Abstract: A semiconductor module is provided with a semiconductor element, a case housing the semiconductor element, and an external terminal that electrically connects a main electrode of the semiconductor element to an external conductor. The external terminal projects out from a top face of the case and is bent at a right angle along the top face of the case. The case includes a protruding part that projects in a projection direction to a predetermined height above the top face of the case, and acts as a fulcrum for bending the external terminal, the protruding part having a slit that extends in a direction intersecting the projection direction to divide the protruding part.

Abstract: A semiconductor module includes a circuit board mounted on a base, a case having a sidewall and a lid and covering the circuit board, a plurality of conductive plates each parallel to a predetermined plane, electrically connected to different conductive patterns. The lid of the case has a partition that protrudes from an inner surface of the lid toward the base between two of the conductive plates. The partition has a first portion at a position where the partition and the conductive plates overlap each other, and a second portion at a position where the partition and the conductive plates do not overlap each other in a side view. The second portion has a cutout section disposed such that in a depth direction, a distance from the base to the second portion is greater than a distance from the base to the first portion.

Abstract: A semiconductor device includes a first insulated circuit board that is rectangular with first to fourth sides, including a first input wiring board and a first output wiring board each extending in a first direction parallel to the first side and being adjacent to each other. The first output wiring board includes a first output region electrically connected to a first output terminal and a first connection wiring region electrically connected to the output electrodes of the plurality of first semiconductor chips and being closer to the second side than is the first output region. The first connection wiring region has a first slit extending in the first direction from an end of the first connection wiring region at a side thereof where the first output region is located.

Abstract: A semiconductor device includes a substrate having a semiconductor chip mounted thereon, a heat dissipation plate having a front surface on which the substrate is disposed, a case including a side wall disposed on the front surface of the heat dissipation plate so as to surround a housing space accommodating the substrate therein together with the heat dissipation plate and a lid disposed on the side wall to cover the housing space, and a sealing member filling the housing space to seal the substrate. The lid has a through hole and a projection (or a groove) provided on the inner surface of the lid, configured to surround the through hole so as not to contact the sealing member such that the projection forms a plurality of circumferential patterns around the through hole in plan view.

Abstract: Provided is a semiconductor device including an upper arm circuit and a lower arm circuit and having a positive electrode terminal, a negative electrode terminal, and an output terminal, which includes an insulating plate; a first wiring pattern provided on the insulating plate; and a second wiring pattern provided on the insulating plate and spaced apart from the first wiring pattern, the upper arm circuit has a circuit in which the positive electrode terminal, a first diode portion provided on the first wiring pattern, a first transistor portion connected in series with the first diode portion and provided on the first wiring pattern, and the output terminal are connected and arranged in this order, and the lower arm circuit has a second transistor portion provided on the second wiring pattern, and a second diode portion provided on the second wiring pattern.

Abstract: A semiconductor module includes a circuit board mounted on a base, a case having a sidewall and a lid and covering the circuit board, a plurality of conductive plates each parallel to a predetermined plane, electrically connected to different conductive patterns. The lid of the case has a partition that protrudes from an inner surface of the lid toward the base between two of the conductive plates. The partition has a first portion at a position where the partition and the conductive plates overlap each other, and a second portion at a position where the partition and the conductive plates do not overlap each other in a side view. The second portion has a cutout section disposed such that in a depth direction, a distance from the base to the second portion is greater than a distance from the base to the first portion.

Abstract: A semiconductor device includes a base plate that includes a body plate containing a silicon carbide, a metal-filled body having a top surface and a bottom surface opposite to each other and having a through hole, and a protective member disposed on the bottom surface of the metal-filled body and having a hardness less than a hardness of the body plate, an insulating board disposed on the base plate, a semiconductor element mounted on a top surface of the base plate via the insulating board, and a cooling member attached to a bottom surface of the base plate and fastened to the base plate with a screw that passes through the through-hole.

Abstract: A semiconductor device includes first and second conductive parts, a first bonding wire connecting the first and second conductive parts and having a non-flat portion between opposite ends thereof so that a portion between the opposite ends is away from the first and second conductive parts, a case having a housing space to accommodate the first and second conductive parts, including a sidewall having first to fourth lateral faces surrounding the housing space to form a rectangular shape in a plan view, and a cover disposed on the sidewall, a sealing member filling the case to seal the first bonding wire, and a first stress relaxer for relieving a stress in the first bonding wire. The first bonding wire extends from the second lateral face toward the fourth lateral face, and the first stress relaxer is positioned between the first bonding wire and the first lateral face.

Abstract: A power converter includes a case including an outlet with an outlet opening in a principal surface thereof, and a wiring member having, as an external connection portion, a portion that extends out from the outlet opening and is bent at the outlet opening toward the principal surface. The external connection portion of the wiring member has a first surface facing the principal surface and includes a spacer provided on the first surface at a position adjacent to the outlet opening. The spacer is sandwiched between the first surface of the drawn-out portion and the principal surface of the case.

Abstract: A semiconductor device includes a first insulated circuit board that is rectangular with first to fourth sides, including a first input wiring board and a first output wiring board each extending in a first direction parallel to the first side and being adjacent to each other. The first output wiring board includes a first output region electrically connected to a first output terminal and a first connection wiring region electrically connected to the output electrodes of the plurality of first semiconductor chips and being closer to the second side than is the first output region. The first connection wiring region has a first slit extending in the first direction from an end of the first connection wiring region at a side thereof where the first output region is located.

