Abstract: An IC chip package and a chip-on-glass structure using the same are provided. The IC chip package includes an IC chip having a circuit surface, and plural copper (Cu) bumps formed on the circuit surface. Moreover, a non-conductive film (NCF) could be formed on the circuit surface to cover the Cu bumps. The chip-on-glass structure includes a glass substrate, plural electrodes such as aluminum (Al) electrodes formed on the glass substrate, and a conductive film formed on the electrodes. The conductive film contains a number of conductive particles. When the IC chip package is coupled to the glass substrate, the Cu bumps can be coupled to the corresponding electrodes via conductive particles.

Abstract: An integrated circuit device including a semiconductor substrate, a first bonding pad structure, a second bonding pad structure, and an internal bonding wire is provided. The first bonding pad structure is disposed on a surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The second bonding pad structure is disposed on the surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The first bonding pad structure is electrically coupled to the second bonding pad structure via the internal bonding wire. The integrated circuit device having a better electrical performance is provided by eliminating internal resistance drop in power supply trails or ground trails, and improving signal integrity of the integrated circuit device.

Abstract: An integrated circuit device including a substrate, a first internal bonding pad, a second internal bonding pad, an external bonding pad and a bonding wire is provided. A first circuit and a second circuit are embedded in the substrate. The first internal bonding pad is disposed on a surface of the substrate and electrically coupled to the first circuit. The second internal bonding pad is disposed on the surface of the substrate and electrically coupled to the second circuit. The second internal bonding pad is electrically coupled to the first internal bonding pad via the bonding wire. The external bonding pad is electrically coupled to the first internal bonding pad.

Abstract: A picture delivering system is disclosed including: a picture generating device for outputting a flat picture corresponding to an encrypted picture and for providing a picture ID corresponding to the encrypted picture; and a picture presenting device for utilizing an optical imaging device to capture an image of the flat picture to generate a captured picture, for obtaining the picture ID, and for transmitting the picture ID to the picture generating device. When the picture presenting device passed an entity identification procedure, the picture presenting device obtains a decryption information, processes the captured picture according to the decryption information to obtain a decrypted picture, and then utilizes a display device to display the decrypted picture. The decryption information comprises at least one of a seed key, a mask picture, and a transposition table corresponding to the picture ID.

Abstract: An integrated circuit device including a substrate, a first internal bonding pad, a second internal bonding pad, an external bonding pad and a bonding wire is provided. A first circuit and a second circuit are embedded in the substrate. The first internal bonding pad is disposed on a surface of the substrate and electrically coupled to the first circuit. The second internal bonding pad is disposed on the surface of the substrate and electrically coupled to the second circuit. The second internal bonding pad is electrically coupled to the first internal bonding pad via the bonding wire. The external bonding pad is electrically coupled to the first internal bonding pad.

Abstract: A chip-on-film device including a flexible circuit film having a wire, a passivation layer having a hole, an adhesive layer, a first pad, a second pad, an interconnection, and a bump is provided. A part of the adhesive layer is disposed in the hole. The first pad and the second pad are disposed under the passivation layer. A part of the interconnection is disposed under the passivation layer, and disposed between the first pad and the second pad. The bump is electrically connected to the first pad via the adhesive layer. The bump is welded on the wire. A part of a first part of the bump overlaps the first pad, a second part of the bump extends to an outside of the pad and at least partially overlaps the interconnection, and the third part of the bump overlaps the second pad.

Abstract: A dual-channel electronic signature system is disclosed, having a signature verification server, a signature requester device, and a hand-held device. The signature requester device calculates a characteristic value related to content of a target document, encodes the characteristic value and a destination message to generate a first graph, and outputs the first graph The hand-held device captures and decodes an image of the first graph to obtain the characteristic value, performs an electronic signature operation on the characteristic value to generate a signature data, encodes the signature data to generate a second graph, and transmits the second graph to a destination network address. If the signature data contained in the second graph passes a verification procedure of the signature verification server, the signature verification server transmits a verification graph corresponding to the second graph to the signature requester device.

