Patents by Inventor Takaaki Hirooka
Takaaki Hirooka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150158242Abstract: An imprint device includes a template provided with a plate-shaped template body and a pattern portion having a predetermined shape formed on a surface of the template body; a template holding mechanism configured to hold the template; a substrate holding mechanism configured to hold a substrate formed with a resin layer made of a photo-curable resin in a state where the pattern portion of the template and the resin layer are in contact with each other; and a light irradiating mechanism configured to irradiate a light in a wavelength range for curing the photo-curable resin. The template allows the light to be incident from a lateral surface of the template body, and the light irradiating mechanism irradiates the light to the resin layer by allowing the light to be incident from the lateral surface of the template body and transmitted through the template body.Type: ApplicationFiled: May 30, 2013Publication date: June 11, 2015Applicant: TOKYO ELECTRON LIMITEDInventors: Kenya Iwasaki, Hiroaki Fusano, Takaaki Hirooka, Takeshi Nagao, Hiroyuki Nakayama
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Publication number: 20130334204Abstract: A novel heat retainer/heat generator is provided using carbon nanotube (CNT) paper, particularly, a plane heating film suitable for use in an integrated gas supply system for supplying a special gas for semiconductor manufacturing. The plane heating film comprises a piece of electrically conductive paper created by mixing carbon nanotubes with pulp fiber, and processing the mixture into a sheet, electrodes disposed in an end area of the electrically conductive paper for supplying power to the electrically conductive film, and heat-resistive insulating films for laminating both sides of the electrically conductive paper. With the employment of carbon nanotubes, the plane heating film is improved in temperature characteristics, heat generating efficiency, and durability.Type: ApplicationFiled: June 13, 2013Publication date: December 19, 2013Inventors: Mitsuyoshi AIZAWA, Takaaki HIROOKA
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Publication number: 20060207971Abstract: An atmospheric transfer chamber, connected to an object processing chamber for processing a target object by using a plasma of a halogen-based gas, for transferring the target object therein, the atmospheric transfer chamber includes a dehumidifying unit for dehumidifying air in the atmospheric transfer chamber. The dehumidifying unit includes a desiccant filter, a cooling unit for cooling the air introduced into the atmospheric transfer chamber, and an air conditioner. The atmospheric transfer chamber is connected to a reaction product removal chamber for removing reaction products of a halogen-based gas attached to the target object, wherein halogen in reaction products attached to the target object is reduced.Type: ApplicationFiled: March 16, 2006Publication date: September 21, 2006Applicant: TOKYO ELECTRON LIMITEDInventors: Tsuyoshi Moriya, Takaaki Hirooka, Akitaka Shimizu, Satoshi Tanaka
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Patent number: 7000416Abstract: a cooling apparatus 110 comprises a primary refrigerant circulating circuit which allows a primary refrigerant CW1 whose temperature is adjusted by a heat exchanger 138 to circulate through an electrode to adjust a temperature of the electrode, a secondary refrigerant circulating circuit which supplies a secondary refrigerant CW2 to the heat exchanger to adjust the temperature of the primary refrigerant, and a freezing circuit 140 which has a first heat exchanger 141 interposed in the secondary refrigerant circulating circuit and which adjust a temperature of the secondary refrigerant by a tertiary refrigerant. The temperature of the primary refrigerant is adjusted by the secondary refrigerant without adjusting the temperature using the freezing circuit. When a temperature of the primary refrigerant is set higher than that of the secondary refrigerant, the temperature of the primary refrigerant can be adjusted only by the secondary refrigerant.Type: GrantFiled: November 29, 2001Date of Patent: February 21, 2006Assignee: Tokyo Electron LimitedInventors: Takaaki Hirooka, Masao Furuya
