Abstract: It is an object to provide a flexible light-emitting device with long lifetime in a simple way and to provide an inexpensive electronic device with long lifetime using the flexible light-emitting device. A flexible light-emitting device is provided, which includes a substrate having flexibility and a light-transmitting property with respect to visible light; a first adhesive layer over the substrate; an insulating film containing nitrogen and silicon over the first adhesive layer; a light-emitting element including a first electrode, a second electrode facing the first electrode, and an EL layer between the first electrode and the second electrode; a second adhesive layer over the second electrode; and a metal substrate over the second adhesive layer, wherein the thickness of the metal substrate is 10 ?m to 200 ?m inclusive. Further, an electronic device using the flexible light-emitting device is provided.

Abstract: There are provided a copper alloy plate having high strength, high electrical conductivity, a high bending deflection coefficient, and excellent stress relaxation characteristics, and an electronic component preferred for high current applications or heat dissipation applications. A copper alloy plate comprising 0.8 to 5.0% by mass of one or more of Ni and Co and 0.2 to 1.5% by mass of Si, with the balance being copper and an unavoidable impurity, having a tensile strength of 500 MPa or more, and having an A value of 0.5 or more, the A value being given by the following formula: A=2X(111)+X(220)?X(200) X(hkl)=I(hkl)/I0(hkl) wherein I(hkl) and I0(hkl) are diffraction integrated intensities of a (hkl) face obtained for a rolled face and a copper powder, respectively, using an X-ray diffraction method.

Abstract: A camera module (1) which includes a lens (3); a spring member (9a, 9b) which elastically urges the lens (3) toward an initial position along an optical axis direction; an electromagnetic drive means (11) capable of driving the lens (3) along the optical axis direction by producing an electromagnetic force against an urging force of the spring member (9a, 9b); and a control means (12) configured to control a drive current supplied to the electromagnetic drive means (11), wherein the spring member (pa, 9b) contains 2.9% to 3.5% by mass of Ti, with the balance being copper and inevitable impurities, and has a Vickers hardness equal to or greater than 350.

Abstract: There are provided a copper alloy plate having high strength, high electrical conductivity, a high bending deflection coefficient, and excellent stress relaxation characteristics, and an electronic component preferred for high current applications or heat dissipation applications. A copper alloy plate comprising 0.8 to 5.0% by mass of one or more of Ni and Co and 0.2 to 1.5% by mass of Si, with the balance being copper and an unavoidable impurity, having a tensile strength of 500 MPa or more, and having an A value of 0.5 or more, the A value being given by the following formula: A=2X(111)+X(220)?X(200) X(hkl)=(hkl)/I0(hkl) wherein I(hkl) and I0(hkl) are diffraction integrated intensities of a (hkl) face obtained for a rolled face and a copper powder, respectively, using an X-ray diffraction method.

Abstract: A camera module (1) which includes a lens (3); a spring member (9a, 9b) which elastically urges the lens (3) toward an initial position along an optical axis direction; an electromagnetic drive means (11) capable of driving the lens (3) along the optical axis direction by producing an electromagnetic force against an urging force of the spring member (9a, 9b); and a control means (12) configured to control a drive current supplied to the electromagnetic drive means (11), wherein the spring member (pa, 9b) contains 2.9% to 3.5% by mass of Ti, with the balance being copper and inevitable impurities, and has a Vickers hardness equal to or greater than 350.

Abstract: In an Sn-plated strip in which a copper alloy containing 15 to 40 mass % of Zn in terms of an average concentration is used as an alloy strip and the layers of an Sn phase, an Sn—Cu alloy phase and an Ni phase constitute a plating film from the surface to the alloy strip, the Zn concentration of the surface of the Sn phase is adjusted to a range of 0.1 to 5.0 mass %. The alloy may further contain 0.005 to 3.0 mass % in total of an arbitrary constituent selected from Sn, Ag, Pb, Fe, Ni, Mn, Si, Al and Ti. Moreover, the alloy may be a copper base alloy containing 15 to 40 mass % of Zn, 8 to 20 mass % of Ni, 0 to 0.5 mass % of Mn and a balance of Cu and unavoidable impurities, and may further contain 0.005 to 10 mass % in total of the above arbitrary constituent. There is provided a Cu/Ni double layer base reflowed Sn-plated Cu—Zn alloy strip in which generation of whiskers is suppressed.

