces have conductive circuits and scribe lines. Then the bonding pads bond to conductive circuits and a protection layer is formed on the chip to expose partly conductive circuits. Forming a conductive film on the protection layer and the conductive film contacts with the extending conductive circuits to form the wafer level package structure of optical-electronic device. At last, the transparent layer is diced according to scribe lines to form the individual package devices.

Abstract: A wafer level package structure of optical-electronic device and method for making the same are disclosed. The wafer level package structure of optical-electronic device is provided by employing a substrate whose surfaces have several optical sensitive areas and divided into individual package devices. The manufacture steps first involve providing a substrate with several chips whose surfaces have an optical sensitive area and bonding pads, and providing transparent layer whose surfaces have conductive circuits and scribe lines. Then the bonding pads bond to conductive circuits and a protection layer is formed on the chip to expose partly conductive circuits. Forming a conductive film on the protection layer and the conductive film contacts with the extending conductive circuits to form the wafer level package structure of optical-electronic device. At last, the transparent layer is diced according to scribe lines to form the individual package devices.

Abstract: A remote control method of tile display is disclosed for a tile display system, which contains a host computer, several projector modules, and a screen. The images produced by the projector modules are simultaneously displayed on the screen as a single image. The remote control method includes the steps of: obtaining setting parameters of each projector using a control program on the host computer via a network; storing the setting parameters of each projector in a storage module of the host computer; simultaneously generating a projector parameter table for each projector; updating the projector parameter table when the parameters of any projector are modified; generating a control message for the corresponding projector according to the new parameter table; transmitting the control message to the corresponding projector via the network; and converting the control message into one recognizable by the projector in order to make corresponding modifications.

Abstract: A wafer level package structure of optical-electronic device and method for making the same are disclosed. The wafer level package structure of optical-electronic device is provided by employing a substrate whose surfaces have several optical sensitive areas and divided into individual package devices. The manufacture steps first involve providing a substrate with several chips whose surfaces have an optical sensitive area and bonding pads, and providing transparent layer whose surfaces have conductive circuits and scribe lines. Then the bonding pads bond to conductive circuits and a protection layer is formed on the chip to expose partly conductive circuits. Forming a conductive film on the protection layer and the conductive film contacts with the extending conductive circuits to form the wafer level package structure of optical-electronic device. At last, the transparent layer is diced according to scribe lines to form the individual package devices.

Abstract: A remote control method of tile display is disclosed for a tile display system, which contains a host computer, several projector modules, and a screen. The images produced by the projector modules are simultaneously displayed on the screen as a single image. The remote control method includes the steps of: obtaining setting parameters of each projector using a control program on the host computer via a network; storing the setting parameters of each projector in a storage module of the host computer; simultaneously generating a projector parameter table for each projector; updating the projector parameter table when the parameters of any projector are modified; generating a control message for the corresponding projector according to the new parameter table; transmitting the control message to the corresponding projector via the network; and converting the control message into one recognizable by the projector in order to make corresponding modifications.

Abstract: An apparatus and a method for etching a plurality of glass panels are disclosed. The apparatus is constructed by mounting a panel holder in an etch tank equipped with a rotating means for rotating the panel holder during the etching process. The panel holder is adapted for receiving a plurality of glass and mounting the panels in a vertical position with at least two edges of the panels mounted in a plurality of tracks for protecting conductive elements formed on the edges of the panels and also for holding the panels securely during the rotation of the panel holder. The method for etching the panels can be carried about at a rotational speed between about 5 rpm and about 60 rpm in an etchant solution of a diluted acid such as HF having a concentration of at least 5 vol. %. A suitable immersing time for the plurality of glass panels in the diluted etchant for producing panels of smaller thicknesses is at least 3 min.