Abstract: The pad clip 14d is arranged between pins 12, 12 made to bridge an outer body portion and an inner body portion constituting a caliper and the two pads 10b, 11b. An engaging plate portion 27 is engaged with the respective pins 12, 12 without play. Press pieces 28, 28 formed by folding to bend both end portions in a rotational direction of the engaging plate portion in directions in which the more proximate to the two pads 10b, 11b, the more directed to an outer side in a radial direction are brought into elastic contact with outer peripheral edges of both end portions in a rotational direction of pressure plates 13b, 13b of the two pads 10b, 11b. Thereby, amounts of projecting portions in correspondence with the respective press pieces 28, 28 in a state of a material plate before being folded to bend from the engaging plate portion 27 can be restrained.

Abstract: A semiconductor package includes a substrate for mounting and fixing a semiconductor chip thereon and a connecting pattern. The substrate is provided with an elongate opening formed therein. The semiconductor chip is fixed with its surface being mounted on the substrate and with its electrode being aligned within the elongate opening. The electrode of the semiconductor chip is electrically connected to the connecting pattern via wires through the elongate opening. The elongate opening and the wires are sealed with resin.

Abstract: A semiconductor package includes a substrate for mounting and fixing a semiconductor chip thereon and a connecting pattern. The substrate is provided with an elongate opening formed therein. The semiconductor chip is fixed with its surface being mounted on the substrate and with its electrode being aligned within the elongate opening. The electrode of the semiconductor chip is electrically connected to the connecting pattern via wires through the elongate opening. The elongate opening and the wires are sealed with resin.

Abstract: First to third inner locking pieces 12 to 14 are provided at both ends of an inner shim plate 2a in a radial direction of a rotor so as to be bent toward the pad, respectively. First to third outer locking pieces 15, 17 and 18 are provided at both ends of an outer shim plate 1a in the radial direction of the rotor so as to be bent in the same direction as the locking pieces 12 to 14. An inner shim plate 2a is mounted on a pressure plate 10, and the first to third outer locking pieces 15, 17 and 18 are superimposed on the first to third inner locking pieces 12 to 14 such that main body parts 7 and 8 of the respective shim plates 2a and 1a are locked in the pad in the axial direction of the rotor.

Abstract: A semiconductor package for three-dimensional mounting is provided. The package includes a wiring substrate having a first surface on which a first wiring pattern is formed and a second surface on which a second wiring pattern is formed, the first wiring pattern and second wiring pattern being electrically connected to each other; a semiconductor chip placed on the first surface of the wiring substrate and electrically connected to the first wiring pattern; a sealing resin layer sealing the semiconductor chip and the first wiring pattern; a thickness direction wire passing through the sealing resin layer in a thickness direction and having one end electrically connected to the first wiring pattern and the other end exposed at the surface of the sealing resin layer; and a lower surface connecting electrode formed on the second surface of the wiring substrate and electrically connected to the second wiring pattern.

Abstract: A method of manufacturing a semiconductor package including a substrate for mounting and fixing a semiconductor ship thereon and a connecting pattern, includes providing the substrate with an elongate opening formed therein, fixing the semiconductor chip with its surface mounted on the substrate and with its electrode being aligned within the elongate opening, and electrically an electrode of the semiconductor chip to the connecting pattern via wires through the elongate opening. The elongate opening and the wires then are sealed with resin.

Abstract: A semiconductor package for three-dimensional mounting is provided. The package includes a wiring substrate having a first surface on which a first wiring pattern is formed and a second surface on which a second wiring pattern is formed, the first wiring pattern and second wiring pattern being electrically connected to each other; a semiconductor chip placed on the first surface of the wiring substrate and electrically connected to the first wiring pattern; a sealing resin layer sealing the semiconductor chip and the first wiring pattern; a thickness direction wire passing through the sealing resin layer in a thickness direction and having one end electrically connected to the first wiring pattern and the other end exposed at the surface of the sealing resin layer; and a lower surface connecting electrode formed on the second surface of the wiring substrate and electrically connected to the second wiring pattern.

