Abstract: A method of manufacturing the rolled copper foil by a process which comprises hot rolling an ingot repeating cold rolling and annealing alternately, and finally cold rolling the work to a foil, the annealing immediately preceding the final cold rolling being performed under conditions that enable the annealed recrystallized grains to have a mean grain diameter of not greater than 20 &mgr;m, the reduction ration of the final cold rolling being beyond 90.0%, whereby excellent flex fatigue property and adequate softening property are achieved.

Abstract: A rolled copper foil for flexible printed circuits comprising, all by weight, from 0.0100 to 0.0400% of Ag, from 0.0100 to 0.0500% of oxygen, not more than 0.0030% in total of one or more elements selected from the group consisting of S, As, Sb, Bi, Se, Te, Pb, and Sn, and the balance copper, the foil having a thickness in the range of 5 to 50 &mgr;m, a half-softening temperature of 120 to 150° C., being capable of retaining a tensile strength of at least 300 N/mm2 at 30° C., and possessing excellent flex fatigue property and adequate softening property. The intensity (I) of the (200) plane determined by X-ray diffraction of the rolled surface after annealing at 200° C. for 30 minutes is I/Io>20 with respect to the X-ray diffraction intensity (Io) of the (200) plane of fine copper powder.

Abstract: A shadow mask blank of Fe—Ni alloy which exhibits excellent uniformity of diameter of apertures formed by perforation with etching for the passage of electron beams, consisting of 34-38% Ni, 0.05-0.5% Mn, 4-20 ppm S, and the balance Fe and no more than specified limits of C, Si, Al, and P, with MnS inclusions 50-1,000 nm in diameter dispersed at the density of at least 1,500/mm2 or simply with etched holes 0.5-10 &mgr;m in diameter emerging at the density of at least 2,000/mm2 when the blank is immersed in a 3% nitric acid-ethyl alcohol solution at 20° C. for 30 seconds. A method of manufacturing the blank comprises hot rolling of a slab of the Fe—Ni alloy, cooling, recrystallization annealing, cold rolling, etc. under controlled conditions: e.g., hot rolling the slab at 950-1,250° C. to 2-6 mm thick, cooling the stock in the range of 900-700° C. at the rate of 0.5° C./second, continuously passing the stock through a heating furnace at 850-1,100° C.

Abstract: A rolled copper foil for flexible printed circuits contains not more than 10 ppm by weight of oxygen and has a softening-temperature rise index T defined as T=0.60[Bi]+0.55[Pb]+0.60[Sb]+0.64 [Se]+1.36[S]+0.32[As]+0.09[Fe]+0.02[Ni]+0.76[Te]+0.48[Sn]+0.16[Ag]+1.24[P] (each symbol in the brackets representing the concentration in ppm by weight of the element) in the range of 4 to 34. The concentrations of the elements are in the ranges of[Bi]<5, [Pb]<10, [Sb]<5, [Se]<5, [S]<15, [As]<5, [Fe]<20, [Ni]<20, [Te]<5, [Sn]<20, [Ag]<50, and [P]<15 (each symbol in the brackets representing the concentration in ppm by weight of the element).