Patents by Inventor Takahiro Fujiwara

Takahiro Fujiwara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040063999
    Abstract: An object of the present invention is to provide a process for the production of an optically active amino alcohol, particularly an optically active amino alcohol of a trans-form, being excellent in economy and efficiency, and suitable for industry using easily available and less expensive materials.
    Type: Application
    Filed: September 4, 2003
    Publication date: April 1, 2004
    Applicant: Takasago International Corporation
    Inventors: Takahiro Fujiwara, Hideki Nara, Tsukasa Sotoguchi
  • Patent number: 5601228
    Abstract: The invention provides a solder-precipitating composition containing Sn-Pb alloy powder and an organic acid salt of Pb as essential components, and capable of precipitating solder as a result of substitution between Sn contained in the Sn-Pb alloy powder and Pb contained in the organic acid salt of Pb. Further, the invention provides a mounting method including the steps of supplying a conductor on a board with a solder-precipitating composition which contains Sn-Pb alloy powder and an organic acid salt of Pb as essential components, heating the solder-precipitating composition supplied on the conductor, to precipitate solder on the conductor and pre-coat the conductor with solder, as a result of substitution reaction between Sn in the Sn-Pb alloy powder and Pb ions in the organic acid salt of Pb, mounting a device on the solder pre-coated conductor, and melting the solder layer to securely mount the device on the conductor.
    Type: Grant
    Filed: August 2, 1995
    Date of Patent: February 11, 1997
    Assignees: The Furukawa Electric Co., Ltd., Harima Chemicals, Inc.
    Inventors: Takao Fukunaga, Kazuhito Higasa, Hirokazu Shiroishi, Seishi Kumamoto, Takahiro Fujiwara, Noriko Katayama
  • Patent number: 5453582
    Abstract: A large number of pads, to which component leads are to be soldered, are formed on an insulating substrate so as to constitute a pad array. Colder layers are precoated on the pads. Each of the pads has a component lead mounting portion where a component lead is to be mounted, and a component lead non-mounting portion where no component lead is to be mounted. The component lead non-mounting portion includes a wide part having a width greater than that of the component lead mounting portion.
    Type: Grant
    Filed: March 1, 1995
    Date of Patent: September 26, 1995
    Assignees: The Furukawa Electric Co., Ltd., Harima Chemicals, Inc.
    Inventors: Toshiaki Amano, Kazuhito Hikasa, Seishi Kumamoto, Takahiro Fujiwara