Abstract: An opto-electronic communication module includes a module body and a circuit board having an edge with conductive castellations extending between opposing surfaces of the circuit board. At least one opto-electronic communication device, such as an opto-electronic light source or an opto-electronic light receiver, is mounted on a surface of the circuit board in an orientation in which its optical signal communication axis is normal to the surface of the circuit board and aligned with an optical signal communication port of the module body.

Abstract: An opto-electronic module system includes an opto-electronic module having an optics engine module mounted on an opto-electronic module substrate. The optics engine module includes an opto-electronic light source and an opto-electronic light receiver mounted on an optics engine module substrate. The opto-electronic module substrate has an aperture that is aligned with the opto-electronic light source and the opto-electronic light receiver.

Abstract: An optical package includes a sub-mount, an edge-emitting laser mounted on the sub-mount, a collimating ball lens mounted on the sub-mount adjacent to the edge-emitting laser, a mirror mounted on the sub-mount adjacent to the collimating ball lens. The sub-mount is made of a bottom wafer. A lid is bonded to the sub-mount to form the laser package. The lid is made of a middle wafer bonded to a top wafer. The middle wafer defines an opening that accommodates the edge-emitting laser, the collimating ball lens, and the mirror. The opening is defined by vertical sidewalls. The top wafer further includes a lens above the mirror.

Abstract: In a method of forming a device so as to include a reflective surface at a specific angle to an incident optical axis, a region of a first major surface of a substrate is exposed to an anisotropic etchant to form a surface having the specific angle with respect to the first major surface, but the etched surface is then used as a mounting surface. That is, rather than anisotropically etching a reflective surface, the etching provides the mounting surface and the second major surface of the substrate functions as the reflective surface when the fabricated device is properly mounted. The substrate may be a <100> silicon wafer having a 9.74 degree off-axis cut. Then, a 45 degree mirror is formed by the process. When the reflector is used in an optical device, the <111> crystalline plane will be generally parallel to the surface of the support.

Abstract: An optical package includes a sub-mount, an edge-emitting laser mounted on the sub-mount, a collimating ball lens mounted on the sub-mount adjacent to the edge-emitting laser, a mirror mounted on the sub-mount adjacent to the collimating ball lens. The sub-mount is made of a bottom wafer. A lid is bonded to the sub-mount to form the laser package. The lid is made of a middle wafer bonded to a top wafer. The middle wafer defines an opening that accommodates the edge-emitting laser, the collimating ball lens, and the mirror. The opening is defined by vertical sidewalls. The top wafer further includes a lens above the mirror.

Abstract: A wafer-level device fabrication process forms standing structures around emitting areas of multiple VCSELs. The standing structures can be shaped to hold ball lenses or other optical elements for respective VCSELs or can include platforms on which optical elements are formed. Ball lenses that are attached to the standing structures either during chip-level or wafer-level processes fit into the standing structures and are automatically aligned. Wafer level fabrication of optical elements can align the optical elements with accuracies associated with photolithographic processes. The optical elements can be formed using a molding or replication process, a printing method, or surface tension during a reflow of lithographically formed regions.

Abstract: In a method of forming a device so as to include a reflective surface at a specific angle to an incident optical axis, a region of a first major surface of a substrate is exposed to an anisotropic etchant to form a surface having the specific angle with respect to the first major surface, but the etched surface is then used as a mounting surface. That is, rather than anisotropically etching a reflective surface, the etching provides the mounting surface and the second major surface of the substrate functions as the reflective surface when the fabricated device is properly mounted. The substrate may be a <100> silicon wafer having a 9.74 degree off-axis cut. Then, a 45 degree mirror is formed by the process. When the reflector is used in an optical device, the <111> crystalline plane will be generally parallel to the surface of the support.

Abstract: Compactness is preserved while enabling beam monitoring of optical properties of an output beam by employing a combination of reflection and diffraction. An input beam is reflected, divided using reflection/diffraction, and re-reflected. As a consequence, both a light source and one or more beam monitoring detectors may be disposed along a single side of an optical module. In one embodiment, an input beam is introduced from a first side of an optical module, is reflected by a 45 degree mirror, and is divided by a diffraction grating which redirects a minor portion of the beam energy back to the 45 degree mirror. Following the second reflection from the mirror, the returned portion of the beam is used to measure one or more optical properties.

Abstract: In a method of forming a device so as to include a reflective surface at a specific angle to an incident optical axis, a region of a first major surface of a substrate is exposed to an anisotropic etchant to form a surface having the specific angle with respect to the first major surface, but the etched surface is then used as a mounting surface. That is, rather than anisotropically etching a reflective surface, the etching provides the mounting surface and the second major surface of the substrate functions as the reflective surface when the fabricated device is properly mounted. The substrate may be a <100> silicon wafer having a 9.74 degree off-axis cut. Then, a 45 degree mirror is formed by the process. When the reflector is used in an optical device, the <111> crystalline plane will be generally parallel to the surface of the support.

Abstract: A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.

