Abstract: A power converter includes a case including an outlet with an outlet opening in a principal surface thereof, and a wiring member having, as an external connection portion, a portion that extends out from the outlet opening and is bent at the outlet opening toward the principal surface. The external connection portion of the wiring member has a first surface facing the principal surface and includes a spacer provided on the first surface at a position adjacent to the outlet opening. The spacer is sandwiched between the first surface of the drawn-out portion and the principal surface of the case.

Abstract: A semiconductor device includes a first insulated circuit board that is rectangular with first to fourth sides, including a first input wiring board and a first output wiring board each extending in a first direction parallel to the first side and being adjacent to each other. The first output wiring board includes a first output region electrically connected to a first output terminal and a first connection wiring region electrically connected to the output electrodes of the plurality of first semiconductor chips and being closer to the second side than is the first output region. The first connection wiring region has a first slit extending in the first direction from an end of the first connection wiring region at a side thereof where the first output region is located.

Abstract: A semiconductor unit includes a plurality of semiconductor chips, and an insulated circuit board including an insulating plate having, in a plan view of the semiconductor unit, a rectangular shape surrounded by first and second sides opposite to each other and third and fourth sides perpendicular to the first and second sides and opposite to each other, an output circuit pattern and an input circuit pattern on a front surface of the insulating plate. The output and input circuit patterns each extend from the third side to the fourth side, and disposed in this order side by side in a main current direction that is a direction from the first side toward the second side. The plurality of semiconductor chips are bonded to the input circuit pattern at an area extending from the third side to the fourth side and including a center of the third and fourth sides.

Abstract: A semiconductor device includes first and second conductive parts, a first bonding wire connecting the first and second conductive parts and having a non-flat portion between opposite ends thereof so that a portion between the opposite ends is away from the first and second conductive parts, a case having a housing space to accommodate the first and second conductive parts, including a sidewall having first to fourth lateral faces surrounding the housing space to form a rectangular shape in a plan view, and a cover disposed on the sidewall, a sealing member filling the case to seal the first bonding wire, and a first stress relaxer for relieving a stress in the first bonding wire. The first bonding wire extends from the second lateral face toward the fourth lateral face, and the first stress relaxer is positioned between the first bonding wire and the first lateral face.

Abstract: A semiconductor device includes a semiconductor chip, an insulated circuit substrate including an insulating board and a circuit pattern on the insulating board electrically connected to the semiconductor chip, and a wiring member having a leg portion bonded to the circuit pattern. The leg portion includes a vertical portion, a first divided portion, and a second divided portion. The vertical portion extends in a vertical direction orthogonal to a plane of the circuit pattern, and has a split end provided at a side of the vertical portion at which the circuit pattern is disposed. The first divided portion extends from the split end in a first direction parallel to the plane of the circuit pattern and is bonded to the circuit pattern. The second divided portion extends from the split end in a second direction opposite the first direction and is bonded to the circuit pattern.

Abstract: A semiconductor module is provided with a semiconductor element, a case housing the semiconductor element, and an external terminal that electrically connects a main electrode of the semiconductor element to an external conductor. The external terminal projects out from a top face of the case and is bent at a right angle along the top face of the case. The case includes a protruding part that projects in a projection direction to a predetermined height above the top face of the case, and acts as a fulcrum for bending the external terminal, the protruding part having a slit that extends in a direction intersecting the projection direction to divide the protruding part.

Abstract: A main ceramic circuit board on which a semiconductor element is arranged is separate from a sub-ceramic circuit board on which a connection terminal is arranged. Accordingly, heat generated by the semiconductor element is conducted via the main ceramic circuit board and a base plate arranged thereunder and the sub-ceramic circuit board to the connection terminal. That is to say, it is difficult to conduct heat from the semiconductor element to the connection terminal, compared with a case where the connection terminal and the semiconductor element are arranged over the same ceramic circuit board.

Abstract: In a semiconductor device, the marginal edge of a resist member on the side closer to a substrate is between first and third positions on a metal base plate. The third position is directly under an outer side surface of a metal plate. The first position is outside the third position and is away from a second position on the metal base plate directly under an outer side surface of the electrical insulating board, by a distance calculated by dividing “the height from a principal surface of the metal base plate to the front surface of the electrical insulating board” by “the tangent of the contact angle of solder created by the marginal edge stopping solder flow”. This makes it possible to ensure sufficient insulation distances between conductive patterns and the solder and to reduce creepage distances of the conductive patterns over the electrical insulating board.

Abstract: A main ceramic circuit board on which a semiconductor element is arranged is separate from a sub-ceramic circuit board on which a connection terminal is arranged. Accordingly, heat generated by the semiconductor element is conducted via the main ceramic circuit board and a base plate arranged thereunder and the sub-ceramic circuit board to the connection terminal. That is to say, it is difficult to conduct heat from the semiconductor element to the connection terminal, compared with a case where the connection terminal and the semiconductor element are arranged over the same ceramic circuit board.

