Abstract: Automated swivel seat and control method thereof are provided. Automated swivel seat comprising a base part fixed to a lower frame of the vehicle and comprising a first through hole formed in a central part thereof, a seat support part fixed to a lower side of a seat frame and configured to rotate on the base part, a swivel structure disposed between the base part and the seat support part and comprising an upper swivel plate coupled to the seat support part and a lower coupling plate coupled to the base part, a first gear coupled to one side of the upper swivel plate, a second gear engage with the first gear, a motor part configured to provide power to the second gear, a sensor part configured to generate gear measurement values comprising a rotation direction and a rotation angle of the seat support part.

Abstract: In a method for inspecting pattern defects, a plurality of patterns are formed over an underlying layer. The plurality of patterns are electrically isolated from each other. A part of the plurality of patterns are scanned with an electron beam to charge the plurality of patterns. An intensity of secondary electrons emitted from the scanned part of the plurality of patterns is obtained. One or more of the plurality of patterns that show an intensity of the secondary electrons different from others of the plurality of patterns are searched.

Abstract: A device is disclosed and includes an input stage circuit, a switching circuit, and a first latch circuit. The input stage circuit generates a first input signal having a first voltage and a second input signal based on a third input signal. The switching circuit operates in response to a first control signal, and adjusts a voltage level of a first data line according to the first input signal and a voltage level of a second data line according to the second input signal. The first latch circuit is coupled to the switching circuit by the first data line and the second data line. The first latch circuit latches a data in response to the first control signal and a second control signal, and adjusts the voltage level of the first data line based on a second voltage different from the first voltage.

Abstract: A semiconductor device includes a first fin and a second fin in a first direction and aligned in the first direction over a substrate, an isolation insulating layer disposed around lower portions of the first and second fins, a first gate electrode extending in a second direction crossing the first direction and a spacer dummy gate layer, and a source/drain epitaxial layer in a source/drain space in the first fin. The source/drain epitaxial layer is adjacent to the first gate electrode and the spacer dummy gate layer with gate sidewall spacers disposed therebetween, and the spacer dummy gate layer includes one selected from the group consisting of silicon nitride, silicon oxynitride, silicon carbon nitride, and silicon carbon oxynitride.

Abstract: Semiconductor structures and methods of fabrication are provided. A method according to the present disclosure includes receiving a workpiece that includes an active region over a substrate and having first semiconductor layers interleaved by second semiconductor layers, and a dummy gate stack over a channel region of the active region, etching source/drain regions of the active region to form source/drain trenches that expose sidewalls of the active region, selectively and partially etching second semiconductor layers to form inner spacer recesses, forming inner spacer features in the inner spacer recesses, forming channel extension features on exposed sidewalls of the first semiconductor layers, forming source/drain features over the source/drain trenches, removing the dummy gate stack, selectively removing the second semiconductor layers to form nanostructures in the channel region, forming a gate structure to wrap around each of the nanostructures. The channel extension features include undoped silicon.

Abstract: A stacked multi-chip electronic assembly with an electronic component sub-assembly. having components, including a conductive top clip, first and second semiconductor chips, and a conductive bottom clip assembled in a stacked arrangement. Solder layers are located between facing contact surfaces of the components in the stacked arrangement. Once soldered together, this forms the electronic component sub-assembly. A polymer layer extends between the conductive top clip and the conductive bottom clip encapsulating sides of the first and second semiconductor chips and the solder layers. This polymer layer protects and/or seals exposed chip surfaces to inhibit mechanical damage from further processes, and protects the chip passivation surface(s) from ionic contamination that may be introduced from further assembly processes.

Abstract: A hydrogen storage-compression system has a hydrogen storage-compression apparatus and a thermal management system. The apparatus includes a casing and a plurality of storage-compression units mounted within an internal chamber of the casing. Each storage-compression unit includes a container and a metal hydride for hydrogen storage-compression contained within the container. The storage-compression containers are interconnected by a hydrogen gas circuit flow system to a hydrogen inlet and outlet for connection to a hydrogen consumer and a hydrogen source. The thermal management system includes a thermal liquid circuit system and a heat exchanger system. The circuit system includes a closed loop thermal liquid flow circuit, a thermal liquid flowing within the flow circuit, and a pump for pumping the thermal liquid in the flow circuit.

Abstract: An aluminum alloy-plated steel sheet having excellent workability and corrosion resistance and a method for manufacturing the same are disclosed. The aluminum alloy-plated steel sheet includes a base sheet, and an alloy-plated layer formed on the base sheet. Interfacial roughness between the alloy-plated layer and the base steel sheet is 25 ?m or less. Such an aluminum alloy-plated steel sheet prevents microcracks generated during hot forming and has excellent seizure resistance and corrosion resistance. A method for manufacturing such an aluminum alloy-plated steel is also disclosed.

Abstract: An exemplary method for forming a gate stack of a multigate device includes forming a gate dielectric over a channel layer and forming a gate electrode over the gate dielectric. Forming the gate electrode includes forming a work function layer over the gate dielectric and forming a cap over the work function layer. Forming the cap includes forming a metal nitride layer over the work function layer and forming a silicon-comprising layer over the metal nitride layer. Forming the gate electrode includes forming a fluorine-free tungsten layer over the silicon-comprising layer of the cap without breaking vacuum. Forming the fluorine-free tungsten layer over the silicon-comprising layer includes co-flowing a tungsten-comprising precursor (e.g., WCl5) and a hydrogen-comprising precursor (e.g., H2).

