Patents by Inventor Takaaki Miyoshi

Takaaki Miyoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8075805
    Abstract: The present invention relates to a method for producing a conductive masterbatch containing a polyamide resin and a carbonaceous filler. The present invention provides a method for producing a conductive masterbatch which can suppress an increase in resin temperature during extrusion, formation of die drips, and strand breakage and can also significantly increase the output of extruding. The method is achieved by the steps of feeding the carbonaceous filler to a molten first polyamide to melt-knead them together and then feeding a second polyamide to the resulting melt-kneaded product to further melt-knead the second polyamide, the carbonaceous filler, and the first polyamide.
    Type: Grant
    Filed: September 4, 2006
    Date of Patent: December 13, 2011
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Kazuya Noda, Takaaki Miyoshi
  • Patent number: 7935275
    Abstract: A shaped resin article comprising a polyamide (A) (comprising at least two different polyamide components), a polyphenylene ether (B) and a partially hydrogenated block copolymer (C) (obtained by partially hydrogenating a block copolymer comprising an aromatic vinyl polymer block and a conjugated diene polymer block) including a block copolymer (C-1) having a number average molecular weight of from 200,000 to 300,000, wherein (A) is present as a continuous phase in which (B) is dispersed to form a dispersed phase, and (C) is present in the continuous phase of (A) and/or the dispersed phase of (B), wherein the surface area of the polyamide (A) exposed on the overall surface of the shaped resin article is at least 80%, based on the surface area of the shaped resin article.
    Type: Grant
    Filed: April 16, 2004
    Date of Patent: May 3, 2011
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Takaaki Miyoshi, Kazuya Noda, Mitsuhiro Horio, Yuuji Yoshinaga
  • Patent number: 7897687
    Abstract: The present invention provides a thermoplastic resin composition obtained by feeding to an extruder and melt-kneading a polyamide; a polyphenylene ether; and a hydrogenated block copolymer (having a packed bulk density of from 0.15 to 0.25 g/cm3) prepared by hydrogenating a block copolymer comprising at least one polymer block mainly composed of an aromatic vinyl compound and at least one polymer block mainly composed of a conjugated diene compound.
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: March 1, 2011
    Assignee: Asahi Kasei Chemicals Corporation
    Inventor: Takaaki Miyoshi
  • Patent number: 7786206
    Abstract: A thermoplastic resin composition comprising: (A) 30 to 80 parts by mass of a polyamide; (B) 20 to 70 parts by mass of a polyphenylene ether; (C) 0 to 40 parts by mass, based on 100 parts by mass of the total amount of the polyamide (A) and the polyphenylene ether (B), of a rubbery polymer; and (D) 10 to 50 parts by mass, based on 100 parts by mass of the total amount of the polyamide (A) and the polyphenylene ether (B), of a platy inorganic filler having an average particle size of 9 to 20 ?m, and having a particle size ratio (d75%/d25%) of the particle size (d75%) at 75% counted from smaller particle size to the particle size (d25%) at 25% of 1.0 or more and 2.5 or less.
    Type: Grant
    Filed: January 17, 2006
    Date of Patent: August 31, 2010
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Makoto Doki, Takaaki Miyoshi, Kazuya Noda
  • Publication number: 20100173139
    Abstract: The present invention provides a polyamide-polyphenylene ether resin composition comprising a polyamide having an alicyclic structure and composed of dicarboxylic acid units comprising from 20 to 100 mol % of cyclohexanedicarboxylic acid units and diamine units comprising aliphatic diamine units with from 6 to 12 carbon atoms, a polyphenylene ether, and a compatibilizer for a polyamide and a polyphenylene ether.
    Type: Application
    Filed: June 3, 2008
    Publication date: July 8, 2010
    Applicant: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Takaaki Miyoshi, Hiroaki Furukawa
  • Publication number: 20100155673
    Abstract: The present invention relates to a method for producing a conductive masterbatch containing a polyamide resin and a carbonaceous filler. The present invention provides a method for producing a conductive masterbatch which can suppress an increase in resin temperature during extrusion, formation of die drips, and strand breakage and can also significantly increase the output of extruding. The method is achieved by the steps of feeding the carbonaceous filler to a molten first polyamide to melt-knead them together and then feeding a second polyamide to the resulting melt-kneaded product to further melt-knead the second polyamide, the carbonaceous filler, and the first polyamide.
    Type: Application
    Filed: September 4, 2006
    Publication date: June 24, 2010
    Inventors: Kazuya Noda, Takaaki Miyoshi
  • Patent number: 7696274
    Abstract: Disclosed is a conductive resin composition containing a polyamide, a polyphenylene ether, a polyester and a conductive carbon filler. The resin composition has attained excellent conductivity by being added with a small amount of the conductive carbon filler, while being excellent in fluidity and surface luster. Also disclosed is a molded body formed from such a resin composition.
