Patents by Inventor Tak M. Mak

Tak M. Mak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6721216
    Abstract: An apparatus and method for testing an address decoder and word lines of a memory array comprised of connecting a signature analyzer to the word lines emanating from an address decoder, setting a clock used to trigger the latching of the states of the word lines by the signature analyzer, transmitting an address to the address decoder to be decoded, and triggering the signature analyzer to latch the state of the word lines.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: April 13, 2004
    Assignee: Intel Corporation
    Inventors: Tak M. Mak, Michael R. Spica, Michael J. Tripp
  • Publication number: 20040036494
    Abstract: A testing mode is provided for self testing of the transmitter and receiver pair provided on-chip. The testing mode targets each module individually; wherein when one of the two devices is placed under test, the other is used as a tester. When the transmitter is the device under test and the receiver is the tester that receives a transmitted signal from the transmitter, the receiver is used to determine the data eye size with the transmitted signal. When the receiver is the device under test and the transmitter is the tester, the transmitter is used to determine the amount of noise and power loss tolerated by the receiver.
    Type: Application
    Filed: August 21, 2002
    Publication date: February 26, 2004
    Inventors: Tak M. Mak, Michael J. Tripp
  • Patent number: 6629274
    Abstract: According to one embodiment, a method of conducting a switching state (AC) loop back test at a buffer circuit comprises varying the relationship between the generation of strobe signals at a strobe input/output (I/O) circuit of a first group of I/O circuits and the reception of data at the first group of I/O circuits receiving the strobe signals fails, and comparing the time at which the first I/O circuit fails with a predetermined timing performance for the first group of I/O circuits. Subsequently, it is determined whether the first group of I/O circuits satisfies the predetermined timing performance.
    Type: Grant
    Filed: December 21, 1999
    Date of Patent: September 30, 2003
    Assignee: Intel Corporation
    Inventors: Mike Tripp, Tak M. Mak, Alper Ilkbahar, R. Tim Frodsham
  • Publication number: 20020141259
    Abstract: An apparatus and method for testing memory cells comprising coupling a first and a second memory cell to a first and a second bit lines, respectively, reading data from the first and second memory cells through the first and second bit lines, and comparing the voltage levels of the first and second bit lines.
    Type: Application
    Filed: March 30, 2001
    Publication date: October 3, 2002
    Inventors: Tak M. Mak, Michael R. Spica, Michael J. Tripp
  • Publication number: 20020141276
    Abstract: An apparatus and method for testing an address decoder and word lines of a memory array comprised of connecting a signature analyzer to the word lines emanating from an address decoder, setting a clock used to trigger the latching of the states of the word lines by the signature analyzer, transmitting an address to the address decoder to be decoded, and triggering the signature analyzer to latch the state of the word lines.
    Type: Application
    Filed: March 30, 2001
    Publication date: October 3, 2002
    Inventors: Tak M. Mak, Michael R. Spica, Michael J. Tripp
  • Patent number: 6424926
    Abstract: A bus signature analyzer (BSA) device and method to provide high-speed functional testing of a highly integrated circuit (IC) are provided such that existing automatic test equipment (ATE) can be used. The BSA includes a serially-connected multiple input signature register (MISR), which is coupled to the highly integrated circuit, having a feedback circuit coupled to an output of the MISR to receive an output signal and the feedback circuit being coupled to a plurality of inputs of the MISR to feedback the output signal to the plurality of inputs. The BSA further includes a control circuit coupled to the MISR, such that the control circuit enables the MISR to compress an outgoing data signal, which represents the functional behavior of the IC being tested, into a signature on a valid bus cycle.
    Type: Grant
    Filed: March 31, 2000
    Date of Patent: July 23, 2002
    Assignee: Intel Corporation
    Inventor: Tak M. Mak
  • Patent number: 6222246
    Abstract: A flip-chip having a decoupling capacitor electrically coupled to the backside thereof. The flip-chip includes a semiconductor substrate having first and second opposing surfaces with circuit elements formed within the first surface. A plurality of raised bump contacts are located on the first surface and connected to the circuit elements. A plurality of electrical interconnects are also located on or within the second surface and connected to the circuit elements. The electrodes of a decoupling capacitor are electrically coupled to the plurality of electrical interconnects.
    Type: Grant
    Filed: January 8, 1999
    Date of Patent: April 24, 2001
    Assignee: Intel Corporation
    Inventors: Tak M. Mak, Paul Winer, Valluri R. Rao, Richard H. Livengood
  • Patent number: 5621739
    Abstract: A self-testing buffer circuit. The buffer circuit utilizes an adjustable delay circuit to test whether the buffer can capture a data value during a variable stroke window. The buffer includes an input circuit coupled to receive a data value generated by the self-testing buffer circuit. The buffer circuit also includes a latch which has a latch input coupled to receive the data value from the input circuit. An adjustable delay circuit having a delay adjust input is coupled to provide an adjustably delayed strobe to a clock input of the latch. A comparison circuit may be coupled to compare a latch output value to an expected value. The self-testing buffer circuit may be used in conjunction with serial or parallel test resisters to test the buffer performance for a variety of strobe delays and data values.
    Type: Grant
    Filed: May 7, 1996
    Date of Patent: April 15, 1997
    Assignee: Intel Corporation
    Inventors: Christopher J. Sine, Alper Ilkbahar, Tak M. Mak