Abstract: The object of the invention is to provide a reflow Sn-plated copper alloy strip having improved fatigue characteristics by preventing the degradation of fatigue characteristics caused by reflow Sn plating. The invention provides a copper alloy strip having an Sn or Sn alloy plating film formed thereon by electroplating and reflowing treatment, wherein average hydrogen concentration in the strip being about 2 mass ppm or less.

Abstract: A Cu—Zn alloy strip and Sn plating strip thereof having improved thermal peel resistance of Sn Plating is provided. In a Cu—Zn alloy strip comprising 15 to 40% by mass of Zn and a balance of Cu and unavoidable impurities, the total concentration of P, As, Sb and Bi is regulated to 100 ppm by mass or less, the total concentration of Ca and Mg is regulated to 100 ppm by mass or less, and the concentrations of O and S are each regulated to 30 ppm by mass or less.

Abstract: The present invention provides Cu—Ni—Si system alloys for electronic material that with the addition of other alloy elements minimized, simultaneously exhibits enhanced electric conductivity, strength, bendability and stress relaxation performance. There are provided Cu—Ni—Si system alloys comprising 1.2 to 3.5 mass % Ni, Si in a concentration (mass %) of ? to ¼ of Ni concentration (mass %) and the balance Cu and impurities whose total amount is 0.05 mass % or less, the Cu—Ni—Si system alloys having its configuration of crystal grains and width of a precipitate-free zone regulated so as to fall within appropriate ranges by controlling solution treatment conditions, aging treatment conditions and degree of a reduction ratio. Thus, there can be provided copper alloys strip of 55 to 62% IACS electric conductivity and 550 to 700 MPa tensile strength, being free from cracking at 180° bending test of 0 radius and exhibiting a stress relaxation ratio, as measured on heating at 150° C. for 1000 hr, of 30% or less.

Abstract: A Cu—Zn alloy strip and Sn plating strip thereof having improved thermal peel resistance of Sn Plating is provided. In a Cu—Zn alloy strip comprising 15 to 40% by mass of Zn and a balance of Cu and unavoidable impurities, the total concentration of P, As, Sb and Bi is regulated to 100 ppm by mass or less, the total concentration of Ca and Mg is regulated to 100 ppm by mass or less, and the concentrations of O and S are each regulated to 30 ppm by mass or less.

Abstract: In a Sn-plated strip in which a copper base alloy contains 1.0 to 4.5 mass % of Ni, 0.2 to 1.0 mass % of Si and a balance of Cu and unavoidable impurities, an S concentration and a C concentration in a boundary between a plating layer and the base alloy are adjusted to 0.05 mass % or less, respectively. The base alloy may further contain 0.005 to 3.0 mass % in total of at least one selected from the group consisting of Sn, Zn, Mg, Fe, Mn, Co, Ti, Cr, Zr, Al and Ag. There is provided a Cu—Ni—Si base alloy Sn-plated strip in which the resistance to thermal peel of Sn plating has been improved.

Abstract: The object of the invention is to provide a reflow Sn-plated copper alloy strip having improved fatigue characteristics by preventing the degradation of fatigue characteristics caused by reflow Sn plating. The invention provides a copper alloy strip having an Sn or Sn alloy plating film formed thereon by electroplating and reflowing treatment, wherein average hydrogen concentration in the strip being about 2 mass ppm or less.

