Abstract: A numerical controller controls a three-axis machine tool that machines a workpiece, mounted on a table, with at least three linear axes. The numerical controller includes a workpiece mounting error compensation unit that compensates a mounting error caused when the workpiece is mounted. The workpiece mounting error compensation unit performs an error compensation with respect to an instructed linear-axis position with amounting error which is set beforehand, in order to keep a position with respect to the workpiece at a tool center point position, based on the instructed linear-axis position of the three linear axes to obtain a compensated linear-axis position. The three linear axes are driven based on the obtained compensated linear-axis position.

Abstract: Production efficiency of a substrate (in particular, a substrate on which a SiC epitaxial film is formed) is improved and formation of the film inside a gas supply port is suppressed. This is accomplished by a substrate processing apparatus including a reaction chamber configured to accommodate a plurality of substrates 14, a heating part installed to surround the reaction chamber and configured to heat the reaction chamber, and a first gas supply pipe 60 extending in the reaction chamber, wherein the first gas supply pipe 60 includes a first gas supply port 68 configured to inject a first gas toward the plurality of substrates 14, and first shielding walls installed at both sides of the first gas supply port to expose the first gas supply port 68, the first shielding walls extending toward the plurality of substrates 14 from the first gas supply port 68.

Abstract: An image forming apparatus is disclosed that includes a liquid discharger including a liquid discharge head configured to discharge a droplet of liquid so as to form an image. The liquid discharge head includes multiple individual channels communicating with corresponding nozzles from which the liquid is discharged; a common channel configured to supply the liquid to the individual channels; a deformable member configured to form at least one wall face of the common channel; and a vibration damping member formed of a viscoelastic material, the vibration member being provided in contact with the deformable member.

Abstract: The present invention provides a processing method for converting slag ejected from a converter in a copper smelting process to raw materials for iron manufacture. The processing method is for converter slag containing 1 mass % or more of Cu produced in a copper smelting process. The processing method comprises a step of charging the converter slag in a reduction furnace, and a step of conducting a heat reduction of a zinc content and a copper content contained in the slag and removing a reduced zinc by volatilization in the reduction furnace. The removal of the reduced zinc by volatilization is conducted in a condition in which an air fuel ratio of a volume of air blowing to an input of a reductant is controlled to 0.25 to 1.0.

Abstract: An image forming apparatus creates a drive waveform containing a first pulse to discharge the droplet and a second pulse to cause a liquid to flow within a recording head. A data creation part creates data to select a first or second droplet discharge pulse. The first droplet discharge pulse contains the first pulse and the second pulse. The second droplet discharge pulse does not contain the second pulse. When the first or second droplet discharge pulse is selected in a subsequent drive period and when neither the first nor second droplet discharge pulse is selected in a current drive period, the second pulse is selected in the current drive period when selecting the second droplet discharge pulse in the subsequent drive period, and the second pulse is not selected in the current drive period when selecting the first droplet discharge pulse in the subsequent drive period.

Abstract: A numerical controller for controlling a multi-axis machine calculates an axis-dependent translation error amount and an axis-dependent rotation error amount based on a command axis position. Translation and rotation compensation amounts are calculated based on the axis dependent translation and rotation error amounts, respectively. The translation and rotation compensation amounts are added to command linear and rotary axis positions, respectively. Three linear axes and three rotary axes are driven to the added positions, individually. Thus, there is provided a numerical controller that enables even machining with a side face of a tool or boring to be in commanded tool position and posture (orientation) in the multi-axis machine.

Abstract: A numerical controller for controlling a multi-axis machine tool having three linear axes and three rotating axes obtains an interpolated tool direction vector by interpolating a tool direction command and computes multiple solutions for three rotating axes from the vector. The three rotating axis positions are computed by synthesizing these multiple solutions. The three linear axis positions on a machine coordinate system are computed by adding to the interpolated tool center point position the product of the interpolated tool direction vector, or a verified tool direction vector based on the three rotating axis positions determined by the rotating axis position computing means, and a tool length compensation amount. The three rotating axes are moved to the positions computed above and the three linear axes are moved to the positions computed above.

