Patents by Inventor Takaaki Miyoshi

Takaaki Miyoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060199903
    Abstract: A shaped resin article comprising a polyamide (A) (comprising at least two different polyamide components), a polyphenylene ether (B) and a partially hydrogenated block copolymer (C) (obtained by partially hydrogenating a block copolymer comprising an aromatic vinyl polymer block and a conjugated diene polymer block) including a block copolymer (C-1) having a number average molecular weight of from 200,000 to 300,000, wherein (A) is present as a continuous phase in which (B) is dispersed to form a dispersed phase, and (C) is present in the continuous phase of (A) and/or the dispersed phase of (B), wherein the surface area of the polyamide (A) exposed on the overall surface of the shaped resin article is at least 80%, based on the surface area of the shaped resin article.
    Type: Application
    Filed: April 16, 2004
    Publication date: September 7, 2006
    Inventors: Takaaki Miyoshi, Kazuya Noda, Mitsuhiro Horio, Yuuji Yoshinaga
  • Publication number: 20060020077
    Abstract: A resin composition comprising a polyamide, a polyphenylene ether, an impact modifier, and a carbon type filler for an electrically conductive use, the filler residing in a phase of the polyphenylene ether. The resin composition of the present invention has excellent electrical conductivity, fluidity, and an excellent balance of a coefficient of linear expansion and an impact resistance, and generation of fines caused by pelletizing thereof can be largely suppressed when processing of an extrusion thereof is conducted.
    Type: Application
    Filed: August 15, 2005
    Publication date: January 26, 2006
    Inventors: Takaaki Miyoshi, Kazuhiko Hashimoto
  • Patent number: 6984678
    Abstract: The present invention provides a thermoplastic resin composition characterized by (1) having an excellent appearance even when it is extruded into a molded piece at a high output, (2) retaining its impact strength even after heat exposure, and (3) having less foreign matter generation at the time of production. According to the present invention, in a composition comprising a polyamide, a polyphenylene ether and a block copolymer, a mixture of a block copolymer having a number average molecular weight of less than 120,000 and a block copolymer having a number average molecular weight of 120,000 or more is used as the block copolymer.
    Type: Grant
    Filed: May 21, 2002
    Date of Patent: January 10, 2006
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Matsuyoshi Nakagawa, Takaaki Miyoshi, Kazuya Noda
  • Patent number: 6946084
    Abstract: The present invention provides a thermoplastic resin composition remarkably improved in toughness, particularly, tensile elongation and multiaxial impact strength, while maintaining the flowability and heat resistance of polyamide/polyphenylene ether alloys.
    Type: Grant
    Filed: November 28, 2003
    Date of Patent: September 20, 2005
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Matsuyoshi Nakagawa, Takaaki Miyoshi, Kazuya Noda
  • Publication number: 20050171262
    Abstract: The present invention provides a relay block inhibited from occurrence of melt wrinkles and considerably inhibited from deformation of thin wall portions. That is, the present invention provides a relay block obtained by molding a resin composition which contains a polyamide, a polyphenylene ether and a block copolymer comprising at least one polymer block mainly composed of an aromatic vinyl compound and at least one polymer block mainly composed of a conjugated diene compound and which has a melt volume rate of not less than 60 cm3/10 min. and a dimensional change after water absorption of not more than 1.0%.
    Type: Application
    Filed: April 2, 2003
    Publication date: August 4, 2005
    Applicant: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Takaaki Miyoshi, Shigeki Katayama
  • Patent number: 6919394
    Abstract: An electrically conductive resin composition comprising a polyamide, a polyphenylene ether, an impact modifier and an electrically conductive filler, not less than 50 wt. % of all of the filler used being preliminarily compounded with a mixture containing the impact modifier and the polyphenylene ether, wherein electrical conductivity having a level in which electrostatic coating is possible, a low coefficient of linear expansion and high surface appearance have been accomplished at the same time, and wherein generation of fines caused by pelletizing on extruding has been suppressed.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: July 19, 2005
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Takaaki Miyoshi, Kazuhiko Hashimoto
  • Patent number: 6894100
    Abstract: An electrically conductive resin composition comprising a polyamide, a polyphenylene ether, an impact modifier and an electrically conductive filler, wherein more than 0 and less than 50 wt. % of all of the filler used is preliminarily compounded with a mixture containing the impact modifier and the polyphenylene ether. The resin composition has an excellent balance of electrical conductivity and Dart impact strength at low temperatures, and excellent stiffness at high temperatures, thermal resistance, fluidity, and surface appearance.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: May 17, 2005
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Takaaki Miyoshi, Kazuhiko Hashimoto
  • Patent number: 6866798
    Abstract: The present invention relates to a polyamide composition comprising (A) polyamide, (B) polyphenylene ether, and (C) an ethylene-?-olefin copolymer prepared using a single site catalyst. The resin composition of the present invention can provide a polyamide composition having excellent impact resistance and excellent surface smoothness, and displaying only small dimensional changes after water absorption.
