Abstract: A grinding apparatus and a grinding method of a composite substrate including resin, by which loading of a grinding wheel can be suppressed in grinding of a large-sized composite substrate including resin, and with which grinding can be effectively performed with high precision. This method for grinding a front surface of a composite substrate formed with a resin substrate embedded with at least one of a semiconductor device chip and an electrode, includes: bringing at least a part of a grinding member for grinding the front surface of the composite substrate into contact with the front surface; supplying water to at least one of a contacting part or a non-contacting part between the front surface of the composite substrate and the grinding member; and grinding the front surface of the composite substrate simultaneously with the supplying water.

Abstract: A fuse puller accommodating structure includes a puller main body, a puller accommodating section, an accommodating side protrusion provided within the puller accommodating section, a puller side protrusion provided on the puller main body, wherein the puller side protrusion is configured to be locked to the accommodating side protrusion, and a pushing-up section provided at a bottom of the puller accommodating section, wherein the pushing-up section is configured to bias a forward end of the puller main body accommodated in the puller accommodating section in a pushing-up direction in order to push the puller side protrusion against the accommodating side protrusion, wherein the forward end is oriented forward with respect to an inserting direction, and wherein the pushing-up direction is opposite to the inserting direction.

Abstract: A method for manufacturing a semiconductor device includes chucking in which a semiconductor device wafer is attached to an upper surface of a chuck mechanism with its device surface down; and edge trimming performed after the chucking, wherein the edge trimming comprises: rotating the semiconductor device water horizontally by the chuck mechanism; rotating a rotating blade horizontally by a vertical spindle to which an ultrasonic wave is applied and trimming a circumferential side surface of the semiconductor device wafer by the rotating blade.

Abstract: Provided is a substrate grinding device including: a work table; a first grinding wheel; and a second grinding wheel, wherein the work table is configured to rotate while sucking and holding a substrate, the first grinding wheel and the second grinding wheel are cup wheel type wheels, and provided at positions where the first grinding wheel and the second grinding wheel can be simultaneously in contact with the substrate rotating, the first grinding wheel and the second grinding wheel being configured to grind the substrate rotating, while rotating, and the work table is configured to be able to move a rotation center of the substrate from a first grinding position within a grinding range of the first grinding wheel to a second grinding position within a grinding range of the second grinding wheel.

Abstract: There is provided a method for manufacturing a semiconductor device, including: attracting a semiconductor device wafer by a chuck mechanism and rotating the semiconductor device wafer horizontally; rotating a rotary blade horizontally by a vertical spindle to which ultrasonic waves are applied; trimming an outer peripheral end portion of the semiconductor device wafer that is horizontally rotating by the rotary blade that is horizontally rotating, to form a groove in the outer peripheral end portion; correcting a tip shape of the rotary blade that is horizontally rotating by a blade-forming grinding wheel during the trimming; and grinding one main surface of the semiconductor device wafer that is horizontally rotating by a cup grinding wheel that is horizontally rotating after the trimming.

Abstract: There is provided a grinding method for grinding a substrate with a grinding wheel. A dissimilar material portion made of a material different from a main constituent material of the substrate is embedded in the substrate. The grinding method includes: lowering the grinding wheel toward the substrate rotating while rotating the grinding wheel, and grinding the substrate by the grinding wheel; continuously imaging a processed surface of the substrate by an image sensor during grinding the substrate; analyzing an amount of exposure of the dissimilar material portion based on data of an image captured by the image sensor; and continuously grinding the substrate from a state where the dissimilar material portion begins to be exposed to a stage where the amount of exposure of the dissimilar material portion reaches a predetermined set value, based on the amount of exposure analyzed.

Abstract: A dressing apparatus includes a dresser provided in a polishing apparatus for polishing a board-like work by relative movement between the work and a polishing pad while bringing the polishing pad into contact with the work, the dresser having a dressing surface that slides relative to a polishing surface of the polishing pad to dress the polishing pad; a dresser drive member that rotates the dresser; a high-pressure water generating device that supplies high-pressure water pressurized to 1 to 15 MPa; and a high-pressure water injection nozzle that injects the high-pressure water toward the dressing surface rotating.

Abstract: A fuse puller accommodating structure includes a puller main body, a puller accommodating section, an accommodating side protrusion provided within the puller accommodating section, a puller side protrusion provided on the puller main body, wherein the puller side protrusion is configured to be locked to the accommodating side protrusion, and a pushing-up section provided at a bottom of the puller accommodating section, wherein the pushing-up section is configured to bias a forward end of the puller main body accommodated in the puller accommodating section in a pushing-up direction in order to push the puller side protrusion against the accommodating side protrusion, wherein the forward end is oriented forward with respect to an inserting direction, and wherein the pushing-up direction is opposite to the inserting direction.