Abstract: A semiconductor unit includes a plurality of semiconductor chips, and an insulated circuit board including an insulating plate having, in a plan view of the semiconductor unit, a rectangular shape surrounded by first and second sides opposite to each other and third and fourth sides perpendicular to the first and second sides and opposite to each other, an output circuit pattern and an input circuit pattern on a front surface of the insulating plate. The output and input circuit patterns each extend from the third side to the fourth side, and disposed in this order side by side in a main current direction that is a direction from the first side toward the second side. The plurality of semiconductor chips are bonded to the input circuit pattern at an area extending from the third side to the fourth side and including a center of the third and fourth sides.

Abstract: A semiconductor device includes first and second conductive parts, a first bonding wire connecting the first and second conductive parts and having a non-flat portion between opposite ends thereof so that a portion between the opposite ends is away from the first and second conductive parts, a case having a housing space to accommodate the first and second conductive parts, including a sidewall having first to fourth lateral faces surrounding the housing space to form a rectangular shape in a plan view, and a cover disposed on the sidewall, a sealing member filling the case to seal the first bonding wire, and a first stress relaxer for relieving a stress in the first bonding wire. The first bonding wire extends from the second lateral face toward the fourth lateral face, and the first stress relaxer is positioned between the first bonding wire and the first lateral face.

Abstract: A semiconductor device includes a semiconductor chip, an insulated circuit substrate including an insulating board and a circuit pattern on the insulating board electrically connected to the semiconductor chip, and a wiring member having a leg portion bonded to the circuit pattern. The leg portion includes a vertical portion, a first divided portion, and a second divided portion. The vertical portion extends in a vertical direction orthogonal to a plane of the circuit pattern, and has a split end provided at a side of the vertical portion at which the circuit pattern is disposed. The first divided portion extends from the split end in a first direction parallel to the plane of the circuit pattern and is bonded to the circuit pattern. The second divided portion extends from the split end in a second direction opposite the first direction and is bonded to the circuit pattern.

Abstract: A semiconductor module is provided with a semiconductor element, a case housing the semiconductor element, and an external terminal that electrically connects a main electrode of the semiconductor element to an external conductor. The external terminal projects out from a top face of the case and is bent at a right angle along the top face of the case. The case includes a protruding part that projects in a projection direction to a predetermined height above the top face of the case, and acts as a fulcrum for bending the external terminal, the protruding part having a slit that extends in a direction intersecting the projection direction to divide the protruding part.

Abstract: A main ceramic circuit board on which a semiconductor element is arranged is separate from a sub-ceramic circuit board on which a connection terminal is arranged. Accordingly, heat generated by the semiconductor element is conducted via the main ceramic circuit board and a base plate arranged thereunder and the sub-ceramic circuit board to the connection terminal. That is to say, it is difficult to conduct heat from the semiconductor element to the connection terminal, compared with a case where the connection terminal and the semiconductor element are arranged over the same ceramic circuit board.

Abstract: In a semiconductor device, the marginal edge of a resist member on the side closer to a substrate is between first and third positions on a metal base plate. The third position is directly under an outer side surface of a metal plate. The first position is outside the third position and is away from a second position on the metal base plate directly under an outer side surface of the electrical insulating board, by a distance calculated by dividing “the height from a principal surface of the metal base plate to the front surface of the electrical insulating board” by “the tangent of the contact angle of solder created by the marginal edge stopping solder flow”. This makes it possible to ensure sufficient insulation distances between conductive patterns and the solder and to reduce creepage distances of the conductive patterns over the electrical insulating board.

Abstract: A main ceramic circuit board on which a semiconductor element is arranged is separate from a sub-ceramic circuit board on which a connection terminal is arranged. Accordingly, heat generated by the semiconductor element is conducted via the main ceramic circuit board and a base plate arranged thereunder and the sub-ceramic circuit board to the connection terminal. That is to say, it is difficult to conduct heat from the semiconductor element to the connection terminal, compared with a case where the connection terminal and the semiconductor element are arranged over the same ceramic circuit board.

Abstract: In a semiconductor device, the marginal edge of a resist member on the side closer to a substrate is between first and third positions on a metal base plate. The third position is directly under an outer side surface of a metal plate. The first position is outside the third position and is away from a second position on the metal base plate directly under an outer side surface of the electrical insulating board, by a distance calculated by dividing “the height from a principal surface of the metal base plate to the front surface of the electrical insulating board” by “the tangent of the contact angle of solder created by the marginal edge stopping solder flow”. This makes it possible to ensure sufficient insulation distances between conductive patterns and the solder and to reduce creepage distances of the conductive patterns over the electrical insulating board.

Abstract: A plurality of sheets of photofixed-recording medium are stacked on top of each other and stored in a cartridge. An EEPROM is attached to the cartridge. The EEPROM is connecting to a memory connection section. A central processing unit is connected to the memory connecting section. The central processing unit can write information to the EEPROM of the cartridge or read information therefrom. Access to EEPROM can be correctly obtained only when the cartridge is properly inserted into a printing apparatus.