    Type: Grant
    Filed: January 24, 2003
    Date of Patent: March 15, 2005
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Takaaki Miyoshi, Junichi Nakahashi
  • Publication number: 20040157978
    Abstract: The present invention provides a thermoplastic resin composition remarkably improved in toughness, particularly, tensile elongation and multiaxial impact strength, while maintaining the flowability and heat resistance of polyamide/polyphenylene ether alloys.
    Type: Application
    Filed: November 28, 2003
    Publication date: August 12, 2004
    Inventors: Matsuyoshi Nakagawa, Takaaki Miyoshi, Kazuya Noda
  • Publication number: 20040143061
    Abstract: The present invention provides a thermoplastic resin composition characterized by (1) having an excellent appearance even when it is extruded into a molded piece at a high output, (2) retaining its impact strength even after heat exposure, and (3) having less foreign matter generation at the time of production.
    Type: Application
    Filed: November 21, 2003
    Publication date: July 22, 2004
    Inventors: Matsuyoshi Nakagawa, Takaaki Miyoshi, Kazuya Noda
  • Publication number: 20030149178
    Abstract: The present invention relates to a polyamide composition comprising (A) polyamide, (B) polyphenylene ether, and (C) an ethylene-&agr;-olefin copolymer prepared using a single site catalyst. The resin composition of the present invention can provide a polyamide composition having excellent impact resistance and excellent surface smoothness, and displaying only small dimensional changes after water absorption.
    Type: Application
    Filed: January 24, 2003
    Publication date: August 7, 2003
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Takaaki Miyoshi, Junichi Nakahashi
  • Publication number: 20030139518
    Abstract: An electrically conductive resin composition comprising a polyamide, a polyphenylene ether, an impact modifier and an electrically conductive filler, wherein more than 0 and less than 50 wt. % of all of the filler used is preliminarily compounded with a mixture containing the impact modifier and the polyphenylene ether. The resin composition has an excellent balance of electrical conductivity and Dart impact strength at low temperatures, and excellent stiffness at high temperatures, thermal resistance, fluidity, and surface appearance.
    Type: Application
    Filed: October 31, 2002
    Publication date: July 24, 2003
    Inventors: Takaaki Miyoshi, Kazuhiko Hashimoto
  • Publication number: 20030134963
    Abstract: An electrically conductive resin composition comprising a polyamide, a polyphenylene ether, an impact modifier and an electrically conductive filler, not less than 50 wt. % of all of the filler used being preliminarily compounded with a mixture containing the impact modifier and the polyphenylene ether, wherein electrical conductivity having a level in which electrostatic coating is possible, a low coefficient of linear expansion and high surface appearance have been accomplished at the same time, and wherein generation of fines caused by pelletizing on extruding has been suppressed.
    Type: Application
    Filed: October 31, 2002
    Publication date: July 17, 2003
    Inventors: Takaaki Miyoshi, Kazuhiko Hashimoto
  • Publication number: 20030116757
    Abstract: A resin composition comprising a polyamide, a polyphenylene ether, an impact modifier, and a carbon type filler for an electrically conductive use, the filler residing in a phase of the polyphenylene ether. The resin composition of the present invention has excellent electrical conductivity, fluidity, and an excellent balance of a coefficient of linear expansion and an impact resistance, and generation of fines caused by pelletizing thereof can be largely suppressed when processing of an extrusion thereof is conducted.
    Type: Application
    Filed: October 4, 2002
    Publication date: June 26, 2003
    Inventors: Takaaki Miyoshi, Kazuhiko Hashimoto
  • Publication number: 20010031831
    Abstract: The present invention relates to a polyamide composition comprising (A) polyamide, (B) polyphenylene ether, and (C) an ethylene-&agr;-olefin copolymer prepared using a single site catalyst. The resin composition of the present invention can provide a polyamide composition having excellent impact resistance and excellent surface smoothness, and displaying only small dimensional changes after water absorption.
    Type: Application
    Filed: February 14, 2001
    Publication date: October 18, 2001
    Inventors: Takaaki Miyoshi, Junichi Nakahashi
  • Patent number: 5854639
    Abstract: The data transferred from a computer to the accelerator are stored in the transfer data storage region together with the transfer flag that indicates the destination of transfer. The transfer data determination unit determines the destination of data transfer from the transfer flag, and the graphic data that do not need to be extended are directly written into the graphic data storage means of the accelerator, and the graphic data that do need to be extended and the control data are written into the shared memory. The graphic data are extended by the graphic data extension processing unit and are written into the graphic data storage unit. The interrupt control unit and the interrupt processing unit work to change over the writing of graphic data into the graphic data storage unit and bring the output from the transfer data determination unit into synchronism with the output from the graphic data extension processing unit.
    Type: Grant
    Filed: August 19, 1997
    Date of Patent: December 29, 1998
    Assignee: Fujitsu Limited
    Inventor: Takaaki Miyoshi