Patents by Inventor Takahiro Ishibashi
Takahiro Ishibashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230274122Abstract: To provide a coil that has satisfactory characteristics even when the coil is used by being attached to or embedded in a tire, the coil forming an RFID tag in combination with a substrate on which an RF chip and a pattern coil connected to the RF chip are mounted. A coil 30 is held in a housing 75 accommodating a substrate 90 and is wound around the substrate 90. A first end of the coil 30 extends from the substrate 90 and forms a first element 50 of an antenna. A second end of the coil 30 extends from the substrate 90 and forms a second element 60 of the antenna. The first element 50 and the second element 60 are arranged in parallel to each other, and the first element 50 has a longer extension length than the second element 60. The coil 30 and a pattern coil 40 form a coupling transformer 20. The number of windings in the coil 30 is smaller than the number of windings in the pattern coil 40.Type: ApplicationFiled: August 17, 2021Publication date: August 31, 2023Inventors: Shiro SUGIMURA, Takahiro ISHIBASHI
-
Patent number: 9911714Abstract: A lead frame includes adjacent die pads which lie adjacent to each other; grounding leads extended from the adjacent die pads; a connecting bar by which the grounding leads extended from the adjacent die pads are interconnected. The grounding leads and the connecting bar are formed to be thinner at one surface than a maximum thickness of leads of the lead frame, the grounding leads extended from the adjacent die pads are aligned on a common axis while providing the connecting bar between the grounding leads, and a support projection is provided at the one surface on the connecting bar in the common axis.Type: GrantFiled: January 2, 2014Date of Patent: March 6, 2018Assignee: MITSUI HIGH-TEC, INC.Inventor: Takahiro Ishibashi
-
Publication number: 20180040543Abstract: Provided is a lead frame including: one or more solder bonding regions containing copper material or copper plating; and a molding resin adhesion region containing a copper oxide film. The solder bonding regions are exposed on a surface of the lead frame. Further, provided is a lead frame manufacturing method including: forming a resist film in a molding resin adhesion region that is included in a surface of a lead frame member made of copper, or that is included in a surface of a copper-plated lead frame member; forming a plating film by performing a metal plating process on one or more solder bonding regions included in the surface of the lead frame member; removing the resist film; and forming a copper oxide film by oxidizing the molding resin adhesion region.Type: ApplicationFiled: October 17, 2017Publication date: February 8, 2018Inventors: Takahiro ISHIBASHI, Kimihiko KUBO, Ryota FURUNO, Takaaki KATSUDA
-
Patent number: 9852929Abstract: A lead frame includes a lead frame body processed in a predetermined shape, and including a notched part provided at an end of the lead frame body, the notched part being used as a starting point of tape-removing, a resin leakproof tape stuck on a back surface of the lead frame body, and a region of a periphery of the notched part in the back surface of the lead frame body, the region being reduced in a strength of bonding between the resin leakproof tape and the lead frame body is reduced relative to other region.Type: GrantFiled: October 16, 2015Date of Patent: December 26, 2017Assignee: MITSUI HIGH-TEC, INC.Inventor: Takahiro Ishibashi
-
Patent number: 9847173Abstract: A multilayer ceramic capacitor connected to an output electrode and an input electrode of a mounting substrate includes a laminated body. In the laminating direction of the laminated body, the shortest distance from an outer first internal electrode to the surface of an external electrode on the side closer to a first principal surface, and the shortest distance from an outer second internal electrode to the surface of an external electrode on the side closer to a second principal surface are each about 40 ?m or less. In the width direction of the laminated body, the shortest distance from an end of an internal electrode to the surface of the external electrode on the side closer to a first side surface, and the shortest distance from an end of an internal electrode to the surface of the external electrode on the side closer to a second side surface are each about 40 ?m or less.Type: GrantFiled: June 17, 2016Date of Patent: December 19, 2017Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Masaaki Taniguchi, Yasuji Yamamoto, Takahiro Ishibashi
-
Patent number: 9824960Abstract: Provided is a lead frame including: one or more solder bonding regions containing copper material or copper plating; and a molding resin adhesion region containing a copper oxide film. The solder bonding regions are exposed on a surface of the lead frame. Further, provided is a lead frame manufacturing method including: forming a resist film in a molding resin adhesion region that is included in a surface of a lead frame member made of copper, or that is included in a surface of a copper-plated lead frame member; forming a plating film by performing a metal plating process on one or more solder bonding regions included in the surface of the lead frame member; removing the resist film; and forming a copper oxide film by oxidizing the molding resin adhesion region.Type: GrantFiled: July 18, 2016Date of Patent: November 21, 2017Assignee: Mitsui High-tec, Inc.Inventors: Takahiro Ishibashi, Kimihiko Kubo, Ryota Furuno, Takaaki Katsuda
