Semiconductor module

- FUJI ELECTRIC CO., LTD.
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Description

FIG. 1 is a front view of a semiconductor module showing our new design;

FIG. 2 is a rear view of the semiconductor module of FIG. 1;

FIG. 3 is a left side view of the semiconductor module of FIG. 1;

FIG. 4 is a right side view of the semiconductor module of FIG. 1;

FIG. 5 is a top view of the semiconductor module of FIG. 1;

FIG. 6 is a bottom view of the semiconductor module of FIG. 1;

FIG. 7 is a top, front, and right side perspective view of the semiconductor module of FIG. 1; and,

FIG. 8 is a top, rear, and left side perspective view of the semiconductor module of FIG. 1.

The portions of the semiconductor module shown in broken lines form no part of the claimed design.

Claims

The ornamental design for a semiconductor module, as shown and described.

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Patent History
Patent number: D884662
Type: Grant
Filed: Nov 7, 2018
Date of Patent: May 19, 2020
Assignee: FUJI ELECTRIC CO., LTD. (Kawasaki)
Inventors: Taichi Itoh (Matsumoto), Hiroaki Ichikawa (Azumino), Mitsuhiro Kakefu (Matsumoto), Akio Yamano (Matsumoto), Takuya Yamamoto (Matsumoto)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/669,336