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Patent number: 6993919Abstract: The electrode temperature control device in a processing apparatus 100 includes a freezing circuit 110 comprising a compressor 148, a condenser 142, an expansion valve 150 and an evaporator 108 with the evaporator disposed inside a lower electrode 106. This electrode temperature control device does not require components such as a coolant tank for storing the coolant, a pump for supplying the coolant to the processing apparatus, a heater for adjusting the temperature of the coolant and a heat exchanger for exchanging heat between a primary coolant and a secondary coolant. Thus, the production cost can be lowered, a reduction in installation area through miniaturization of the apparatus is achieved and more efficient use of energy is achieved as well. In addition, by using CO2 as the coolant, the GWP value can be reduced to approximately 1/8000 to 1/7000 that of Freon.Type: GrantFiled: March 10, 2005Date of Patent: February 7, 2006Assignees: Tokyo Electron Limited, Daikin Industries, Ltd.Inventors: Takaaki Hirooka, Masao Furuya, Shohei Tsutsumi
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Publication number: 20050155373Abstract: The electrode temperature control device in a processing apparatus 100 includes a freezing circuit 110 comprising a compressor 148, a condenser 142, an expansion valve 150 and an evaporator 108 with the evaporator disposed inside a lower electrode 106. This electrode temperature control device does not require components such as a coolant tank for storing the coolant, a pump for supplying the coolant to the processing apparatus, a heater for adjusting the temperature of the coolant and a heat exchanger for exchanging heat between a primary coolant and a secondary coolant. Thus, the production cost can be lowered, a reduction in installation area through miniaturization of the apparatus is achieved and more efficient use of energy is achieved as well. In addition, by using CO2 as the coolant, the GWP value can be reduced to approximately {fraction (1/8000)} to {fraction (1/7000)} that of Freon.Type: ApplicationFiled: March 10, 2005Publication date: July 21, 2005Inventors: Takaaki Hirooka, Masao Furuya, Shohei Tsutsumi
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Publication number: 20040068997Abstract: A cooling apparatus 110 comprises a primary refrigerant circulating circuit which allows a primary refrigerant CW1 whose temperature is adjusted by a heat exchanger 138 to circulate through an electrode to adjust a temperature of the electrode, a secondary refrigerant circulating circuit which supplies a secondary refrigerant CW2 to the heat exchanger to adjust the temperature of the primary refrigerant, and a freezing circuit 140 which has a first heat exchanger 141 interposed in the secondary refrigerant circulating circuit and which adjust a temperature of the secondary refrigerant by a tertiary refrigerant. The temperature of the primary refrigerant is adjusted by the secondary refrigerant without adjusting the temperature using the freezing circuit. When a temperature of the primary refrigerant is set higher than that of the secondary refrigerant, the temperature of the primary refrigerant can be adjusted only by the secondary refrigerant.Type: ApplicationFiled: May 29, 2003Publication date: April 15, 2004Inventors: Takaaki Hirooka, Masao Furuya
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Patent number: 6700089Abstract: An upper electrode unit constituting the upper wall of a processing chamber of an etching device includes a first assembly that includes an upper electrode, a second assembly that supports the first assembly and a third assembly that includes power supply routes. After releasing a second locking mechanism and disengaging the third assembly alone with a removing mechanism, the first assembly is disengaged to perform maintenance on the upper electrode. After locking the second locking mechanism and releasing a first locking mechanism, the removing mechanism is utilized to disengage the second and third assemblies and, as a result, the processing chamber is opened to enable maintenance. By adopting the structure described above, a plasma processing device and a maintenance method thereof, that facilitate maintenance and reduce the workload imposed on the operator, are provided.Type: GrantFiled: September 28, 2001Date of Patent: March 2, 2004Assignee: Tokyo Electron LimitedInventor: Takaaki Hirooka