Abstract: A semiconductor package for three-dimensional mounting is provided. The package includes a wiring substrate having a first surface on which a first wiring pattern is formed and a second surface on which a second wiring pattern is formed, the first wiring pattern and second wiring pattern being electrically connected to each other; a semiconductor chip placed on the first surface of the wiring substrate and electrically connected to the first wiring pattern; a sealing resin layer sealing the semiconductor chip and the first wiring pattern; a thickness direction wire passing through the sealing resin layer in a thickness direction and having one end electrically connected to the first wiring pattern and the other end exposed at the surface of the sealing resin layer; and a lower surface connecting electrode formed on the second surface of the wiring substrate and electrically connected to the second wiring pattern.

Abstract: A semiconductor package is comprised of a substrate for mounting and fixing a semiconductor element thereon and a connecting pattern. The substrate is provided with a through hall formed therein. The semiconductor element is fixed with its surface where the element is formed being mounted on the substrate and with its electrode being within the through hall. The electrode of the semiconductor element is electrically connected to the connecting pattern via wires through the through hall. The through hall and the wires are sealed with resin.

Abstract: A semiconductor package is comprised of a substrate for mounting and fixing a semiconductor element thereon and a connecting pattern. The substrate is provided with a through hall formed therein. The semiconductor element is fixed with its surface where the element is formed being mounted on the substrate and with its electrode being within the through hall. The electrode of the semiconductor element is electrically connected to the connecting pattern via wires through the through hall. The through hall and the wires are sealed with resin.

Abstract: A semiconductor package for three-dimensional mounting is provided. The package includes a wiring substrate having a first surface on which a first wiring pattern is formed and a second surface on which a second wiring pattern is formed, the first wiring pattern and second wiring pattern being electrically connected to each other; a semiconductor chip placed on the first surface of the wiring substrate and electrically connected to the first wiring pattern; a sealing resin layer sealing the semiconductor chip and the first wiring pattern; a thickness direction wire passing through the sealing resin layer in a thickness direction and having one end electrically connected to the first wiring pattern and the other end exposed at the surface of the sealing resin layer; and a lower surface connecting electrode formed on the second surface of the wiring substrate and electrically connected to the second wiring pattern.

Abstract: A file access system includes a file opening unit which opens a given file within an external storage device when a file opening request is issued by an application program. A determining unit determines whether a given file within the storage device has encrypted data when a reading request is issued by the application program. When the given file is determined as having the encrypted data, a reading unit receives a fixed length of the encrypted data from the given file and generates a block of decrypted data of the same size as the fixed length by performing a decryption wherein a position of the fixed length of the decrypted data is determined by a position indicated by the reading request.

Abstract: A semiconductor package is comprised of a substrate for mounting and fixing a semiconductor element thereon and a connecting pattern. The substrate is provided with a through hall formed therein. The semiconductor element is fixed with its surface where the element is formed being mounted on the substrate and with its electrode being within the through hall. The electrode of the semiconductor element is electrically connected to the connecting pattern via wires through the through hall. The through hall and the wires are sealed with resin.

Abstract: The malfunction of a vibrator as a drawback of a conventional independent vibrator type portable terminal is obviated. A communication system of a portable communication terminal comprises a portable communication terminal capable of movably communicating with another communication terminal via radio communication with a base station, and peripheral equipment which performs a predetermined operation via radio communication with the portable communication terminal. The portable communication terminal transmits a radio signal to the peripheral equipment by using a time division multiplex access system for exchanging signals by putting data on a time slot as the radio communication between the portable communication terminal and the peripheral equipment and using the time slot in a time zone excluding other time zones in which the portable communication terminal is transmitting a radio signal to the base station.

Abstract: A semiconductor package is includes a substrate for mounting and fixing a semiconductor chip thereon and a connecting pattern. The substrate is provided with a elongate opening formed therein. The semiconductor chip is fixed with its surface being mounted on the substrate and with its electrode being aligned within the elongate opening. The electrode of the semiconductor chip is electrically connected to the connecting pattern via wires elongate opening the through. The elongate opening and the wires are sealed with resin.