Patents by Inventor Tak Ning

Tak Ning has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Silicon-on-insulator (SOI) integrated circuit (IC) chip with the silicon layers consisting of regions of different thickness
    Publication number: 20050006704
    Abstract: The present invention provides SOI material which includes a top Si-containing layer which has regions of different thickness as well as a method of fabricating such SOI material. The inventive method includes a step of thinning predetermined regions of the top Si-containing layer by masked oxidation of silicon. SOI IC chips including the inventive SOI material having different types of CMOS devices build thereon as also disclosed.
    Type: Application
    Filed: July 28, 2004
    Publication date: January 13, 2005
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Tak Ning, Devendra Sadana