Patents by Inventor Taiichi Furukawa
Taiichi Furukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150160556Abstract: A resist pattern-forming method includes applying a resist underlayer film-forming composition to a substrate to form a resist underlayer film. The resist underlayer film-forming composition includes (A) a polysiloxane. A radiation-sensitive resin composition is applied to the resist underlayer film to form a resist film. The radiation-sensitive resin composition includes (a1) a polymer that changes in polarity and decreases in solubility in an organic solvent due to an acid. The resist film is exposed. The exposed resist film is developed using a developer that includes an organic solvent.Type: ApplicationFiled: February 20, 2015Publication date: June 11, 2015Applicant: JSR CorporationInventors: Yusuke ANNO, Takashi MORI, Hirokazu SAKAKIBARA, Taiichi FURUKAWA, Kazunori TAKANASHI, Hiromitsu TANAKA, Shin-ya MINEGISHI
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Patent number: 9034559Abstract: A pattern-forming method includes providing a resist film on a substrate using a radiation-sensitive composition. The resist film is exposed. The exposed resist film is developed using a developer solution. The developer solution includes no less than 80% by mass of an organic solvent. The radiation-sensitive composition includes at least two components including a first polymer and a radiation-sensitive acid generator. The first polymer includes a structural unit having an acid-labile group. One or more components of the radiation-sensitive composition have a group represented by a formula (1). A? represents —N?—SO2—RD, —COO?, —O? or —SO3?. —SO3? does not directly bond to a carbon atom having a fluorine atom. RD represents a linear or branched monovalent hydrocarbon group, or the like. X+ represents an onium cation.Type: GrantFiled: April 19, 2013Date of Patent: May 19, 2015Assignee: JSR CORPORATIONInventors: Hirokazu Sakakibara, Masafumi Hori, Taiichi Furukawa, Koji Ito
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Patent number: 8993223Abstract: A resist pattern-forming method includes applying a resist underlayer film-forming composition to a substrate to form a resist underlayer film. The resist underlayer film-forming composition includes (A) a polysiloxane. A radiation-sensitive resin composition is applied to the resist underlayer film to form a resist film. The radiation-sensitive resin composition includes (a1) a polymer that changes in polarity and decreases in solubility in an organic solvent due to an acid. The resist film is exposed. The exposed resist film is developed using a developer that includes an organic solvent.Type: GrantFiled: January 17, 2014Date of Patent: March 31, 2015Assignee: JSR CorporationInventors: Yusuke Anno, Takashi Mori, Hirokazu Sakakibara, Taiichi Furukawa, Kazunori Takanashi, Hiromitsu Tanaka, Shin-ya Minegishi
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Patent number: 8980539Abstract: A developer includes an organic solvent and a nitrogen-containing compound. The developer is configured to develop a resist film to form a negative resist pattern. The resist film is formed using a photoresist composition. The photoresist composition includes a polymer and a radiation-sensitive acid generator. The polymer includes a structural unit including an acid-labile group.Type: GrantFiled: February 26, 2014Date of Patent: March 17, 2015Assignee: JSR CorporationInventors: Taiichi Furukawa, Hirokazu Sakakibara
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Publication number: 20150050600Abstract: A resist pattern-forming method includes applying a resist underlayer film-forming composition to a substrate to form a resist underlayer film. The resist underlayer film-forming composition includes (A) a polysiloxane. A radiation-sensitive resin composition is applied to the resist underlayer film to form a resist film. The radiation-sensitive resin composition includes (a1) a polymer that changes in polarity and decreases in solubility in an organic solvent due to an acid. The resist film is exposed. The exposed resist film is developed using a developer that includes an organic solvent.Type: ApplicationFiled: January 17, 2014Publication date: February 19, 2015Applicant: JSR CorporationInventors: Yusuke ANNO, Takashi MORI, Hirokazu SAKAKIBARA, Taiichi FURUKAWA, Kazunori TAKANASHI, Hiromitsu TANAKA, Shin-ya MINEGISHI
