Abstract: A radiation imaging system is configured by a collimator 30A including a detector 21 with a discrete detection pixel corresponding with a pixel and a plurality of radiation passages 31 and looks into a plurality of detectors 21 through one radiation passage 31 to set a step width of rotation around a rotation center axis X1 only for an angle ?p made by lines provided by connecting a center detector 21 of the radiation passage 31 and the adjacent two detectors 21. In the case of generating a flat plane projection image for one direction, radio-graphing is carried out on a projection image in a plurality of predetermined angle positions (??p, 0, +?p) in the circumferential direction of the rotation center axis X1 and thereby one plane projection image is obtained.

Abstract: A ?-ray signal processing section 60? determines a detection time of a ? ray based on a ?-ray detection signal outputted from a semiconductor radiation detector for detecting the ? ray, and determines the energy of the ? ray. Then, a time correction circuit 70 obtains, based on the energy of the ? ray, a detection value of the detection time that corresponds to the energy of the ? ray from a time correction table indicating the relationship between the energy of the ? ray and the correction value of the detection time of the ? ray, and corrects the detection time according to the obtained correction value of the detection time. Coincidence counting is performed on the ? ray in a coincidence counting circuit 80 based on the corrected detection time.

Abstract: Disclosed herein is a radiation imaging apparatus and radiation-imaging-apparatus-based nuclear medicine diagnosis apparatus having a collimator in which a plurality of rectangular through-holes are arranged in a grid pattern and separated by septa is rotated through a predetermined angle as viewed from above in relation to the layout of a plurality of rectangular detectors that are arranged in a grid pattern. The predetermined angle ranges from 20 to 70 degree and more preferably from 30 deg to 60 deg. With this configuration, the influence of sensitivity variations (moire patterns) that are included in an image picked up due to interference with a collimator when pixel type detectors are used is eliminated.

Abstract: A processing circuit, which carries out coincidence counting, acquires calibration data so that time delays of ?-ray detection signals from radiation detectors coincide with one another. A technique for acquiring calibration data faster and easily is provided to attain high time precision and respond to multi-channeling of detectors. A signal from a test signal generator is sent to signal processing apparatuses and coincidence count events are generated as a test. The events generated are processed by a delay time control apparatus and a variable delay circuit is controlled to improve the accuracy of coincidence counting.

Abstract: The semiconductor radiological detector 1 minimizes a dead space resulting from the draw-out of a signal line from an electrode and which allows a number of semiconductor devices to be densely arranged to improve sensitivity and spatial resolution. The semiconductor radiological detector 1 comprises a semiconductor device 2, an anode 3 attached to one surface of the semiconductor device 2, and a cathode 4 attached to the other surface of the semiconductor device 2. A signal line 5 is provided on the anode 3; the signal line 5 extends straight from the anode 3 and is connected to an X axis wire 12. Another signal line 13 is provided on the cathode 4; the signal line 13 extends straight from the cathode 4 and is connected to a Y axis wire 14.

Abstract: It is an object of the invention to provide a stable and linear energy reference against a variation in an amount of electronic noise or the like. The present invention is an energy calibration method detecting irradiation of radiation with predetermined energy from a calibration radiation source using a plurality of radiation detectors having a peak value distribution whose mode and mean value are different and performing calibration so that mean values become identical within the peak value distributions of the respective radiation detectors obtained through irradiation of radiation with predetermined energy from the calibration radiation source.

Abstract: A ?-ray signal processing section 60? determines a detection time of a ? ray based on a ?-ray detection signal outputted from a semiconductor radiation detector for detecting the ? ray, and determines the energy of the ? ray. Then, a time correction circuit 70 obtains, based on the energy of the ? ray, a detection value of the detection time that corresponds to the energy of the ? ray from a time correction table indicating the relationship between the energy of the ? ray and the correction value of the detection time of the ? ray, and corrects the detection time according to the obtained correction value of the detection time. Coincidence counting is performed on the ? ray in a coincidence counting circuit 80 based on the corrected detection time.