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Patent number: 6629423Abstract: A refrigerant circulating passage is provided in a bottom electrode in a processing chamber of an etching system. A refrigerant CW1 is fed from a refrigerant tank to the passage via a refrigerant supply pipe. The refrigerant is cooled in a cooler via a refrigerant pipe and is returned to the refrigerant tank. Temperature sensors provided in the refrigerant supply pipe and refrigerant discharge pipe, detect a feed temperature, an inlet temperature, an outlet temperature and a return temperature, respectively. A target differential value is derived from the heat quantity of a wafer. During processing, the temperature of the refrigerant CW1 is controlled, permitting an actual differential value between the inlet and outlet temperatures follow the target differential value which in turn permits the return temperature to follow a target return temperature which is obtained by subtracting the target differential value from a set temperature of the wafer W.Type: GrantFiled: January 28, 2002Date of Patent: October 7, 2003Assignee: Tokyo Electron LimitedInventors: Takaaki Hirooka, Masao Furuya
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Patent number: 6579056Abstract: An object of the present invention is to provide a wafer transfer robot mount/demount cart for simply mounting and demounting a wafer transfer robot which is linearly, substantially horizontally reciprocated in a wafer transfer apparatus to transfer wafers. A pair of mount/demount cart-side rails 9 which can be connected to a pair of wafer transfer apparatus-side guide rails mounted inside a wafer transfer apparatus D is mounted on a raised portion 5 of the mount/demount cart A. A joint rail S is mounted in a gap between the pair of wafer transfer apparatus-side rails and the pair of mount/demount cart-side rails 9 so as to slide a wafer transfer robot R onto the pair of mount/demount cart-side rails 9 via the joint rail S.Type: GrantFiled: June 1, 2001Date of Patent: June 17, 2003Assignees: Tokyo Electron Limited, Shinko Electric Company, Ltd.Inventors: Yoshiaki Sasaki, Takaaki Hirooka, Shuji Hagihara
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Publication number: 20010048871Abstract: An object of the present invention is to provide a wafer transfer robot mount/demount cart for simply mounting and demounting a wafer transfer robot which is linearly, substantially horizontally reciprocated in a wafer transfer apparatus to transfer wafers. A pair of mount/demount cart-side rails 9 which can be connected to a pair of wafer transfer apparatus-side guide rails mounted inside a wafer transfer apparatus D is mounted on a raised portion 5 of the mount/demount cart A. A joint rail S is mounted in a gap between the pair of wafer transfer apparatus-side rails and the pair of mount/demount cart-side rails 9 so as to slide a wafer transfer robot R onto the pair of mount/demount cart-side rails 9 via the joint rail S.Type: ApplicationFiled: June 1, 2001Publication date: December 6, 2001Inventors: Yoshiaki Sasaki, Takaaki Hirooka, Shuji Hagihara
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Patent number: 5799288Abstract: The invention provides a remaining money management system which can predict and manage a demanded cash amount for an ATM. The remaining money management system includes one or more automatic cash transaction apparatus, and a remaining money management apparatus which manages remaining money amounts based on transaction data from the automatic cash transaction apparatus. The remaining money management apparatus includes a storage section for cumulatively storing transaction data from the automatic cash transaction apparatus, and a prediction section for calculating and predicting demanded cash amounts within a designated time for the automatic cash transaction apparatus based on transaction data in the past accumulated in the storage section. The remaining money amount management system can be applied to an apparatus for managing ATMs installed in monetary facilities such as banks.Type: GrantFiled: June 26, 1996Date of Patent: August 25, 1998Assignee: Fujitsu LimitedInventors: Takao Tanaka, Masanori Mukai, Takeshi Nagaoka, Kazuo Nakamura, Takaaki Hirooka, Takuji Shiota, Yoshihiro Kakiuchi, Ryoichi Tabei, Kouichi Matsuo
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Patent number: D459254Type: GrantFiled: October 19, 2000Date of Patent: June 25, 2002Assignee: Tokyo Electron LimitedInventors: Jun Hirose, Eiji Hirose, Jun Ozawa, Takaaki Hirooka