Abstract: An electrostatic attachment chuck includes: a substrate; a synthetic resin sheet joined to one main surface of the substrate; and at least a pair of electrodes disposed in the synthetic resin sheet. The synthetic resin sheet includes a planarized and ground surface serving as a surface on which a semiconductor wafer is abutted.

Abstract: An electrical connection box includes: a frame main body; a lid assembled to the frame main body; a plate-shaped member sandwiched between the frame main body and the lid; and a bus bar which has a main body arranged on a surface of the plate-shaped member and a terminal portion bent from the main body toward the lid. The bus bar has a protrusion protruding from a side surface of the terminal portion. The lid has a bus bar holding portion into which the terminal portion is inserted. In the bus bar holding portion, a wall portion opposing the side surface of the terminal portion has a holding groove into which the protrusion is press-fitted.

Abstract: An embodiment of the present disclosure provides a method of manufacturing a semiconductor apparatus, including the following steps.

Abstract: A grinding apparatus and a grinding method of a composite substrate including resin, by which loading of a grinding wheel can be suppressed in grinding of a large-sized composite substrate including resin, and with which grinding can be effectively performed with high precision. This method for grinding a front surface of a composite substrate formed with a resin substrate embedded with at least one of a semiconductor device chip and an electrode, includes: bringing at least a part of a grinding member for grinding the front surface of the composite substrate into contact with the front surface; supplying water to at least one of a contacting part or a non-contacting part between the front surface of the composite substrate and the grinding member; and grinding the front surface of the composite substrate simultaneously with the supplying water.

Abstract: Provided is a substrate grinding device including: a work table rotatable with the work table sucking and holding a substrate; a cup wheel-type first grinding wheel configured to grind the rotating substrate while rotating, the substrate being held by the work table; and a cup wheel-type second grinding wheel configured to grind the substrate along with grinding by the first grinding wheel while rotating in a close vicinity of the substrate.

Abstract: A method for manufacturing a semiconductor device includes chucking in which a semiconductor device wafer is attached to an upper surface of a chuck mechanism with its device surface down; and edge trimming performed after the chucking, wherein the edge trimming comprises: rotating the semiconductor device water horizontally by the chuck mechanism; rotating a rotating blade horizontally by a vertical spindle to which an ultrasonic wave is applied and trimming a circumferential side surface of the semiconductor device wafer by the rotating blade.

Abstract: A tuning fork terminal includes: a pair of press fit pieces having end surfaces facing each other with a gap into which a mating terminal is inserted; a connecting portion that connects one-end sides of the pair of press fit pieces; and a connection end surface that smoothly connects the one-end sides of each of the end surfaces of the pair of press fit pieces and the end surface of the gap side of the connecting portion. The connection end surface is formed by hollowing the one-end side of the end surface of the press fit piece more than the other part of the end surface, and the one-end side of each of the end surfaces of the pair of press fit pieces and the end surface of the connecting portion are smoothly connected in an arc shape to form a curved surface.

Abstract: An embodiment of the present disclosure provides a method of manufacturing a semiconductor apparatus, including the following steps.

Abstract: An electrical connection box includes: a frame main body; a lid assembled to the frame main body; a plate-shaped member sandwiched between the frame main body and the lid; and a bus bar which has a main body arranged on a surface of the plate-shaped member and a terminal portion bent from the main body toward the lid. The bus bar has a protrusion protruding from a side surface of the terminal portion. The lid has a bus bar holding portion into which the terminal portion is inserted. In the bus bar holding portion, a wall portion opposing the side surface of the terminal portion has a holding groove into which the protrusion is press-fitted.

Abstract: A tuning fork terminal includes: a pair of press fit pieces having end surfaces facing each other with a gap into which a mating terminal is inserted; a connecting portion that connects one-end sides of the pair of press fit pieces; and a connection end surface that smoothly connects the one-end sides of each of the end surfaces of the pair of press fit pieces and the end surface of the gap side of the connecting portion. The connection end surface is formed by hollowing the one-end side of the end surface of the press fit piece more than the other part of the end surface, and the one-end side of each of the end surfaces of the pair of press fit pieces and the end surface of the connecting portion are smoothly connected in an arc shape to form a curved surface.

Abstract: An electrostatic attachment chuck includes: a substrate; a synthetic resin sheet joined to one main surface of the substrate; and at least a pair of electrodes disposed in the synthetic resin sheet. The synthetic resin sheet includes a planarized and ground surface serving as a surface on which a semiconductor wafer is abutted.