Abstract: A radiological imaging apparatus comprising a semiconductor detector unit in which a plurality of semiconductor radiation detection elements are installed on a detector mounted substrate in a matrix to constitute a detector unit. A plurality of detector units are releasably mounted on a fixing substrate. This mounting is carried out mating a coupling screw with a threaded hole formed in the detector mounted substrate, the coupling screw being inserted through a through-hole formed in the fixing substrate. The detector mounted substrate is provided with a pair of positioning pins. The positioning pins are inserted into positioning holes, respectively, formed in the fixing substrate, to position the detector unit.

Abstract: A radiation imaging apparatus with high spatial resolution including semiconductor radiation detectors arranged on a wiring board capable of detecting ?-rays by separating their positions in the direction of incidence of ?-rays is provided. A semiconductor radiation detector is constructed by including five semiconductor devices made up of, for example, CdTe rectangular parallelepiped plates, a cathode electrode on one side of the semiconductor device, an anode electrode on the other side of the semiconductor device and an insulator for coating five semiconductor detection devices from the outside. The semiconductor radiation detector is mounted on a wiring board using an anode pin and a cathode pin.

Abstract: A radiological imaging apparatus allowing semiconductor radiation detectors to be easily replaced with new ones and densely arranged. Terminals (31cjk) and (33cjk) are provided on a bottom surface of a detector aggregate (40mn) including a plurality of semiconductor radiation detectors (1); the terminals is connected to electrodes (3 and 4) of the detectors (1). A plurality of zero insertion force connectors (56) are provided on a connecting device (33jk) installed on a support substrate (32h). The terminals (31cjk and 33cjk) are detachably attached to the zero insertion force connectors (56) to mount the detector aggregates (40mn) that are the semiconductor radiation detectors (1), on the support substrate (32h). When the detector aggregates (40mn) are attached to the zero insertion force connectors (56), since no frictional force acts on the terminals, the size of the gap between the detector aggregates (40mn) is reduced.

Abstract: A radiological imaging apparatus allowing semiconductor radiation detectors to be easily replaced with new ones and densely arranged. Terminals (31cjk) and (33cjk) are provided on a bottom surface of a detector aggregate (40mn) including a plurality of semiconductor radiation detectors (1); the terminals is connected to electrodes (3 and 4) of the detectors (1). A plurality of zero insertion force connectors (56) are provided on a connecting device (33jk) installed on a support substrate (32h). The terminals (31cjk and 33cjk) are detachably attached to the zero insertion force connectors (56) to mount the detector aggregates (40mn) that are the semiconductor radiation detectors (1), on the support substrate (32h). When the detector aggregates (40mn) are attached to the zero insertion force connectors (56), since no frictional force acts on the terminals, the size of the gap between the detector aggregates (40mn) is reduced.

Abstract: A radiological imaging apparatus capable of improving an arrangement density of semiconductor radiation detectors and detector units thereof, each detector unit consisting of a plurality of combined substrates having a detector substrate which includes semiconductor radiation detectors and a signal processing substrate which includes integrated circuits, housed in a housing. The detector substrate protrudes outward from an opening of the housing. A plurality of detector units are attached to a ring-shaped unit support section in a circumferential direction thereof. More specifically, the detector substrate protrudes inward from the unit support section and the housing is attached to the unit support section.

Abstract: A nuclear medicine diagnostic apparatus is provided that can improve time resolution and energy resolution and diagnosing accuracy by enhancing radiation detectors in terms of moisture-proofing and dust-proofing effects while efficiently cooling the radiation detectors. The apparatus has a first region A in which radiation detectors are to be accommodated, and a second region B in which signal processors are to be accommodated. These regions are provided inside a housing member 5 via an adiabatic member 7. The housing member 5 also has a ventilation port 8 formed to communicate with the first region A and equipped with an anti-dust filter. Ventilation holes 34 are formed to communicate with the first region B and serving as entrances for cooling air. Unit fans 33 serve as exits for the cooling air.