Abstract: A liquid dispenser head includes nozzles, pressure chambers, an energy generator, a shared chamber, a vibration member, and a specific wall portion. The nozzles discharge liquid. Each of the pressure chambers communicates with a corresponding one of the nozzles. The energy generator, provided for each of the pressure chambers, generates energy for pressurizing liquid in the pressure chamber. The shared chamber supplies liquid to the pressure chambers. The vibration member, forming a wall of each one of the pressure chambers, includes an energy-transmitting area configured to transmit the energy generated by the energy generator to each one of the pressure chambers. The specific wall portion, constituting at least a part of the same wall, or a different wall, of each of the pressure chambers, has a structural compliance set greater than a compression compliance of liquid in the pressure chamber.

Abstract: A numerical controller controlling a 5-axis machine tool compensates setting error that arises when a workpiece is set on the table. Error in the three linear axes and the two rotation axes are compensated using preset error amounts to keep the calculated tool position and tool direction in a command coordinate system. If a trigonometric function used for error compensation has a plurality of solution sets, the solution set closest to the tool direction in the command coordinate system is selected from the plurality of solution sets and used as the positions of the two rotation axes compensated in the above error compensation.

Abstract: An image forming apparatus including a liquid discharge head unit which in turn includes (a) a liquid discharge head including multiple liquid chambers connected to multiple nozzles for discharging liquid droplets, and a common liquid chamber including a liquid supply opening and a liquid discharge opening, to supply a liquid to the multiple liquid chambers, (b) a sub tank including a liquid container, connected to the liquid supply opening to store the liquid to be supplied to the liquid discharge head, (c) a tank connected to the liquid discharge opening to store the liquid used for filling the liquid discharge head, and (d) a mechanism to return the liquid in the tank to the sub tank.

Abstract: Provided is a method of manufacturing a semiconductor device using a substrate processing apparatus including a reaction chamber in which a plurality of substrates are stacked at a predetermined distance; a first gas supply nozzle installed to extend to a region in which the plurality of substrates are stacked; a second gas supply nozzle installed to extend to a different position from a position at which the first gas supply nozzle is installed in the region in which the plurality of substrates are stacked; a first branch nozzle installed at the first gas supply nozzle in a direction parallel to major surfaces of the plurality of substrates, at least one line of which is branched in a direction of the second gas supply nozzle, and including at least one first gas supply port; and a second branch nozzle installed at the second gas supply nozzle in the direction parallel to the major surfaces of the plurality of substrates, at least one line of which is branched in a direction of the first gas supply nozzle, a

Abstract: At a low temperature of 500° C. to 700° C., the concentration of atomic oxygen is controlled in a wafer stacked direction, and the thickness distribution of oxide films is kept uniform in the wafer stacked direction. A semiconductor device manufacturing method includes a process of oxidizing substrates by supplying oxygen-containing gas and hydrogen-containing gas through a mixing part from an end side of a substrate arrangement region where the substrates are arranged inside the process chamber so that the gases flow toward the other end side of the substrate arrangement region, and supplying hydrogen-containing gas from mid-flow locations corresponding to the substrate arrangement region.

Abstract: There are provided a substrate processing apparatus, a method of manufacturing a semiconductor device, and a method of manufacturing a substrate, for growing a SiC epitaxial film at a high-temperature condition. The substrate processing apparatus comprises: a reaction chamber; a first gas supply system configured to supply at least a gas containing silicon atoms and a gas containing chlorine atoms, or a gas containing silicon and chlorine atoms; a second gas supply system configured to supply at least a reducing gas; a third gas supply system configured to supply at least a gas containing carbon atoms; a first gas supply nozzle connected to the first gas supply system or the first and third gas supply systems; a second gas supply nozzle connected to the second gas supply system or the second and third gas supply systems; and a controller configured to control the first to third gas supply systems.