Abstract: A memory circuit includes a first and a second bit line coupled to a set of memory cells, a local input output circuit including a first and a second data line, a first control circuit configured to generate a first sense amplifier signal and a second sense amplifier signal, a second control circuit configured to generate a first control signal in response to at least a second control signal or a third control signal, a switching circuit configured to transfer a first and second input signal to the corresponding first and second data line during a write operation, and to electrically isolate the first and second data line from the first and second input signal during a read operation, and a first latch configured as a sense amplifier, during the read operation, and configured as a write-in latch, during the write operation.

Abstract: A semiconductor structure includes a first transistor and a second transistor. The first transistor includes a first fin structure and a first metal gate over the first fin structure. The first metal gate includes a first work function metal layer and a first gap-filling metal layer. The second transistor includes a second fin structure and a second metal gate over the second fin structure. The second metal gate includes a second work function metal layer and a second gap-filling metal layer. The first metal gate and the second metal gate provide a same work function. A width of the first metal gate is equal to a width of the second metal gate. A width of a top surface of the first gap-filling metal layer is greater than a width of a top surface of the second gap-filling metal layer.

Abstract: An image capturing device and a zooming method for a depth-of-field image thereof are disclosed. The method is adapted to the image capturing device including a first lens module and a second lens module, and includes the following steps. In response to a photographing instruction, a first image and a second image are acquired respectively by using the first lens module and the second lens module. A digital zoom processing is respectively performed on the first image and the second image to generate a first zooming image and a second zooming image. A depth-of-field composite processing is performed according to the first zooming image and the second zooming image to generate a zooming depth-of-field image. The zooming depth-of-field image is recorded in a photo gallery.

Abstract: A mobile electronic device and an operation interface adjustment method thereof are provided. The method is adapted to the mobile electronic device including a touch screen and includes the following steps. An application (app) is launched. A handedness status is determined. A display position of each of a plurality of control options in an operation interface of the app is determined according to the handedness status and a frequency of use of each of the control options of the app. The operation interface including the control options is displayed via a touch screen according to the display position of each of the control options in the operation interface.

Abstract: A touch display device includes a plurality of light emitting elements arranged on a substrate, an encapsulation layer arranged on the light emitting elements, a plurality of first touch electrodes arranged on the encapsulation layer, and a plurality of second touch electrodes arranged on the encapsulation layer and spaced apart from and adjacent to the first touch electrodes. At least one of the first touch electrodes may include a plurality of first protrusions extending in a first direction. At least one of the second touch electrodes may include a plurality of second protrusions extending in a second direction opposite the first direction. One of the first protrusions and another of the first protrusions adjacent to the one of the first protrusions may have different lengths from each other in the first direction.

Abstract: A touch display device has an inspection process and a repair process that may be easily performed. The touch display device includes first and second touch electrodes spaced apart from each other and a dummy conductive layer spaced apart from at least one of the first touch electrodes and the second touch electrodes, and is characterized in that the shape of at least one of the first touch electrodes and the second touch electrodes arranged in first boundary areas is different from the shape of at least one of the first touch electrodes, the second touch electrodes and the dummy conductive layer arranged in second boundary areas, thereby rapidly detecting the position of a defect and improving efficiency of inspection and repair processes.

Abstract: A camera module includes a housing, a first lens module configured to be movable in a first direction of the housing, a second lens module configured to be movable in the first direction, a first magnet disposed on the first lens module, a first yoke member disposed on the housing so as to face a first side surface of the first magnet and configured to limit a movement position of the first lens module with respect to the housing, and a second yoke member disposed on the second lens module so as to face a second side surface of the first magnet and configured to limit a movement position of the second lens module with respect to the first lens module.

Abstract: A photosensitive resin composition includes an additive; a binder resin; a photopolymerizable compound; a photopolymerization initiator; a colorant; and a solvent, wherein the additive includes a leveling agent, and the leveling agent is included in an amount of about 15 ppm to about 30 ppm, based on a total amount of the photosensitive resin composition.

Abstract: An exogenous biomolecular tracing method includes: extracting a nucleotide marker from a marker source organism; combining a basic material with the nucleotide marker to form a nucleotide marked material; exogenously combining an aquatic creature or an aquatic product to form an exogenously-marked aquatic creature or an exogenously-marked aquatic product; and identifying a DNA sample from the exogenously-marked aquatic creature or the exogenously-marked aquatic product with at least one primer pair in an exogenous biomolecular tracing procedure to obtain an exogenously-marked identification result.

Abstract: Provided are a connector and a manufacturing method thereof. The connector is configured to dispose on a circuit board including a mounting hole. The connector includes a guide pin module and a conductive cover. The guide pin module is located on one side of the circuit board and includes a base, a metal guide pin, and a glass sealing layer. The base has a perforation hole corresponding to the mounting hole. The metal guide pin is inserted into the perforation hole and the mounting hole. The glass sealing layer is disposed at the perforation hole and wraps around part of the metal guide pin. The conductive cover is disposed at the mounting hole, connected to the top of the metal guide pin, and protrudes from the circuit board. The conductive cover is bonded to the circuit board by soldering to electrically connect the metal guide pin to the circuit board.

Abstract: In an embodiment, a server computer (“server”) identifies planting datasets of planting data values that correspond to separate planting passes in a field and harvesting datasets of harvesting data values that correspond to separate harvesting passes in the field, each planting data value and each harvesting data value including a location value. The server normalizes the planting datasets based on a heading direction of a first agricultural equipment, a row-unit shift of the first agricultural equipment, or a direct measurement of a first measurement device value. The server also normalizes the harvesting datasets based on a heading direction of a second agricultural equipment, a row-unit shift of the second agricultural equipment, or a direct measurement of a second measurement device value.