Abstract: A wafer-level device fabrication process forms standing structures around emitting areas of multiple VCSELs. The standing structures can be shaped to hold ball lenses or other optical elements for respective VCSELs or can include platforms on which optical elements are formed. Ball lenses that are attached to the standing structures either during chip-level or wafer-level processes fit into the standing structures and are automatically aligned. Wafer level fabrication of optical elements can align the optical elements with accuracies associated with photolithographic processes. The optical elements can be formed using a molding or replication process, a printing method, or surface tension during a reflow of lithographically formed regions.

Abstract: An alignment assembly for an optics module includes an alignment stage that is enabled to provide an adjustment of the relative positioning of a light beam and a lens, but also includes a locking mechanism which disables the movement of the alignment stage following a one-time alignment procedure. The locking mechanism may include one or more heaters and meltable material which is heated during the one-time alignment procedure and cooled when the target relative position between the beam and the lens is achieved.

Abstract: A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.

Abstract: A method for forming a diffractive lens includes forming an etch stop layer on a first surface of a silicon substrate, forming a diffractive optical element above the etch stop layer, forming a planarization layer covering the diffractive optical element, planarizing the planarization layer, forming a bonding layer on the planarization layer, bonding a transparent substrate on the bonding layer, and etching a second surface of the silicon substrate to the etch stop layer to remove a portion of the silicon substrate opposite the diffractive optical element, wherein the remaining portion of the silicon substrate forms a bonding ring.

Abstract: A micro-machined valve assembly includes a valve diaphragm that will not adhere to a valve seat during elevated temperature operation. The valve assembly has a valve seat, a diaphragm suspended over the valve seat, the diaphragm configured to contact the valve seat upon the application of an actuating pressure on the diaphragm. The diaphragm has a continuous film of a first material, where a portion of the first material in a region where the diaphragm contacts the valve seat includes a first metallic material. The absence of an adhesive or the addition of the metal layer extends the operating temperature of the valve by preventing adhesion of the diaphragm to the valve seat during high temperature operation. Selection of an appropriate material for the metal layer can improve chemical inertness of valve, thereby reducing the possibility that the material flowing through the valve will react with the metal.

Abstract: Micro-valves that include a diaphragm capable of being positioned on a valve seat or removed from the valve seat. The micro-valves also include supports and a cover that restrict the motion of the diaphragm, thereby reducing the possibility of cracking. Micro-valves made by anodically bonding the diaphragm to a seat substrate and anodically bonding the cover to the diaphragm. Micro-injectors that include micro-valves. Also, methods of making the micro-valves and micro-injectors.

Abstract: Micro-valves that include a diaphragm capable of being positioned on a valve seat or removed from the valve seat. The micro-valves also include supports and a cover that restrict the motion of the diaphragm, thereby reducing the possibility of cracking. Micro-valves made by anodically bonding the diaphragm to a seat substrate and anodically bonding the cover to the diaphragm. Micro-injectors that include micro-valves. Also, methods of making the micro-valves and micro-injectors.

Abstract: A micro-machined valve assembly includes a valve diaphragm that will not adhere to a valve seat during elevated temperature operation. In one embodiment, the valve assembly comprises a valve seat, a diaphragm suspended over the valve seat, the diaphragm configured to contact the valve seat upon the application of an actuating pressure on the diaphragm. The diaphragm comprises a continuous film of a first material to which a layer of adhesive is applied. A portion of the adhesive in a region where the diaphragm contacts the valve seat is removed. In an alternative embodiment, the invention is a valve assembly comprising a valve seat, a diaphragm suspended over the valve seat, the diaphragm configured to contact the valve seat upon the application of an actuating pressure on the diaphragm. The diaphragm comprises a continuous film of a first material, where a portion of the first material in a region where the diaphragm contacts the valve seat includes a first metallic material.

Abstract: An improved micro-machined valve assembly includes a valve diaphragm that will not adhere to a valve seat during elevated temperature operation. In one embodiment, a portion of the diaphragm that is susceptible to adhering to the valve seat at elevated temperature is removed in the region where the diaphragm contacts the valve seat. In another embodiment, the valve diaphragm includes a metal layer applied to the portion of the diaphragm that comes into contact with the valve seat during operation of the valve. The metal layer extends the operating temperature of the valve by preventing adhesion of the diaphragm to the valve seat during high temperature operation. Selection of an appropriate material for the metal layer can improve chemical inertness of valve, thereby reducing the possibility that the material flowing through the valve will react with the metal.

Abstract: A device with a multi-layered micro-component electrical connector. The multi-layer micro-component electrical connector includes a dielectric layer, a micro-mesh of a first electrical conductor secured to the dielectric layer, and a second electrical conductor secured to and contacting the micro-mesh to provide electrical communication. The dielectric layer has a dielectric layer thermal expansion coefficient and the first electrical conductor has a thermal expansion coefficient different from the dielectric layer thermal expansion coefficient. Due to the presence of the micro-mesh the device is operable at temperatures above 250° C. without delamination or blistering of the first electrical conductor from the dielectric layer.