Abstract: According to one embodiment, a nonvolatile memory device includes first and second word lines, first and second bit lines, memory cells each including a resistance change memory element, a global word line including a first global word line portion including a first end portion, a global bit line including a first global bit line portion including a second end portion. The first and second word lines and the first global bit line portion have a first line width and a first line thickness, the first and second bit lines and the first global word line portion have a second line width and a second line thickness.

Abstract: According to one embodiment, a storage device includes: a memory cell including a storage component to which a plurality of data values are allowed to set in response to a plurality of resistance values of the storage component and a selector connected in series to the storage component; a word line configured to provide a signal to select the memory cell; a bit line configured to receive a data signal from the memory cell; a first conversion circuit configured to nonlinearly convert a first current, generated in response to the data signal input to the bit line, into a first voltage; and a comparison circuit configured to compare the first voltage, converted by the first conversion circuit, with a plurality of reference voltages.

Abstract: According to one embodiment, a memory device includes a memory cell including a resistance change memory element and a selector element, a word line, a bit line connected to one end of the memory cell, an operational amplifier including a non-inverting input connected to the bit line, an output circuit including a first terminal connected to an output of the operational amplifier, a second terminal connected to the bit line, and a charge/discharge circuit including a capacitor, a charge circuit and a discharge circuit, each including one end connected to an inverting input of the operational amplifier. At the time of falling of a write voltage for the memory cell, a potential of the other end of the memory cell is set higher than a potential of the other end of the discharge circuit.

Abstract: A semiconductor memory device comprises a memory cell including a resistance change memory element and a write control circuit for setting a resistance state of the resistance change memory element. The write control circuit applies a first voltage signal when setting the resistance change memory element. The first voltage signal rises in a first rise time from a first reference voltage to a first predetermined voltage, maintains at the first predetermined voltage for a first predetermined time period, and then falls from the first predetermined voltage to the first reference voltage in a first falling time. The write circuit applies a second or third voltage signal according to the state being set in the resistance change memory element. In some examples, a predetermined voltage level of the third signal is applied for a period of time longer than a predetermined level of the first and second voltage signals.

Abstract: A semiconductor memory device comprises a memory cell including a resistance change memory element and a write control circuit for setting a resistance state of the resistance change memory element. The write control circuit applies a first voltage signal when setting the resistance change memory element. The first voltage signal rises in a first rise time from a first reference voltage to a first predetermined voltage, maintains at the first predetermined voltage for a first predetermined time period, and then falls from the first predetermined voltage to the first reference voltage in a first falling time. The write circuit applies a second or third voltage signal according to the state being set in the resistance change memory element. In some examples, a predetermined voltage level of the third signal is applied for a period of time longer than a predetermined level of the first and second voltage signals.

Abstract: A semiconductor memory device includes a first conductor extending in a first direction and a second conductor extending in a second direction and disposed above the first conductor in a third direction. Third and fourth conductors extend in the first direction and adjacent to each other in the second direction. The third and fourth conductors are above the second conductor. A fifth conductor includes a variable resistance unit and is between the first and second conductors. A sixth conductor includes a variable resistance unit and is between the third and second conductors. A seventh conductor includes a variable resistance unit and is between the fourth and second conductors. A center point of the fifth conductor along a width of the fifth conductor is does not fully overlap with either of the sixth or seventh conductors along the third direction.

Abstract: A semiconductor memory device includes a first conductor extending in a first direction and a second conductor extending in a second direction and disposed above the first conductor in a third direction. Third and fourth conductors extend in the first direction and adjacent to each other in the second direction. The third and fourth conductors are above the second conductor. A fifth conductor includes a variable resistance unit and is between the first and second conductors. A sixth conductor includes a variable resistance unit and is between the third and second conductors. A seventh conductor includes a variable resistance unit and is between the fourth and second conductors. A center point of the fifth conductor along a width of the fifth conductor is does not fully overlap with either of the sixth or seventh conductors along the third direction.