Abstract: A clock control method for a High Definition Multimedia Interface (HDMI) receiver operating in a power-saving mode in a sink device is provided. The HDMI receiver has a first module, a second module, and a third module. The clock control method includes the following stages. A clock signal is enabled to be sent to the first module and the third module during a first region of received data. The clock signal is disabled to be sent to the second module during the first region of the received data. The clock signal is enabled to be sent to the third module and the clock signal is disabled to be sent to the first module and the second module during a second region of the received data.

Abstract: Semiconductor devices and methods of manufacturing are provided. In some embodiments the method includes depositing an etch stop layer over a first hard mask material, the first hard mask material over a gate stack, depositing an interlayer dielectric over the etch stop layer, forming a first opening through the interlayer dielectric, the etch stop layer, and the first hard mask material, the first opening exposing a conductive portion of the gate stack, and treating sidewalls of the first opening with a first dopant to form a first treated region within the interlayer dielectric, a second treated region within the etch stop layer, a third treated region within the first hard mask material, and a fourth treated region within the conductive portion, wherein after the treating the fourth treated region has a higher concentration of the first dopant than the first treated region.

Abstract: A wafer treatment system is provided. The wafer treatment system includes a wafer treatment chamber defining a treatment area within which a wafer is treated. The wafer treatment system includes a gas injection system. The gas injection system includes a gas injector configured to inject a first gas, used for treatment of the wafer, into the treatment area. A first gas tube is configured to conduct the first gas at a first temperature to the gas injector. The gas injection system includes a heating enclosure enclosing the gas injector. A second gas tube is configured to conduct a heated gas to the heating enclosure to increase an enclosure temperature at the heating enclosure to a second enclosure temperature. A temperature of the first gas is increased in the gas injector from the first temperature to a second temperature due to the second enclosure temperature at the heating enclosure.

Abstract: A barrier layer is formed in a portion of a thickness of sidewalls in a recess prior to formation of an interconnect structure in the recess. The barrier layer is formed in the portion of the thickness of the sidewalls by a plasma-based deposition operation, in which a precursor reacts with a silicon-rich surface to form the barrier layer. The barrier layer is formed in the portion of the thickness of the sidewalls in that the precursor consumes a portion of the silicon-rich surface of the sidewalls as a result of the plasma treatment. This enables the barrier layer to be formed in a manner in which the cross-sectional width reduction in the recess from the barrier layer is minimized while enabling the barrier layer to be used to promote adhesion in the recess.

Abstract: A semiconductor package structure includes a first component, a bonding structure on the first component, a second component connected to the first component, and a copper connector on the second component. The bonding structure includes a copper base on the first component and copper protruding portions on the copper base. The second component is connected to the first component by bonding the copper protruding portions to the copper connector, and the copper protruding portions are in contact with the copper connector.

Abstract: A method comprises forming a first conductive line and a second conductive line in a first dielectric layer over a substrate, each having a planar top surface, applying an etch-back process to the first dielectric layer until a dielectric portion between the first conductive line and the second conductive line has been removed, and the first conductive line and the second conductive line have respective cross sectional shapes including a rounded surface and two rounded corners and depositing a second dielectric layer over the substrate, while leaving a first air gap between the first conductive line and the second conductive line.

Abstract: A container data center includes a container, an air duct, and a connecting member. The container is received in a room. The container defines an air inlet and an air outlet away from the air inlet. The air duct extends through a sidewall of the room. A first side of the connecting member is detachably connected to the air inlet of the container, and a second side of the connecting member is connected to the air duct. Air outside the room enters the air duct, flows through the connecting member, enters the container through the air inlet, and flows out of the container through the air outlet.

Abstract: A container data center includes a container, a cooling room defined in the container, and a cabinet receiving a server. The cabinet includes a fan module opposite to the cooling room. An opening is defined in the cabinet. A box is attached to the cabinet. The box defines an inlet. A blocking plate is pivotably attached to the box to cover or uncover the inlet. An air plate is pivotably attached to the cabinet to cover or uncover the opening. When the server is moved into the cabinet through the inlet, the server pushes the corresponding blocking plate and the corresponding air plate to rotate. When the cabinet operates, the fan module operates to exhaust hot air from the cabinet, the cabinet then becomes negative pressure rooms to let the cooling air enter the cooling room through the inlet and the opening.

Abstract: A heat dissipation system for cooling a cabinet server with an outlet and an inlet includes an outlet pipe connected to the outlet, an inlet pipe connected to the inlet, a pump apparatus located between the outlet pipe and the inlet pipe, a first heat dissipation apparatus, a second heat dissipation apparatus, and a valve. The first and second heat dissipation apparatus are connected between the outlet pipe and the pump apparatus in parallel. The first valve apparatus includes a first end connected to the outlet pipe, a second end connected to the first heat dissipation apparatus, and a third end connected to the second heat dissipation apparatus. The first end of the valve is operable to be connected to either the second end or the third end.