    Type: Grant
    Filed: April 13, 2005
    Date of Patent: April 13, 2010
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Kazunori Terada, Takaaki Miyoshi
  • Publication number: 20090305016
    Abstract: Disclosed is a resin composition comprising an aromatic polyamide having a terminal amino group concentration of 5 to 45 ?moles/g inclusive, polyphenylene ether, a compatibilizing agent for the polyamide and the polyphenylene ether, and a crystal nucleating agent. The composition is extremely useful in an automotive body panel (e.g., an automotive fender), an SMT-compliant component or the like.
    Type: Application
    Filed: November 14, 2006
    Publication date: December 10, 2009
    Inventors: Takaaki Miyoshi, Kazuya Noda
  • Publication number: 20090275682
    Abstract: The present invention relates to a resin composition containing (A) a polyamide having a viscosity number (as measured in the 96% sulfuric acid according to ISO 307 (1997)) of from 50 ml/g to 250 ml/g; (B) a polyphenylene ether; and (C) a phosphinate represented by a particular formula. The resin composition according to the present invention is excellent in flame retardancy, impact resistance and thin-wall moldability and can significantly suppress gas generation during the molding process and substantially inhibit the generation of deposits on a mold during injection molding. As a result, a molded product thereof excellent in surface appearance can be provided.
    Type: Application
    Filed: November 2, 2006
    Publication date: November 5, 2009
    Applicant: Asahi Kasei Chemicals Corporation
    Inventors: Hiroaki Furukawa, Takaaki Miyoshi, Yasukazu Shikano, Makoto Doki
  • Patent number: 7605204
    Abstract: A polyamide-polyphenylene ether based resin composition containing 1 to 20 mass ppm of copper and 0.1 to 2 mass % of titanium dioxide and/or carbon black, wherein a dispersed phase containing polyphenylene ether or polyphenylene ether and a partially hydrogenated block copolymer dispersed in the polyamide has a ratio of a volume average particle diameter to a number average particle diameter of the range of 2.0 to 5.0, and the polyphenylene ether in the resin composition has a weight average molecular weight of the range of 45,000 to 65,000.
    Type: Grant
    Filed: September 17, 2004
    Date of Patent: October 20, 2009
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Takaaki Miyoshi, Makoto Doki, Shu Keat Ooi
  • Publication number: 20090081462
    Abstract: The invention provides a long fiber filler reinforced resin pellet composed of a long fiber filler and a thermoplastic resin blend. In the pellet, the long fiber filler is aligned to form a spiral with a central axis along the longitudinal direction of the pellet, and the pellet has a skin layer part with a lower content of the long fiber filler, and a core part with a higher content of the long fiber filler, thereby the cross-section of the core part is in a range of 30% to 70% of the cross-section of the pellet. The thermoplastic resin blend in the pellet is composed of polyphenylene ether and a thermoplastic resin other than polyphenylene ether.
    Type: Application
    Filed: July 29, 2008
    Publication date: March 26, 2009
    Applicant: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Takaaki Miyoshi, Hiroshi Kamo, Koji Sarukawa, Kazuo Yoshida, Yoshikuni Akiyama, Hiroaki Furukawa, Kazunori Terada
  • Publication number: 20090029138
    Abstract: Disclosed is a resin composition comprising 10 to 90 parts by weight of a mixture of two or more aromatic polyamides having different intrinsic viscosities [?] and 90 to 10 parts by weight of a polyphenylene ether, both relative to 100 parts by weight of the sum total of the aromatic polyamides and the polyphenylene ether. The resin composition is extremely useful for an automotive exterior panel (e.g., a car fender), an SMT-compatible part, a lamp-related part, and the like.
    Type: Application
    Filed: November 14, 2006
    Publication date: January 29, 2009
    Inventors: Takaaki Miyoshi, Kazuya Noda
  • Publication number: 20080152885
    Abstract: A resin composition comprising a polyamide, a polyphenylene ether, an elastomer, and an inorganic filler having a mean particle diameter of 0.05 to 1 ?m, characterized in that the polyamide is a polyamide mixture of two or more polyamides each having a different relative viscosity, the polyamide mixture has a larger content of the polyamide having a higher relative viscosity than that of the polyamide having a lower relative viscosity, and the polyamide mixture has a relative viscosity of 3.3 to 5.0.