Abstract: A picture delivering system is disclosed including: a picture generating device for outputting a flat picture corresponding to an encrypted picture and for providing a picture ID corresponding to the encrypted picture; and a picture presenting device for utilizing an optical imaging device to capture an image of the flat picture to generate a captured picture, for obtaining the picture ID, and for transmitting the picture ID to the picture generating device. When the picture presenting device passed an entity identification procedure, the picture presenting device obtains a decryption information, processes the captured picture according to the decryption information to obtain a decrypted picture, and then utilizes a display device to display the decrypted picture. The decryption information comprises at least one of a seed key, a mask picture, and a transposition table corresponding to the picture ID.

Abstract: An integrated circuit device including a substrate, a first internal bonding pad, a second internal bonding pad, an external bonding pad and a bonding wire is provided. A first circuit and a second circuit are embedded in the substrate. The first internal bonding pad is disposed on a surface of the substrate and electrically coupled to the first circuit. The second internal bonding pad is disposed on the surface of the substrate and electrically coupled to the second circuit. The second internal bonding pad is electrically coupled to the first internal bonding pad via the bonding wire. The external bonding pad is electrically coupled to the first internal bonding pad.

Abstract: An integrated circuit device including a substrate, a first internal bonding pad, a second internal bonding pad, an external bonding pad and a bonding wire is provided. A first circuit, a second circuit, at least one interconnect line and an electrostatic discharge protection circuit are embedded in the substrate. The first internal bonding pad is disposed on a surface of the substrate and electrically connected to the first circuit. The second internal bonding pad is disposed on the surface of the substrate and electrically connected to the second circuit. The first internal bonding pad is electrically connected to the second internal bonding pad via the bonding wire. The first internal bonding pad is electrically connected to the electrostatic discharge protection circuit via the interconnect line. The electrostatic discharge protection circuit is electrically connected to the external bonding pad which is used for electrically connecting an external package lead.

Abstract: A chip-on-film device including a flexible circuit film having a wire, a passivation layer having a hole, an adhesive layer, a pad, an interconnection, and a bump is provided. A part of the adhesive layer is disposed in the hole. The pad is disposed under the passivation layer, and a part of the pad is disposed under the hole. A part of the interconnection is disposed under the passivation layer, and disposed at a side of the pad, wherein the interconnection does not touch the pad. A part of the bump is disposed on the adhesive layer. The bump is electrically connected to the pad via the adhesive layer. The bump is welded on the wire. A part of a first part of the bump overlaps the pad, and a second part of the bump extends to an outside of the pad and at least partially overlaps the interconnection.

Abstract: An assembling mechanism of a self-locking linear actuator includes a gearbox, a one-piece rear retainer seat and a casing. The gearbox is composed of two half pieces, which are mated with each other for accommodating and locating a transmission mechanism of the actuator. The rear retainer seat is fixedly held in the gearbox for supporting a bearing of a threaded rod of the transmission mechanism and bearing the stress from the threaded rod. The contact faces of the rear retainer seat and the gearbox are regular polygonal to facilitate adjustment of fixing angle of the rear retainer seat. The casing is composed of two half casings, which are mated with each other to accommodate the transmission mechanism, the gearbox and the rear retainer seat. The mating faces of the half casings are parallel to the axis of the output shaft of a motor to facilitate connection operation of the casing.

Abstract: An electronic signature verification method implemented by SKI infrastructure adopts a secret key infrastructure (SKI) system for registering a secret key and issuing a signature key and a verification key. After a signer has completed a signature, a signature data, a verification data and a verification key encrypted by the secret key of a signature verification unit are sent to a recipient. After the recipient has received the data, a user needs to send the verification data and the encrypted verification key to a signature verification unit if the user wants to confirm the signature on the signature data. The signature verification unit uses a secret key authorized by the SKI for the decryption to obtain the verification key and uses the verification key to verify the verification data and confirm the existence of the signature of the signature data, so as to authenticate the signature of the signature data.

