Abstract: A heat dissipation device for dissipating heat from an electronic component, includes two heat dissipating boards attached to two opposite lateral sides of the electronic component, respectively, and an elastic member securing the heat dissipating boards on the electronic component. Each of the heat dissipating boards includes a heat absorbing body, two heat dissipating arms extending upwardly from the heat absorbing body, and a plurality of fins extending outwardly from each of the heat dissipating arms.

Abstract: A container data center system includes a plurality of container data centers and a dissipation system. Each container data center includes a container and a number of servers arranged in the container. The containers of the container data centers communicate with each other. The heat dissipation system includes a refrigerating device configured for generating cooling air to one of the containers.

Abstract: A modular data center includes a container and a heat-dissipating control system. The container defines an opening with a cover rotatably mounted to the container to cover or uncover the opening when needed to assist in dissipating heat. The heat-dissipating control system includes a temperature sensor, a comparison unit, and a driving device. The temperature sensor is used to sense a temperature in the container, and output a sensed temperature value. The comparison unit is used to receive the sensed temperature value, and compare the sensed temperature value with a first predetermined temperature value. When the sensed temperature value is greater than or equal to the first predetermined temperature value, the comparison unit outputs a control signal. The driving device is used to open the cover to expose the opening after receiving the first control signal.

Abstract: An internet-protocol camera device includes a lens module and an image pickup module. The lens module guides light to the image pickup module. The image pickup module includes a metal housing, heat generating electronic devices received in the metal housing, heat sinks received in the metal housing, and heat dissipation plates. The metal housing includes a first inner side surface, a second inner side surface, a third inner side surface and a fourth inner side surface connected end-to-end in that order. The first inner side surface faces the third inner side surface. The second inner side surface faces the fourth inner side surface. The heat sinks are mounted on the corresponding heat generating electronic devices. The heat dissipation plates are mounted on the first inner side surface, the second inner side surface, the third inner side surface and the fourth inner side surface.

Abstract: A printed circuit board includes a heat sink and a circuit board. The heat sink defines two fixing blind holes respectively arranged on adjacent opposite ends of the heat sink. The circuit board includes a heat-generating component and two fixing elements corresponding to the fixing blind holes. Each fixing elements includes a fixing portion fixed on the circuit board, a locking portion, and an elastic portion extending from a first end of the locking portion to be connected to the fixing portion. A second end of the locking portion of each fixing element is inserted into a corresponding fixing blind hole, to fix the heat sink on the heat-generating component.

Abstract: A heat dissipation module includes a heat-absorbing unit, a first heat pipe, a second heat pipe, and a heat-dissipating unit. The heat-absorbing unit is adapted to contact the heat source thermally. The first heat pipe has a first heat-absorbing section being connected to the heat-absorbing unit and a first heat-dissipating section. The second heat pipe has a second heat-absorbing section being connected to the heat-absorbing unit and a second heat-dissipating section. The heat-dissipating unit includes a first fin assembly and a second fin assembly. The first heat-dissipating section is connected to the first fin assembly along a first extending direction, the second heat-dissipating section is connected to the second fin assembly along a second extending direction, the first extending direction and second extending direction are oblique to each other, and a part of the first fin assembly and a part of the second fin assembly are inset to each other.

Abstract: An optoelectronic semiconductor package for packaging a heat source capable of emitting light includes a base, a seal member, and a plurality of heat-dissipation elements. The base carries and touches the heat source and has a plurality of openings formed thereon, and the seal member is used to seal the heat source on the base. Each of the heat-dissipation elements is inserted in one of the corresponding openings, and the heat-dissipation element placed in the corresponding opening is deformed to result in a tight coupling between the heat-dissipation element and the base.

Abstract: An illumination module including a first light-emitting element, a first heat dissipation element, a first heat conducting unit, a second light-emitting element, a second heat dissipation element, and a second heat conducting unit is provided. The first light-emitting element is capable of emitting a first color light beam. The first heat conducting unit is connected between the first light-emitting element and the first heat dissipation element. The second light-emitting element is capable of emitting a second color light beam. The second heat conducting unit is connected between the second light-emitting element and the second heat dissipation element. The first heat dissipation element and the second heat dissipation element are disposed separately. The first heat conducting unit and the second heat conducting unit are also disposed separately. The heat dissipation characteristic of the illumination module is better. A projection apparatus having the illumination module is also provided.

Abstract: An optoelectronic semiconductor package for packaging a heat source capable of emitting light includes a base, a seal member, and a plurality of heat-dissipation elements. The base carries and touches the heat source and has a plurality of openings formed thereon, and the seal member is used to seal the heat source on the base. Each of the heat-dissipation elements is inserted in one of the corresponding openings, and the heat-dissipation element placed in the corresponding opening is deformed to result in a tight coupling between the heat-dissipation element and the base.

Abstract: An illumination module including a first light-emitting element, a first heat dissipation element, a first heat conducting unit, a second light-emitting element, a second heat dissipation element, and a second heat conducting unit is provided. The first light-emitting element is capable of emitting a first color light beam. The first heat conducting unit is connected between the first light-emitting element and the first heat dissipation element. The second light-emitting element is capable of emitting a second color light beam. The second heat conducting unit is connected between the second light-emitting element and the second heat dissipation element. The first heat dissipation element and the second heat dissipation element are disposed separately. The first heat conducting unit and the second heat conducting unit are also disposed separately. The heat dissipation characteristic of the illumination module is better. A projection apparatus having the illumination module is also provided.

Abstract: A entertainment robot includes a recognition unit, an environment detecting unit, an intelligent unit, and a behavior unit. The recognition unit receives an input signal from a user and outputs a corresponding command signal. The environment detecting unit detects background information and outputs a corresponding environment signal. The intelligent unit outputs a corresponding behavior signal based on the command signal and the environment signal. The behavior unit controls the operation of the entertainment robot based on the behavior signal.

Abstract: A transmission line that is plugged and unplugged includes a wire and at least one socket connecting to one end of the wire. The socket is connected to an electronic device and coupled with a force applying member. The force applying member rams the electronic device when subject to a force to facilitate separation of the socket and the electronic device. The force applying member is hinged on the socket and is divided by the hinged location to form a force applying portion and a pressing portion. When the force applying portion receives the force, the pressing portion generates a counter force about the hinged location against the electronic device to make the socket to be removed from the electronic device.

Abstract: A transmission line that is plugged and unplugged includes a wire and at least one socket connecting to one end of the wire. The socket is connected to an electronic device and coupled with a force applying member. The force applying member rams the electronic device when subject to a force to facilitate separation of the socket and the electronic device. The force applying member is hinged on the socket and is divided by the hinged location to form a force applying portion and a pressing portion. When the force applying portion receives the force, the pressing portion generates a counter force about the hinged location against the electronic device to make the socket to be removed from the electronic device.