Semiconductor module
Description
The portions of the semiconductor module shown in broken lines form no part of the claimed design.
Claims
The ornamental design for a semiconductor module, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
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Patent History
Patent number: D884662
Type: Grant
Filed: Nov 7, 2018
Date of Patent: May 19, 2020
Assignee: FUJI ELECTRIC CO., LTD. (Kawasaki)
Inventors: Taichi Itoh (Matsumoto), Hiroaki Ichikawa (Azumino), Mitsuhiro Kakefu (Matsumoto), Akio Yamano (Matsumoto), Takuya Yamamoto (Matsumoto)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/669,336
Type: Grant
Filed: Nov 7, 2018
Date of Patent: May 19, 2020
Assignee: FUJI ELECTRIC CO., LTD. (Kawasaki)
Inventors: Taichi Itoh (Matsumoto), Hiroaki Ichikawa (Azumino), Mitsuhiro Kakefu (Matsumoto), Akio Yamano (Matsumoto), Takuya Yamamoto (Matsumoto)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/669,336
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)