Abstract: A semiconductor package for a stacked chip includes a first semiconductor chip, comprising a metal layer; a through-silicon-via, penetrating a top surface of the first semiconductor chip and electrically connected to the metal layer; a redistribution layer, formed on the top surface of the first semiconductor chip, and electrically connected to the through-silicon-via; and a second semiconductor chip, disposed on the first semiconductor chip and electrically connected to the first semiconductor chip via the redistribution layer.

Abstract: A chip package including a lead frame, a heat sink, a chip and a molding compound is provided. The lead frame includes a chip pad and a plurality of leads, wherein the chip pad has a first surface and a second surface opposite thereto. The heat sink has a third surface and a fourth surface opposite thereto, wherein the lead frame is disposed on the third surface of the heat sink through the second surface of the chip pad, and the fourth surface of the heat sink is exposed. The chip is disposed on the first surface of the chip pad and electrically connected to each of the chip pad and the leads. The molding compound encapsulates the chip, the chip pad, the heat sink and a portion of each of the leads.

Abstract: A mobile communication device is disclosed, having a wireless communication interface, a challenge-response module, and a decryption module. The wireless communication interface is used to receive an encrypted electronic file and a challenge value. The challenge-response module is used to generate a response value according to the challenge value and a challenge-response generating algorithm. The decryption module is used to decrypt the encrypted electronic file with the response value. The decryption module may decrypt the encrypted electronic file when the response value generated according to the challenge value and the challenge-response generating algorithm matches the one used to encrypt the electronic file.

Abstract: An integrated circuit device including a substrate, a first internal bonding pad, a second internal bonding pad, an external bonding pad and a bonding wire is provided. A first circuit, a second circuit, at least one interconnect line and an electrostatic discharge protection circuit are embedded in the substrate. The first internal bonding pad is disposed on a surface of the substrate and electrically connected to the first circuit. The second internal bonding pad is disposed on the surface of the substrate and electrically connected to the second circuit. The first internal bonding pad is electrically connected to the second internal bonding pad via the bonding wire. The first internal bonding pad is electrically connected to the electrostatic discharge protection circuit via the interconnect line. The electrostatic discharge protection circuit is electrically connected to the external bonding pad which is used for electrically connecting an external package lead.

Abstract: A secure locking mechanism for pushbutton control box, including a box body and a locking mechanism. The locking mechanism includes several secure locking switches and multiple rotary buttons. The secure locking switches are arranged on a controlling circuit board and serially connected with corresponding control switches disposed thereon. The secure locking switches are movable between an ON position and an OFF position to control electronic signal transmission of the control switches. Each rotary button has a locking body eccentrically disposed on an end face of the rotary button for controlling making/breaking of the secure locking switch. An operator can operate the rotary buttons from outer side of the box body to ensure security. By means of varying the type of serial connection, each secure locking switch can flexibly control electronic signal transmission of one single control switch or plural or even all control switches of the pushbutton control box.

Abstract: An assembling mechanism of a self-locking linear actuator includes a gearbox, a one-piece rear retainer seat and a casing. The gearbox is composed of two half pieces, which are mated with each other for accommodating and locating a transmission mechanism of the actuator. The rear retainer seat is fixedly held in the gearbox for supporting a bearing of a threaded rod of the transmission mechanism and bearing the stress from the threaded rod. The contact faces of the rear retainer seat and the gearbox are regular polygonal to facilitate adjustment of fixing angle of the rear retainer seat. The casing is composed of two half casings, which are mated with each other to accommodate the transmission mechanism, the gearbox and the rear retainer seat. The mating faces of the half casings are parallel to the axis of the output shaft of a motor to facilitate connection operation of the casing.

Abstract: A chip package and a process thereof are provided. The chip package includes a lead frame, a heat sink, a chip and a molding compound. The lead frame includes a chip pad and a plurality of leads, wherein the chip pad has a first surface and a second surface opposite thereto. The heat sink has a third surface and a fourth surface opposite thereto, wherein the lead frame is disposed on the third surface of the heat sink through the second surface of the chip pad, and the fourth surface of the heat sink is exposed. The chip is disposed on the first surface of the chip pad and electrically connected to each of the chip pad and the leads. The molding compound encapsulates the chip, the chip pad, the heat sink and a portion of each of the leads.