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Publication number: 20140363766Abstract: A resist pattern-forming method includes forming a resist coating film using a radiation-sensitive resin composition. The resist coating film is exposed and developed using a developer solution containing no less than 80% by mass of an organic solvent. The radiation-sensitive resin composition includes a polymer component including a polymer having an acid-labile group, and a radiation-sensitive acid generator. The polymer component includes, in an identical polymer or different polymers, a first structural unit having a first hydrocarbon group, and a second structural unit having a second hydrocarbon group. The first hydrocarbon group is an unsubstituted or substituted branched chain group, or the is like. The second hydrocarbon group has an adamantane skeleton. A molar ratio of the second hydrocarbon group to the first hydrocarbon group is less than 1. A proportion of a structural unit having a hydroxyl group in the polymer component is less than 5 mol %.Type: ApplicationFiled: July 11, 2013Publication date: December 11, 2014Inventors: Hirokazu SAKAKIBARA, Taiichi FURUKAWA, Masafumi HORI, Koji ITO, Hiromu MIYATA
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Publication number: 20140295350Abstract: A resist pattern-forming method includes coating a radiation-sensitive resin composition on a substrate to provide a resist film. The resist film is exposed. The exposed resist film is developed using a developer solution including no less than 80% by mass of an organic solvent. The radiation-sensitive resin composition includes a polymer, a radiation-sensitive acid generator, and an acid diffusion controller which includes a compound having an amide group. The polymer has a weight average molecular weight in terms of the polystyrene equivalent of greater than 6,000 and includes a first structural unit that includes an acid-labile group. The polymer includes less than 5 mol % or 0 mol % of a second structural unit that includes a hydroxyl group.Type: ApplicationFiled: June 17, 2014Publication date: October 2, 2014Inventors: Hirokazu SAKAKIBARA, Taiichi FURUKAWA, Reiko KIMURA, Masafumi HORI
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Publication number: 20140255854Abstract: A pattern-forming method includes providing a resist film on a substrate using a photoresist composition. The resist film is exposed. The exposed resist film is developed using a developer having an organic solvent content of 80 mass % or more. The photoresist composition includes a first polymer, a second polymer, and an acid generator. The first polymer is a base polymer and includes a first structural unit that includes an acid-labile group. The second polymer includes a second structural unit that includes an acid-labile group, and has a fluorine atom content higher than a fluorine atom content of the first polymer. The second structural unit is represented by a formula (1) or a formula (2).Type: ApplicationFiled: May 19, 2014Publication date: September 11, 2014Applicant: JSR CORPORATIONInventors: Hirokazu SAKAKIBARA, Hiromu MIYATA, Taiichi FURUKAWA, Koji ITO
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Patent number: 8822140Abstract: A resist pattern-forming method includes applying a radiation-sensitive resin composition on a substrate to form a resist film. The radiation-sensitive resin composition includes an acid-labile group-containing polymer and a photoacid generator. The resist film is exposed. The resist film is developed using a developer including an organic solvent in an amount of no less than 80% by mass to a total amount of the developer. The radiation-sensitive resin composition has a contrast value ? of from 5.0 to 30.0. The contrast value ? is calculated from a resist dissolution contrast curve obtained by changing only a dose of a light used for exposing the resist film.Type: GrantFiled: August 8, 2013Date of Patent: September 2, 2014Assignee: JSR CorporationInventors: Hirokazu Sakakibara, Hiromu Miyata, Koji Ito, Taiichi Furukawa
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Patent number: 8815493Abstract: A resist pattern-forming method includes coating a radiation-sensitive resin composition on a substrate to provide a resist film. The resist film is exposed. The exposed resist film is developed with a developer solution including no less than 80% by mass of an organic solvent. The radiation-sensitive resin composition includes a base polymer, a fluorine-atom-containing polymer, a radiation-sensitive acid generator, a solvent, and a compound. The base polymer has an acid-labile group. The fluorine-atom-containing polymer has a content of fluorine atoms higher than a content of fluorine atoms of the base polymer. The compound has a relative permittivity greater than a relative permittivity of the solvent by at least 15. A content of the compound is no less than 10 parts by mass and no greater than 200 parts by mass with respect to 100 parts by mass of the base polymer.Type: GrantFiled: April 19, 2013Date of Patent: August 26, 2014Assignee: JSR CorporationInventors: Koji Ito, Hirokazu Sakakibara, Masafumi Hori, Taiichi Furukawa
