Patents by Inventor Takahiko Yoshizawa

Takahiko Yoshizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing the same
    Publication number: 20050151266
    Abstract: An insulating film having dielectric constant not greater than 2.7 is provided above a semiconductor substrate. A via comprises a conductive material, which is provided in a via hole formed in the insulating film. A first interconnection comprises a conductive material, which is provided in an interconnection trench formed on the via in the insulating film. A first high-density region is formed in the insulating film, and has a cylindrical shape surrounding the via, an inner surface common to the boundary of the via hole, and a film density higher than the insulating film.
    Type: Application
    Filed: March 23, 2004
    Publication date: July 14, 2005
    Inventors: Takahiko Yoshizawa, Noriaki Matsunaga, Naofumi Nakamura