Abstract: Provided is a substrate processing apparatus, a semiconductor device manufacturing method, and a substrate manufacturing method. The substrate processing apparatus comprises: a reaction chamber configured to process substrates; a first gas supply system configured to supply at least a silicon-containing gas and a chlorine-containing gas or at least a gas containing silicon and chlorine; a first gas supply unit connected to the first gas supply system; a second gas supply system configured to supply at least a reducing gas; a second gas supply unit connected to the second gas supply system; a third gas supply system configured to supply at least a carbon-containing gas and connected to at least one of the first gas supply unit and the second gas supply unit; and a control unit configured to control the first to third gas supply systems.

Abstract: A method for processing converter slag produced in copper smelting includes feeding the converter slag into a reducing furnace, reducing zinc and copper contained in the converter slag by heating and removing the reduced zinc through volatilization in a reducing furnace. The slag discharged from the converter is transformed into a raw material for iron making.

Abstract: A substrate processing apparatus includes: a reaction tube configured to process a plurality of substrates; a heater configured to heat the inside of the reaction tube; a holder configured to arrange and hold the plurality of substrates within the reaction tube; a first nozzle disposed in an area corresponding to a substrate arrangement area where the plurality of substrates are arranged, and configured to supply hydrogen-containing gas from a plurality of locations of the area into the reaction tube; a second nozzle disposed in the area corresponding to the substrate arrangement area, and configured to supply oxygen-containing gas from a plurality of locations of the area into the reaction tube; an exhaust outlet configured to exhaust the inside of the reaction tube; and a pressure controller configured to control pressure inside the reaction tube to be lower than atmospheric pressure, wherein the first nozzle is provided with a plurality of first gas ejection holes, and the second nozzle is provided with as

Abstract: An image forming apparatus is disclosed that includes a liquid discharger including a liquid discharge head configured to discharge a droplet of liquid so as to form an image. The liquid discharge head includes multiple individual channels communicating with corresponding nozzles from which the liquid is discharged; a common channel configured to supply the liquid to the individual channels; a deformable member configured to form at least one wall face of the common channel; and a vibration damping member formed of a viscoelastic material, the vibration member being provided in contact with the deformable member.

Abstract: A numerical controller controlling a 5-axis machine tool compensates setting error that arises when a workpiece is set on the table. Error in the three linear axes and the two rotation axes are compensated using preset error amounts to keep the calculated tool position and tool direction in a command coordinate system. If a trigonometric function used for error compensation has a plurality of solution sets, the solution set closest to the tool direction in the command coordinate system is selected from the plurality of solution sets and used as the positions of the two rotation axes compensated in the above error compensation.

Abstract: There is provided a semiconductor processing apparatus comprising a processing tube for housing a substrate support member that supports a plurality of substrates stacked at a prescribed pitch in a vertical direction; a gas supply part that extends in a direction in which the substrates are stacked in the processing tube and that has a plurality of gas supply openings; an exhaust part that opens onto the processing tube; a gas rectifying plate that is disposed in a space between a penumbra of the substrates supported on the substrate support member and an inner wall of the processing tube, and that extends from the gas supply part in a circumferential direction of the processing tube and in the direction in which the substrates are stacked; and a gas flow regulating part disposed in a space in the processing tube that is above a top-most gas supply opening and a top-most substrate and in a space in the processing tube that is below a bottom-most substrate and a bottom-most gas supply opening.

Abstract: An image forming apparatus including a liquid discharge head unit which in turn includes (a) a liquid discharge head including multiple liquid chambers connected to multiple nozzles for discharging liquid droplets, and a common liquid chamber including a liquid supply opening and a liquid discharge opening, to supply a liquid to the multiple liquid chambers, (b) a sub tank including a liquid container, connected to the liquid supply opening to store the liquid to be supplied to the liquid discharge head, (c) a tank connected to the liquid discharge opening to store the liquid used for filling the liquid discharge head, and (d) a mechanism to return the liquid in the tank to the sub tank.