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Patent number: 8795954Abstract: A resist pattern-forming method includes coating a radiation-sensitive resin composition on a substrate to provide a resist film. The resist film is exposed. The exposed resist film is developed using a developer solution including no less than 80% by mass of an organic solvent. The radiation-sensitive resin composition includes a polymer and a radiation-sensitive acid generator. The polymer has a weight average molecular weight in terms of the polystyrene equivalent of greater than 6,000 and includes a first structural unit that includes an acid-labile group. The polymer includes less than 5 mol % or 0 mol % of a second structural unit that includes a hydroxyl group.Type: GrantFiled: April 12, 2013Date of Patent: August 5, 2014Assignee: JSR CorporationInventors: Hirokazu Sakakibara, Taiichi Furukawa, Reiko Kimura, Masafumi Hori
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Publication number: 20140178825Abstract: A developer includes an organic solvent and a nitrogen-containing compound. The developer is configured to develop a resist film to form a negative resist pattern. The resist film is formed using a photoresist composition. The photoresist composition includes a polymer and a radiation-sensitive acid generator. The polymer includes a structural unit including an acid-labile group.Type: ApplicationFiled: February 26, 2014Publication date: June 26, 2014Applicant: JSR CORPORATIONInventors: Taiichi FURUKAWA, Hirokazu SAKAKIBARA
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Publication number: 20140134544Abstract: A resist pattern-forming method includes applying a resist underlayer film-forming composition to a substrate to form a resist underlayer film. The resist underlayer film-forming composition includes (A) a polysiloxane. A radiation-sensitive resin composition is applied to the resist underlayer film to form a resist film. The radiation-sensitive resin composition includes (a1) a polymer that changes in polarity and decreases in solubility in an organic solvent due to an acid. The resist film is exposed. The exposed resist film is developed using a developer that includes an organic solvent.Type: ApplicationFiled: January 17, 2014Publication date: May 15, 2014Applicant: JSR CorporationInventors: Yusuke ANNO, Takashi MORI, Hirokazu SAKAKIBARA, Taiichi FURUKAWA, Kazunori TAKANASHI, Hiromitsu TANAKA, Shin-ya MINEGISHI
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Patent number: 8703401Abstract: A pattern-forming method includes forming a resist film on a substrate using a photoresist composition, exposing the resist film, and developing the exposed resist film using a negative developer that includes an organic solvent. The photoresist composition includes (A) a polymer that includes a structural unit (I) including an acid-labile group that dissociates due to an acid, the solubility of the polymer in the developer decreasing upon dissociation of the acid-labile group, and (B) a photoacid generator. The developer includes a nitrogen-containing compound.Type: GrantFiled: July 6, 2011Date of Patent: April 22, 2014Assignee: JSR CorporationInventors: Taiichi Furukawa, Hirokazu Sakakibara
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Patent number: 8669042Abstract: A resist pattern-forming method includes applying a resist underlayer film-forming composition to a substrate to form a resist underlayer film. The resist underlayer film-forming composition includes (A) a polysiloxane. A radiation-sensitive resin composition is applied to the resist underlayer film to form a resist film. The radiation-sensitive resin composition includes (a1) a polymer that changes in polarity and decreases in solubility in an organic solvent due to an acid. The resist film is exposed. The exposed resist film is developed using a developer that includes an organic solvent.Type: GrantFiled: March 30, 2012Date of Patent: March 11, 2014Assignee: JSR CorporationInventors: Yusuke Anno, Takashi Mori, Hirokazu Sakakibara, Taiichi Furukawa, Kazunori Takanashi, Hiromitsu Tanaka, Shin-ya Minegishi
