Abstract: A positron emission tomography apparatus installs a plurality of detector units in the circumference of a bed. The detector unit installs a plurality of combined substrates including detectors, analogue ASICs, and a digital ASIC and a voltage adjustment device inside a housing. A partition plate installed inside the housing separates the region inside the housing into a first region installed with the combined substrates and a second region installed with the voltage adjustment device. The partition plate blocks noise generated in the voltage adjustment device so as not to affect ?-ray detection signals outputted from the detectors, thereby preventing the effect of the noise generated in the voltage adjustment device toward ?-ray detection signals and shortening the examination time.

Abstract: In a radiological inspection apparatus, a subject lying on a bed is located in the center of an imaging device. A large number of radiological detectors are arranged around the subject. The radiological detectors are arranged in multiple stages in a direction normal to the body axis of the subject. The radiological detectors are sequentially arranged in three stages in a direction away from the subject. A large number of combinations each of the three radiological detectors are installed like a ring so as to surround the subject. If circuits in the radiological detectors detect a plurality of signals considered to be coincident, the system selects one of the radiological detectors which is closer to the subject depending on the energy of radiation.

Abstract: A radiological imaging apparatus allowing semiconductor radiation detectors to be easily replaced with new ones and densely arranged. Terminals (31cjk) and (33cjk) are provided on a bottom surface of a detector aggregate (40mn) including a plurality of semiconductor radiation detectors (1); the terminals is connected to electrodes (3 and 4) of the detectors (1). A plurality of zero insertion force connectors (56) are provided on a connecting device (33jk) installed on a support substrate (32h). The terminals (31cjk and 33cjk) are detachably attached to the zero insertion force connectors (56) to mount the detector aggregates (40mn) that are the semiconductor radiation detectors (1), on the support substrate (32h). When the detector aggregates (40mn) are attached to the zero insertion force connectors (56), since no frictional force acts on the terminals, the size of the gap between the detector aggregates (40mn) is reduced.

Abstract: A radiological imaging apparatus including a bed which supports an object to be examined and an imaging apparatus, wherein the imaging apparatus has a unit substrate including a first substrate including a radiation detector and a second substrate including a signal processing apparatus to which detection signals of the radiation detector are inputted and the first substrate is connected through a connector, and is provided with a heat insulating member of separating mutually a first area where the radiation detector is disposed from a second area where the signal processing apparatus is disposed, both of which are formed inside the imaging apparatus.

Abstract: Disclosed herein is a radiation imaging apparatus and radiation-imaging-apparatus-based nuclear medicine diagnosis apparatus having a collimator in which a plurality of rectangular through-holes are arranged in a grid pattern and separated by septa is rotated through a predetermined angle as viewed from above in relation to the layout of a plurality of rectangular detectors that are arranged in a grid pattern. The predetermined angle ranges from 20 to 70 degree and more preferably from 30 deg to 60 deg. With this configuration, the influence of sensitivity variations (moire patterns) that are included in an image picked up due to interference with a collimator when pixel type detectors are used is eliminated.

Abstract: A processing circuit, which carries out coincidence counting, acquires calibration data so that time delays of ?-ray detection signals from radiation detectors coincide with one another. A technique for acquiring calibration data faster and easily is provided to attain high time precision and respond to multi-channeling of detectors. A signal from a test signal generator is sent to signal processing apparatuses and coincidence count events are generated as a test. The events generated are processed by a delay time control apparatus and a variable delay circuit is controlled to improve the accuracy of coincidence counting.

Abstract: In a radiological imaging apparatus, a radiation detecting section includes semiconductor detectors arranged in four columns and four rows. Each of the semiconductor detectors includes a semiconductor base material, and an anode electrode film (first electrode film) and a cathode electrode film (second electrode film) lying opposite each other so as to sandwich the semiconductor base material between them. A first conductive member is installed on each first electrode film. Second electrode films of four semiconductor detectors within a row are connected together using one second conductive member. A shaping amplifier connected to the first conductive members with a wire executes a waveform shaping process using a shaping time shorter than that of a shaping amplifier connected to the second conductive member with a wire; the first conductive members are provided for the four semiconductor detectors within a column.