Abstract: In an Sn-plated strip in which a copper alloy containing 15 to 40 mass % of Zn in terms of an average concentration is used as an alloy strip and the layers of an Sn phase, an Sn—Cu alloy phase and an Ni phase constitute a plating film from the surface to the alloy strip, the Zn concentration of the surface of the Sn phase is adjusted to a range of 0.1 to 5.0 mass %. The alloy may further contain 0.005 to 3.0 mass % in total of an arbitrary constituent selected from Sn, Ag, Pb, Fe, Ni, Mn, Si, Al and Ti. Moreover, the alloy may be a copper base alloy containing 15 to 40 mass % of Zn, 8 to 20 mass % of Ni, 0 to 0.5 mass % of Mn and a balance of Cu and unavoidable impurities, and may further contain 0.005 to 10 mass % in total of the above arbitrary constituent. There is provided a Cu/Ni double layer base reflowed Sn-plated Cu—Zn alloy strip in which generation of whiskers is suppressed.

Abstract: The present invention provides a titanium copper alloy excellent in strength, electrical conductivity and bendability, characterized in that it consists essentially of 1.5 to 2.3% by mass of Ti, balance Cu and inevitable impurities; said alloy having a 0.2% yield strength of 750 MPa or greater; an electrical conductivity of 17% IACS or greater; and a relationship represented by the formula: MBR/t?0.04×YS?30, in which, YS is a 0.2% yield strength (MPa), and MBR/t is a ratio of a minimum bending radius (MBR; mm) for no cracking when said alloy is subjected to W bend test according to JIS H3130 standard along a transverse direction to a rolling direction, to a thickness (t; mm) of test piece.

Abstract: The present invention provides a titanium-copper alloy having high strength and excellent conductivity as a copper alloy comprising: three to four percent by mass of Ti, residual Cu, and inevitable impurities, wherein the area percentage (S(%)) of a Cu—Ti intermetallic compound phase observed in a section perpendicular to the rolling direction is represented by the following formula: S(%)?8.1×[Ti]?17.7 where [Ti] represents the Ti content in percent by mass. A method for producing the same is also provided.

Abstract: A mild steel or Fe—Ni alloy used for a shadow mask has TS/0.2% YS ≦1.03.

Abstract: A method of manufacturing the rolled copper foil by a process which comprises hot rolling an ingot repeating cold rolling and annealing alternately, and finally cold rolling the work to a foil, the annealing immediately preceding the final cold rolling being performed under conditions that enable the annealed recrystallized grains to have a mean grain diameter of not greater than 20 &mgr;m, the reduction ration of the final cold rolling being beyond 90.0%, whereby excellent flex fatigue property and adequate softening property are achieved.

Abstract: A titanium copper alloy having excellent strength and bendability comprising 1.0 to 4.5% by mass of Ti, the balance of copper and inevitable impurities, characterized in that; diameters of the intermetallic compound particles consisting of Cu and Ti precipitated in the alloy are 3 &mgr;m or less; the average number of the intermetallic compound particles having the diameters of 0.2 to 3 &mgr;m is 700 or less per a cross-sectional area of 1000 &mgr;m2 in a transverse direction to a rolling direction; the average grain size measured in the above cross-sectional area is 10 &mgr;m or less; and a tensile strength is 890 MPa or more.

Abstract: A shadow mask blank of Fe—Ni alloy which exhibits excellent uniformity of diameter of apertures formed by perforation with etching for the passage of electron beams, consisting of 34-38% Ni, 0.05-0.5% Mn, 4-20 ppm S, and the balance Fe and no more than specified limits of C, Si, Al, and P, with MnS inclusions 50-1,000 nm in diameter dispersed at the density of at least 1,500/mm2 or simply with etched holes 0.5-10 &mgr;m in diameter emerging at the density of at least 2,000/mm2 when the blank is immersed in a 3% nitric acid-ethyl alcohol solution at 20° C. for 30 seconds. A method of manufacturing the blank comprises hot rolling of a slab of the Fe—Ni alloy, cooling, recrystallization annealing, cold rolling, etc. under controlled conditions: e.g., hot rolling the slab at 950-1,250° C. to 2-6 mm thick, cooling the stock in the range of 900-700° C. at the rate of 0.5° C./second, continuously passing the stock through a heating furnace at 850-1,100° C.