    Type: Application
    Filed: November 22, 2005
    Publication date: June 26, 2008
    Inventors: Takaaki Miyoshi, Shukeat Ooi
  • Publication number: 20080146722
    Abstract: A thermoplastic resin composition comprising: (A) 30 to 80 parts by mass of a polyamide; (B) 20 to 70 parts by mass of a polyphenylene ether; (C) 0 to 40 parts by mass, based on 100 parts by mass of the total amount of the polyamide (A) and the polyphenylene ether (B), of a rubbery polymer; and (D) 10 to 50 parts by mass, based on 100 parts by mass of the total amount of the polyamide (A) and the polyphenylene ether (B), of a platy inorganic filler having an average particle size of 9 to 20 ?m, and having a particle size ratio (d75%/d25%) of the particle size (d25%) at 25% counted from smaller particle size to the particle size (d75%) at 75% of 1.0 or more and 2.5 or less.
    Type: Application
    Filed: January 17, 2006
    Publication date: June 19, 2008
    Applicant: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Makoto Doki, Takaaki Miyoshi, Kazuya Noda
  • Patent number: 7358292
    Abstract: The present invention provides a relay block inhibited from occurrence of melt wrinkles and considerably inhibited from deformation of thin wall portions. That is, the present invention provides a relay block obtained by molding a resin composition which contains a polyamide, a polyphenylene ether and a block copolymer comprising at least one polymer block mainly composed of an aromatic vinyl compound and at least one polymer block mainly composed of a conjugated diene compound and which has a melt volume rate of not less than 60 cm3/10 min. and a dimensional change after water absorption of not more than 1.0%.
    Type: Grant
    Filed: April 2, 2003
    Date of Patent: April 15, 2008
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Takaaki Miyoshi, Shigeki Katayama
  • Publication number: 20070235893
    Abstract: The present invention can eliminate a breakage of strands on the way to increase yield, significantly suppress formation of adhered consecutive pellets, and obtain pellets having a low moisture content by a method for producing a resin strand comprising melt-kneading a resin composition in an extruder, extruding a strand-shaped molten resin onto a conveyor, and cooling the resin strand with cooling water, wherein the conveyed strand-shaped molten resin is brought into initial contact with the cooling water at a position downstream ranging from 20% to 70% of the total length of the conveying part of the conveyor.
    Type: Application
    Filed: March 23, 2007
    Publication date: October 11, 2007
    Inventor: Takaaki Miyoshi
  • Publication number: 20070205401
    Abstract: Disclosed is a conductive resin composition containing a polyamide, a polyphenylene ether, a polyester and a conductive carbon filler. The resin composition has attained excellent conductivity by being added with a small amount of the conductive carbon filler, while being excellent in fluidity and surface luster. Also disclosed is a molded body formed from such a resin composition.
    Type: Application
    Filed: April 13, 2005
    Publication date: September 6, 2007
    Applicant: Asahi Kasel Chemicals Corporation
    Inventors: Kazunori Terada, Takaaki Miyoshi
  • Publication number: 20070167570
    Abstract: The present invention provides a thermoplastic resin composition obtained by feeding to an extruder and melt-kneading a polyamide; a polyphenylene ether; and a hydrogenated block copolymer (having a packed bulk density of from 0.15 to 0.25 g/cm3) prepared by hydrogenating a block copolymer comprising at least one polymer block mainly composed of an aromatic vinyl compound and at least one polymer block mainly composed of a conjugated diene compound.
    Type: Application
    Filed: March 29, 2005
    Publication date: July 19, 2007
    Applicant: Asahi Kasei Chemicals Corporation
    Inventor: Takaaki Miyoshi
  • Patent number: 7220795
    Abstract: A resin composition comprising a polyamide, a polyphenylene ether, an impact modifier, and a carbon type filler for an electrically conductive use, the filler residing in a phase of the polyphenylene ether. The resin composition of the present invention has excellent electrical conductivity, fluidity, and an excellent balance of a coefficient of linear expansion and an impact resistance, and generation of fines caused by pelletizing thereof can be largely suppressed when processing of an extrusion thereof is conducted.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: May 22, 2007
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Takaaki Miyoshi, Kazuhiko Hashimoto
  • Publication number: 20070043154
    Abstract: A polyamide-polyphenylene ether based resin composition containing 1 to 20 mass ppm of copper and 0.1 to 2 mass % of titanium dioxide and/or carbon black, wherein a dispersed phase containing polyphenylene ether or polyphenylene ether and a partially hydrogenated block copolymer dispersed in the polyamide has a ratio of a volume average particle diameter to a number average particle diameter of the range of 2.0 to 5.0, and the polyphenylene ether in the resin composition has a weight average molecular weight of the range of 45,000 to 65,000.
    Type: Application
    Filed: September 17, 2004
    Publication date: February 22, 2007
    Applicant: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Takaaki Miyoshi, Makoto Doki, Shu Ooi