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Publication number: 20130337385Abstract: A negative pattern-forming method includes providing a resist film on a substrate using a photoresist composition. The photoresist composition includes a first polymer and an organic solvent. The first polymer includes a first structural unit having an acid-generating capability. The resist film is exposed. The exposed resist film is developed using a developer that includes an organic solvent.Type: ApplicationFiled: August 22, 2013Publication date: December 19, 2013Applicant: JSR CORPORATIONInventors: Taiichi FURUKAWA, Koji ITO, Hiromu MIYATA, Hirokazu SAKAKIBARA
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Publication number: 20130323653Abstract: A resist pattern-forming method includes applying a radiation-sensitive resin composition on a substrate to form a resist film. The radiation-sensitive resin composition includes an acid-labile group-containing polymer and a photoacid generator. The resist film is exposed. The resist film is developed using a developer including an organic solvent in an amount of no less than 80% by mass to a total amount of the developer. The radiation-sensitive resin composition has a contrast value ? of from 5.0 to 30.0. The contrast value ? is calculated from a resist dissolution contrast curve obtained by changing only a dose of a light used for exposing the resist film.Type: ApplicationFiled: August 8, 2013Publication date: December 5, 2013Applicant: JSR CORPORATIONInventors: Hirokazu SAKAKIBARA, Hiromu MIYATA, Koji ITO, Taiichi FURUKAWA
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Publication number: 20130316287Abstract: A photoresist composition includes a base polymer, a polymer and an acid generator. The base polymer includes a first structural unit that includes an acid-labile group. The polymer includes a second structural unit that includes an acid-labile group, and has a fluorine atom content higher than a fluorine atom content of the base polymer. The photoresist composition is developed using an organic solvent. The second structural unit is represented by a formula (1) or a formula (2). R1 is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group. Z1 is a divalent monocyclic hydrocarbon group having 5 or 6 carbon atoms or a divalent polycyclic hydrocarbon group having 7 to 10 carbon atoms. R2 is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group. R3 is an alicyclic hydrocarbon group having 5 to 20 carbon atoms.Type: ApplicationFiled: July 31, 2013Publication date: November 28, 2013Applicant: JSR CORPORATIONInventors: Hirokazu SAKAKIBARA, Hiromu MIYATA, Taiichi FURUKAWA, Koji ITO
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Publication number: 20130295506Abstract: A resist pattern-forming method includes forming a resist coating film using a radiation-sensitive resin composition. The resist coating film is exposed and developed using a developer solution containing no less than 80% by mass of an organic solvent. The radiation-sensitive resin composition includes a polymer component including a polymer having an acid-labile group, and a radiation-sensitive acid generator. The polymer component includes, in an identical polymer or different polymers, a first structural unit having a first hydrocarbon group, and a second structural unit having a second hydrocarbon group. The first hydrocarbon group is an unsubstituted or substituted branched chain group, or the is like. The second hydrocarbon group has an adamantane skeleton. A molar ratio of the second hydrocarbon group to the first hydrocarbon group is less than 1. A proportion of a structural unit having a hydroxyl group in the polymer component is less than 5 mol %.Type: ApplicationFiled: July 11, 2013Publication date: November 7, 2013Inventors: Hirokazu SAKAKIBARA, Taiichi FURUKAWA, Masafumi HORI, Koji ITO, Hiromu MIYATA
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Patent number: 8530146Abstract: A radiation-sensitive resin composition includes an acid-labile group-containing polymer and photoacid generator. The radiation-sensitive resin composition is used to form a resist pattern using a developer that includes an organic solvent in an amount of 80 mass % or more. The radiation-sensitive resin composition has a contrast value ? of 5.0 to 30.0. The contrast value ? is calculated from a resist dissolution contrast curve obtained when developing the radiation-sensitive resin composition using the organic solvent.Type: GrantFiled: January 25, 2012Date of Patent: September 10, 2013Assignee: JSR CorporationInventors: Hirokazu Sakakibara, Hiromu Miyata, Koji Ito, Taiichi Furukawa