Abstract: In a semiconductor device, the marginal edge of a resist member on the side closer to a substrate is between first and third positions on a metal base plate. The third position is directly under an outer side surface of a metal plate. The first position is outside the third position and is away from a second position on the metal base plate directly under an outer side surface of the electrical insulating board, by a distance calculated by dividing “the height from a principal surface of the metal base plate to the front surface of the electrical insulating board” by “the tangent of the contact angle of solder created by the marginal edge stopping solder flow”. This makes it possible to ensure sufficient insulation distances between conductive patterns and the solder and to reduce creepage distances of the conductive patterns over the electrical insulating board.

Abstract: A plurality of sheets of photofixed-recording medium are stacked on top of each other and stored in a cartridge. An EEPROM is attached to the cartridge. The EEPROM is connecting to a memory connection section. A central processing unit is connected to the memory connecting section. The central processing unit can write information to the EEPROM of the cartridge or read information therefrom. Access to EEPROM can be correctly obtained only when the cartridge is properly inserted into a printing apparatus.

Abstract: To keep a toner (1) deposited on a transportation belt (21) from contact with a printhead (4) and prevent the clogging of toner passage holes (6) of the printhead (4), the toner (1) on a toner holding member (2) is ejected toward the transportation belt (21) through the toner passage holes (6) after the movement of the transportation belt (21) is initiated such that the cleaning of the toner passage holes (6) is initiated.

Abstract: The image forming apparatus includes a toner holding element 10 and a toner passage controller 4 having a plurality of toner passage holes 14, for controlling passage of toner 3. In order to prevent shortage of toner supply from the toner holding element 10 and form a high-quality image at a sufficient image density without producing thin white lines in such an image forming apparatus, the traveling speed of the toner holding element 10 is preset based on the traveling speed of an image receiving means 7 and at least one of the weight per unit area or the length in the scanning direction of the toner 3 that is applied to an image receiving means 7, the weight per unit area of the toner 3 held on the toner holding element 10 or the length of a toner-less region in the main scanning direction, and the number of pixels successively formed at different positions in the main scanning direction through the same toner passage hole 14.

Abstract: An image forming device including a toner holder 10 and a toner passage control device 4 including a plurality of toner passage holes 14 for controlling the passage of a toner 3, wherein a spacer member 22 arranged between the toner holder 10 and the toner passage control device 4 for maintaining the distance therebetween to be substantially constant has a predetermined surface roughness and a predetermined hardness while having a rigidity such that irregularities on the surface of the toner passage control device 4 are not transferred onto a toner layer 3a, so as to prevent the toner layer 3a on the toner holder 10 from being scratched and to form a high-quality image both in an initial stage of a recording operation and in a long-term use.

Abstract: To keep a toner (1) deposited on a transportation belt (21) from contact with a printhead (4) and prevent the clogging of toner passage holes (6) of the printhead (4), the toner (1) on a toner holding member (2) is ejected toward the transportation belt (21) through the toner passage holes (6) after the movement of the transportation belt (21) is initiated such that the cleaning of the toner passage holes (6) is initiated.

Abstract: A cartridge comprises a shutter for opening and closing an opening portion formed on a ceiling plate of an upper side member. The shutter slides on an outer surface of the ceiling plate by attaching and detaching the cartridge. Lifter projections are projected on a back portion of a lifter provided in the cartridge. The lifter projections are projected to an outer section through an opening portion formed on a bottom plate of a lower side member. If the cartridge is put on the plane, the lifter projections are pressed to an interior, so that the lifter is pushed up. Thereby, a recording paper is pressed onto the back surface of the ceiling plate. As a result, a space of the cartridge is lessened, the flow of air from the outer section is reduced, and a variation in internal moisture is controlled.

Abstract: In a thermal printer for thermo-sensitive recording, a plurality of heating resistors are electrically divided into N units each having M heating resistors, and N driver circuits, N latch circuits and N shift registers which are interconnected in tandem are respectively provided in association with the N units of M heating resistors. Dot data signals and associated hysteresis correction signals are collectively applied to the shift registers so that a pulse for print data and a pulse for hysteresis correction data can be applied continuously for printing.

Abstract: The present invention relates to a ribbon feed mechanism for use in a heat transfer printer. The ribbon feed mechanism includes first, second, and third ribbon feed components fitted on a shaft, a friction plate mounted between the first and second ribbon feed components, a spring mounted between the second and third ribbon feed components, a cylinder which is in contact with the third ribbon feed component at one end thereof, and a ribbon feed presser for pressing the other end of the cylinder toward the third ribbon feed component. The rotational torque is always kept constant, and therefore no unmatching of colors occurs when the mechanism is applied to a printer.