Abstract: A heat dissipation system for a number of cabinets mounted in a container includes a first heat dissipation apparatus, a second heat dissipation apparatus including a condenser, an inlet pipe assembly connected to the cabinets, an outlet pipe assembly connected to the cabinets, a connecting pipe connected between the inlet pipe assembly and the outlet pipe assembly, a extension pipe connected between the connecting pipe and the inlet pipe assembly, a first valve connected to the connecting pipe and located between the first dissipation apparatus and the second dissipation apparatus, a second valve connected to the extension pipe, a number of temperature sensors installed in the cabinets, and a controller electrically coupled to the temperature sensors, the first valve, the second valve, and the condenser. The controller controls the first valve, the second valve, and the condenser to turn on or off according to temperature sensed by the temperature sensors.

Abstract: An electronic device includes a housing defining an opening, a circuit board mounted in the housing, and a cover capable of conducting heat and covering the opening. An element and a hollow partition portion receiving the element are mounted on the circuit board. The cover includes a block formed on an inner surface of the cover. The block enters the partition portion and contacts the element.

Abstract: A container data center system includes a container, a plurality of servers, at least a regulation device, a first refrigeration device and a second refrigeration device. The container defines a first receiving room and a second receiving room isolated from the first receiving room. The servers are received in the first receiving room. The at least a regulation device is received in second receiving room. The at least regulation device is electrically connected to the servers for regulating the servers. The first refrigeration device is installed outside the container for cooling the first receiving room. The second refrigeration device is installed outside the container for cooling the second receiving room.

Abstract: A heat sink includes a base and a number of fins mounted parallelly on the base. Each fin defines a number of vents, and two heat dissipating pieces protrude from opposite sides of each vent. The heat dissipating pieces of each vent cooperatively bounds an opening communicating with the corresponding vent. The number of openings of each fin is aligned with the number of openings of the other fins. The aligned openings of the number of fins cooperatively define a number of first air channels perpendicular to the number of fins. The number of heat dissipating pieces bound a number of second air channels parallel to the number of fins.

Abstract: A chassis includes a bottom plate, a number of fans mounted to the bottom plate, an air guiding member mounted to the bottom plate and near the fans, and a number of data storage devices received in the air guiding member. The air guiding member includes a top plate and a partition plate below the top plate. The partition plate is near the fans. The partition plate divides the air guiding member into a first aisle below the partition plate and a second aisle above the partition plate. The top plate and the partition plate bound an opening. The data storage devices are located below the partition plate. A part of airflow from the fans flows into the first aisle; another part of airflow from the fans flows through the second aisle and the opening, and flows toward the data storage devices away from the fans.

Abstract: An air guiding device includes two opposite first air guiding apparatus and a second air guiding apparatus mounted on tops of the first air guiding apparatus. Each first air guiding apparatus includes a stretchable first guiding piece. The second air guiding apparatus includes a stretchable second guiding piece. Distal ends of the first and second air guiding pieces are pulled out toward the same direction, the first and second guiding pieces cooperatively bound an airflow channel.

Abstract: A container data center includes a container, an air duct, and a connecting member. The container is received in a room. The container defines an air inlet and an air outlet away from the air inlet. The air duct extends through a sidewall of the room. A first side of the connecting member is detachably connected to the air inlet of the container, and a second side of the connecting member is connected to the air duct. Air outside the room enters the air duct, flows through the connecting member, enters the container through the air inlet, and flows out of the container through the air outlet.

Abstract: A cooling system includes a room, a container data center, and an air duct. The room includes a floor, and defines a receiving space above the floor, and a heat-dissipation space below the floor. The container data center is supported on the floor. The container data center includes a container. The container includes an end wall defining a number of air inlets and a sidewall defining a number of air outlets. The air duct defines a number of vents and an opening communicating with the vents. The air duct is installed to an outer surface of the sidewall, and the vents are aligning with air outlets of the sidewall. The floor defines a number of through holes communicating with the opening of the air duct and the heat-dissipation space.

Abstract: A cooling system includes a first group of fans, a second group of fans, and an air conducting cover. The air conducting cover includes a first partition, a second partition, a third partition. The first partition is connected between the second partition and the third partition to define a first space, a second space and a third space. Wherein the first group of fans directs air flow to enter the first space and the second space, the second group of fans directs air flow to enter the third space.

Abstract: A container data center includes a container, a cooling room defined in the container, and a cabinet receiving a server. The cabinet includes a fan module opposite to the cooling room. An opening is defined in the cabinet. A box is attached to the cabinet. The box defines an inlet. A blocking plate is pivotably attached to the box to cover or uncover the inlet. An air plate is pivotably attached to the cabinet to cover or uncover the opening. When the server is moved into the cabinet through the inlet, the server pushes the corresponding blocking plate and the corresponding air plate to rotate. When the cabinet operates, the fan module operates to exhaust hot air from the cabinet, the cabinet then becomes negative pressure rooms to let the cooling air enter the cooling room through the inlet and the opening.

Abstract: An electronic device includes a chassis, a number of fans arranged in the chassis, a fan bracket, and two locking members. The chassis includes a base and a cover. The base includes a bottom wall supporting the fans and two sidewalls extending from two opposite sides of the bottom. A block extends from each sidewall and aligns with the fans. The cover defines an opening aligned with the fans. The fan bracket includes a covering plate and two mounting plates extending down from a bottom of the covering plate. The fans are sandwiched between the mounting plates. Two cutouts are defined in opposite ends of the covering plate. The locking members are inserted in the corresponding cutouts, to be locked to the blocks of the corresponding sidewalls.