-
Publication number: 20170025329Abstract: Provided is a lead frame including: one or more solder bonding regions containing copper material or copper plating; and a molding resin adhesion region containing a copper oxide film. The solder bonding regions are exposed on a surface of the lead frame. Further, provided is a lead frame manufacturing method including: forming a resist film in a molding resin adhesion region that is included in a surface of a lead frame member made of copper, or that is included in a surface of a copper-plated lead frame member; forming a plating film by performing a metal plating process on one or more solder bonding regions included in the surface of the lead frame member; removing the resist film; and forming a copper oxide film by oxidizing the molding resin adhesion region.Type: ApplicationFiled: July 18, 2016Publication date: January 26, 2017Inventors: Takahiro ISHIBASHI, Kimihiko KUBO, Ryota FURUNO, Takaaki KATSUDA
-
Publication number: 20160381802Abstract: A multilayer ceramic capacitor connected to an output electrode and an input electrode of a mounting substrate includes a laminated body. In the laminating direction of the laminated body, the shortest distance from an outer first internal electrode to the surface of an external electrode on the side closer to a first principal surface, and the shortest distance from an outer second internal electrode to the surface of an external electrode on the side closer to a second principal surface are each about 40 ?m or less. In the width direction of the laminated body, the shortest distance from an end of an internal electrode to the surface of the external electrode on the side closer to a first side surface, and the shortest distance from an end of an internal electrode to the surface of the external electrode on the side closer to a second side surface are each about 40 ?m or less.Type: ApplicationFiled: June 17, 2016Publication date: December 29, 2016Inventors: Masaaki TANIGUCHI, Yasuji YAMAMOTO, Takahiro ISHIBASHI
-
Patent number: 9349612Abstract: A lead frame includes a plurality of unit lead frames arranged in a matrix. Leads of adjacent ones of the unit lead frames are connected via a connecting bar, in which a longitudinal connecting bar and a transverse connecting bar are crossed at a crossing part. The lead frame further includes a dicing part including the connecting bar and a part of the leads, to be cut along a dicing line, a half-etching part formed along the dicing part, and being smaller in width than the dicing part, and a strength retention part formed in the half-etching part and extended from the crossing part of the connecting bar at least to an end lead located closest to the crossing part among the leads of the unit lead frame adjacent to the crossing part.Type: GrantFiled: January 2, 2014Date of Patent: May 24, 2016Assignee: MITSUI HIGH-TEC, INC.Inventor: Takahiro Ishibashi
-
Publication number: 20160118321Abstract: A lead frame includes a lead frame body processed in a predetermined shape, and including a notched part provided at an end of the lead frame body, the notched part being used as a starting point of tape-removing, a resin leakproof tape stuck on a back surface of the lead frame body, and a region of a periphery of the notched part in the back surface of the lead frame body, the region being reduced in a strength of bonding between the resin leakproof tape and the lead frame body is reduced relative to other region.Type: ApplicationFiled: October 16, 2015Publication date: April 28, 2016Applicant: MITSUI HIGH-TEC , INC.Inventor: Takahiro ISHIBASHI
-
Publication number: 20140196938Abstract: A lead frame includes a plurality of unit lead frames arranged in a matrix. Leads of adjacent ones of the unit lead frames are connected via a connecting bar, in which a longitudinal connecting bar and a transverse connecting bar are crossed at a crossing part. The lead frame further includes a dicing part including the connecting bar and a part of the leads, to be cut along a dicing line, a half-etching part formed along the dicing part, and being smaller in width than the dicing part, and a strength retention part formed in the half-etching part and extended from the crossing part of the connecting bar at least to an end lead located closest to the crossing part among the leads of the unit lead frame adjacent to the crossing part.Type: ApplicationFiled: January 2, 2014Publication date: July 17, 2014Applicant: MITSUI HIGH-TEC , INC.Inventor: Takahiro ISHIBASHI
-
Publication number: 20140192506Abstract: A lead frame includes adjacent die pads which lie adjacent to each other; grounding leads extended from the adjacent die pads; a connecting bar by which the grounding leads extended from the adjacent die pads are interconnected. The grounding leads and the connecting bar are formed to be thinner at one surface than a maximum thickness of leads of the lead frame, the grounding leads extended from the adjacent die pads are aligned on a common axis while providing the connecting bar between the grounding leads, and a support projection is provided at the one surface on the connecting bar in the common axis.Type: ApplicationFiled: January 2, 2014Publication date: July 10, 2014Applicant: MITSUI HIGH-TEC , INC.Inventor: Takahiro ISHIBASHI