Abstract: The semiconductor radiological detector 1 minimizes a dead space resulting from the draw-out of a signal line from an electrode and which allows a number of semiconductor devices to be densely arranged to improve sensitivity and spatial resolution. The semiconductor radiological detector 1 comprises a semiconductor device 2, an anode 3 attached to one surface of the semiconductor device 2, and a cathode 4 attached to the other surface of the semiconductor device 2. A signal line 5 is provided on the anode 3; the signal line 5 extends straight from the anode 3 and is connected to an X axis wire 12. Another signal line 13 is provided on the cathode 4; the signal line 13 extends straight from the cathode 4 and is connected to a Y axis wire 14.

Abstract: A radiological imaging apparatus comprising a semiconductor detector unit in which a plurality of semiconductor radiation detection elements are installed on a detector mounted substrate in a matrix to constitute a detector unit. A plurality of detector units are releasably mounted on a fixing substrate. This mounting is carried out mating a coupling screw with a threaded hole formed in the detector mounted substrate, the coupling screw being inserted through a through-hole formed in the fixing substrate. The detector mounted substrate is provided with a pair of positioning pins. The positioning pins are inserted into positioning holes, respectively, formed in the fixing substrate, to position the detector unit.

Abstract: The radiological imaging system which can improve an energy resolution and perform a diagnosis with high accuracy includes a bed for carrying an examinee H, first and second imaging apparatuses and disposed along the longitudinal direction of the bed. The first imaging apparatus has a plurality of semiconductor radiation detectors for detecting ?-rays emitted from the examinee H, arranged around the bed, the second imaging apparatus has an X-ray source for emitting X-rays to the examinee H and a radiation detector for detecting X-rays which have been emitted from the X-ray source and passed through the examinee H, and the bed is shared by the first imaging apparatus and the second imaging apparatus.

Abstract: A radiological imaging apparatus allowing semiconductor radiation detectors to be easily replaced with new ones and densely arranged. Terminals (31cjk) and (33cjk) are provided on a bottom surface of a detector aggregate (40mn) including a plurality of semiconductor radiation detectors (1); the terminals is connected to electrodes (3 and 4) of the detectors (1). A plurality of zero insertion force connectors (56) are provided on a connecting device (33jk) installed on a support substrate (32h). The terminals (31cjk and 33cjk) are detachably attached to the zero insertion force connectors (56) to mount the detector aggregates (40mn) that are the semiconductor radiation detectors (1), on the support substrate (32h). When the detector aggregates (40mn) are attached to the zero insertion force connectors (56), since no frictional force acts on the terminals, the size of the gap between the detector aggregates (40mn) is reduced.

Abstract: A processing circuit, which carries out coincidence counting, acquires calibration data so that time delays of ?-ray detection signals from radiation detectors coincide with one another. A technique for acquiring calibration data faster and easily is provided to attain high time precision and respond to multi-channeling of detectors. A signal from a test signal generator is sent to signal processing apparatuses and coincidence count events are generated as a test. The events generated are processed by a delay time control apparatus and a variable delay circuit is controlled to improve the accuracy of coincidence counting.

Abstract: A processing circuit, which carries out coincidence counting, acquires calibration data so that time delays of ?-ray detection signals from radiation detectors coincide with one another. A technique for acquiring calibration data faster and easily is provided to attain high time precision and respond to multi-channeling of detectors. A signal from a test signal generator is sent to signal processing apparatuses and coincidence count events are generated as a test. The events generated are processed by a delay time control apparatus and a variable delay circuit is controlled to improve the accuracy of coincidence counting.

Abstract: A ?-ray signal processing section 60? determines a detection time of a ? ray based on a ?-ray detection signal outputted from a semiconductor radiation detector for detecting the ? ray, and determines the energy of the ? ray. Then, a time correction circuit 70 obtains, based on the energy of the ? ray, a detection value of the detection time that corresponds to the energy of the ? ray from a time correction table indicating the relationship between the energy of the ? ray and the correction value of the detection time of the ? ray, and corrects the detection time according to the obtained correction value of the detection time. Coincidence counting is performed on the ? ray in a coincidence counting circuit 80 based on the corrected detection time.