Abstract: A radiological imaging apparatus comprising a semiconductor detector unit in which a plurality of semiconductor radiation detection elements are installed on a detector mounted substrate in a matrix to constitute a detector unit. A plurality of detector units are releasably mounted on a fixing substrate. This mounting is carried out mating a coupling screw with a threaded hole formed in the detector mounted substrate, the coupling screw being inserted through a through-hole formed in the fixing substrate. The detector mounted substrate is provided with a pair of positioning pins. The positioning pins are inserted into positioning holes, respectively, formed in the fixing substrate, to position the detector unit.

Abstract: A radiological imaging apparatus capable of improving an arrangement density of semiconductor radiation detectors and detector units thereof, each detector unit consisting of a plurality of combined substrates having a detector substrate which includes semiconductor radiation detectors and a signal processing substrate which includes integrated circuits, housed in a housing. The detector substrate protrudes outward from an opening of the housing. A plurality of detector units are attached to a ring-shaped unit support section in a circumferential direction thereof. More specifically, the detector substrate protrudes inward from the unit support section and the housing is attached to the unit support section.

Abstract: A ?-ray signal processing section 60? determines a detection time of a ? ray based on a ?-ray detection signal outputted from a semiconductor radiation detector for detecting the ? ray, and determines the energy of the ? ray. Then, a time correction circuit 70 obtains, based on the energy of the ? ray, a detection value of the detection time that corresponds to the energy of the ? ray from a time correction table indicating the relationship between the energy of the ? ray and the correction value of the detection time of the ? ray, and corrects the detection time according to the obtained correction value of the detection time. Coincidence counting is performed on the ? ray in a coincidence counting circuit 80 based on the corrected detection time.

Abstract: A radiation imaging apparatus with high spatial resolution including semiconductor radiation detectors arranged on a wiring board capable of detecting ?-rays by separating their positions in the direction of incidence of ?-rays is provided. A semiconductor radiation detector is constructed by including five semiconductor devices made up of, for example, CdTe rectangular parallelepiped plates, a cathode electrode on one side of the semiconductor device, an anode electrode on the other side of the semiconductor device and an insulator for coating five semiconductor detection devices from the outside. The semiconductor radiation detector is mounted on a wiring board using an anode pin and a cathode pin.

Abstract: The semiconductor radiological detector 1 minimizes a dead space resulting from the draw-out of a signal line from an electrode and which allows a number of semiconductor devices to be densely arranged to improve sensitivity and spatial resolution. The semiconductor radiological detector 1 comprises a semiconductor device 2, an anode 3 attached to one surface of the semiconductor device 2, and a cathode 4 attached to the other surface of the semiconductor device 2. A signal line 5 is provided on the anode 3; the signal line 5 extends straight from the anode 3 and is connected to an X axis wire 12. Another signal line 13 is provided on the cathode 4; the signal line 13 extends straight from the cathode 4 and is connected to a Y axis wire 14.

Abstract: Semiconductor radiation detectors are cooled to improve accuracy in radiation detection. Semiconductor radiation detectors are cooled by heat conductance through heat conductive boards. In addition, the semiconductor radiation detectors are cooled by cooling medium filled or supplied to a heat insulating body covering the semiconductor radiation detectors.

Abstract: The radiological imaging system which can improve an energy resolution and perform a diagnosis with high accuracy includes a bed for carrying an examinee H, first and second imaging apparatuses and disposed along the longitudinal direction of the bed. The first imaging apparatus has a plurality of semiconductor radiation detectors for detecting ?-rays emitted from the examinee H, arranged around the bed, the second imaging apparatus has an X-ray source for emitting X-rays to the examinee H and a radiation detector for detecting X-rays which have been emitted from the X-ray source and passed through the examinee H, and the bed is shared by the first imaging apparatus and the second imaging apparatus.