-
Patent number: 8727792Abstract: In a contact block comprising a contact holder having multiple through-holes arranged in a position adjustment direction, two positioning pins are inserted via the through-holes to two through-holes selected from multiple through-holes formed in a contact block accommodation portion in the position adjustment direction, and thereby the relative positions of contact portions of contact terminals held by the contact holder can be adjusted with respect to terminals of a semiconductor device.Type: GrantFiled: October 8, 2010Date of Patent: May 20, 2014Assignee: Yamaichi Electronics Co., Ltd.Inventors: Takahiro Ishibashi, Katunori Takahashi, Noriyuki Matsuoka
-
Patent number: 8529799Abstract: Provided is a manufacturing method of a metal oxide semiconductor material for gas sensors by which an oxide precursor and noble metal colloid particles will not readily cohere in the manufacturing process. The manufacturing process implements a precursor solution synthesis step 1 of synthesizing an oxide precursor solution in which an oxide precursor is dispersed, a pH adjustment step 3 of adjusting the pH of the oxide precursor solution, a precursor-colloid dispersion preparation step 5 of preparing an oxide precursor-noble metal colloid dispersion in which the oxide precursor and the noble metal colloid are dispersed substantially uniformly, a purifying step 7 of purifying the oxide precursor-noble metal colloid dispersion to obtain a purified oxide precursor noble metal colloid dispersion, and a freeze-drying step 11 of freeze-drying an precipitate of the purified oxide precursor-noble metal colloid dispersion.Type: GrantFiled: August 28, 2009Date of Patent: September 10, 2013Assignee: Hokuriku Electric Industry Co., Ltd.Inventors: Tetsuji Imamura, Daisuke Kuwahara, Takayuki Nakano, Takahiro Ishibashi
-
Publication number: 20120233853Abstract: In a contact block comprising a contact holder having multiple through-holes arranged in a position adjustment direction, two positioning pins are inserted via the through-holes to two through-holes selected from multiple through-holes formed in a contact block accommodation portion in the position adjustment direction, and thereby the relative positions of contact portions of contact terminals held by the contact holder can be adjusted with respect to terminals of a semiconductor device.Type: ApplicationFiled: October 8, 2010Publication date: September 20, 2012Inventors: Takahiro Ishibashi, Katunori Takahashi, Noriyuki Matsuoka
-
Publication number: 20120112137Abstract: Provided is a manufacturing method of a metal oxide semiconductor material for gas sensors by which an oxide precursor and noble metal colloid particles will not readily cohere in the manufacturing process. The manufacturing process implements a precursor solution synthesis step 1 of synthesizing an oxide precursor solution in which an oxide precursor is dispersed, a pH adjustment step 3 of adjusting the pH of the oxide precursor solution, a precursor-colloid dispersion preparation step 5 of preparing an oxide precursor-noble metal colloid dispersion in which the oxide precursor and the noble metal colloid are dispersed substantially uniformly, a purifying step 7 of purifying the oxide precursor-noble metal colloid dispersion to obtain a purified oxide precursor noble metal colloid dispersion, and a freeze-drying step 11 of freeze-drying an precipitate of the purified oxide precursor-noble metal colloid dispersion.Type: ApplicationFiled: August 28, 2009Publication date: May 10, 2012Applicant: HOKURIKU ELECTRIC INDUSTRY CO., LTD.Inventors: Tetsuji Imamura, Daisuke Kuwahara, Takayuki Nakano, Takahiro Ishibashi
-
Patent number: 6821131Abstract: An IC socket for the fine pitch IC package includes a socket body having an opening for guiding the IC package, an insulation base having a plurality of through-holes corresponding to the external terminals of the IC package, the contact pins placed in the through-holes, and a cover member for applying a predetermined pressure to bring the external terminals of the IC package and the contact pins into contact with one another. Each of the contact pins is formed with a first plunger including a terminal portion to be in contact with the external terminal of the IC package, a wider portion whose width is larger than the width of the terminal portion and the shaft whose width is equal to or smaller than the terminal portion, the coil spring, and the second plunger having a U-shape section, to be connected with the contact terminal of external circuit.Type: GrantFiled: October 27, 2003Date of Patent: November 23, 2004Assignee: Yamaichi Electronics Co., Ltd.Inventors: Katsumi Suzuki, Takahiro Ishibashi, Yuji Nakamura, Shuuji Kunioka
-
Patent number: D507545Type: GrantFiled: August 18, 2004Date of Patent: July 19, 2005Assignee: Yamaichi Electronics Co., Ltd.Inventors: Yuji Nakamura, Katsumi Suzuki, Takahiro Ishibashi, Eiji Kobori
-
Patent number: D516046Type: GrantFiled: May 10, 2005Date of Patent: February 28, 2006Assignee: Yamaichi Electronics Co.Inventors: Yuji Nakamura, Katsumi Suzuki, Takahiro Ishibashi, Eiji Kobori
-
Patent number: D516528Type: GrantFiled: May 10, 2005Date of Patent: March 7, 2006Assignee: Yamaichi Electronics Co., Ltd.Inventors: Yuji Nakamura, Katsumi Suzuki, Takahiro Ishibashi, Eiji Kobori