Patents by Inventor Takahiro Kitagawa

Takahiro Kitagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210247278
    Abstract: The present invention aims to provide core-shell particles that can be used in a method of separating a substance to be separated and that allow obtainment of a highly purified product. Each of a plurality of core-shell particles (C) of the present invention includes a core layer (P) as magnetic silica particles containing the magnetic metal oxide particles (A) and a shell layer (Q) that is a silica layer on a surface of the core layer (P), an average thickness of a plurality of shell layers (Q) being 3 to 3000 nm, wherein a weight percentage of the magnetic metal oxide particles (A) in the core layer (P) is 60 to 95 wt % based on a weight of the core layer (P), and the plurality of core-shell particles (C) have a particle size distribution with a coefficient of variation of 50% or less.
    Type: Application
    Filed: June 7, 2019
    Publication date: August 12, 2021
    Applicant: SANYO CHEMICAL INDUSTRIES, LTD.
    Inventors: Takahiro KITAGAWA, Masumi UEDA
  • Patent number: 10929585
    Abstract: A recording medium recording a program for a process, the process includes: calculating an amount of distortion in a via of a printed circuit board based on an expression using coefficient m, ??={(L×?×?t×E)/(D×T)}×m, where ?? is the amount of distortion, L is a length of the via, ? is a thermal expansion coefficient of a base material, ?t is a temperature change of an environment, E is a Young's modulus, D is a diameter of the via, and T is a thickness of plating in the via; and calculating a lifetime of the via based on an expression, M=N/(n×365), where M is the lifetime of the via, n is a frequency of the temperature change, and N is the number of cycles of the lifetime satisfying an expression Nx=C/??.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: February 23, 2021
    Assignee: FUJITSU LIMITED
    Inventors: Mitsunori Abe, Yoshiyuki Hiroshima, Takahiro Kitagawa, Naoki Nakamura, Akiko Matsui
  • Patent number: 10906481
    Abstract: A protector includes a case configured to accommodate a wire harness, wherein the case is provided with an insertion hole configured such that the wire harness is inserted through the insertion hole, a rib is provided on an inner surface of the case, the inner surface defining the insertion hole, and the rib protruding inwardly from the inner surface, and the rib is configured to: be fitted in a groove portion provided in an outer peripheral surface of a corrugated tube that is externally mounted on the wire harness; and hold a plug configured to close the insertion hole.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: February 2, 2021
    Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, Yazaki Corporation
    Inventors: Kouichi Inoue, Takahiro Kitagawa, Kunihito Ogura
  • Patent number: 10903492
    Abstract: A method of producing a nickel-cobalt composite hydroxide includes: preparing a first solution containing nickel ions and cobalt ions; preparing a second solution containing tungsten ions and having a pH of 10 or more; preparing a third solution containing a complex ion-forming factor; preparing a liquid medium having a pH in a range of 10 to 13.5; supplying the first solution, the second solution, and the third solution separately and simultaneously to the liquid medium to obtain a reacted solution having a pH in a range of 10 to 13.5; and obtaining the nickel-cobalt composite hydroxide containing nickel, cobalt, and tungsten from the reacted solution.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: January 26, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Hideki Yoshida, Masato Sonoo, Takahiro Kitagawa
  • Patent number: 10863629
    Abstract: A method of manufacturing a through hole of a substrate includes forming, to the substrate, a cutting hole surrounding a removal-target-part such that a connection part of the substrate remains, the connection part that connects the removal-target-part that is removed from the substrate and a remaining part other than the removal-target-part that has been removed, along a cutting line of the through hole formed to the substrate; applying plating on an area including an inner peripheral wall face of the cutting hole of the substrate; applying a film covering an opening of the cutting hole on a surface of the substrate applied with the plating and performing exposure and development of the film to form an etching resist covering an area including the opening of the cutting hole; performing etching of the plating applied on the substrate; removing the etching resist; and cutting the connection part to remove the removal-target-part.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: December 8, 2020
    Assignee: FUJITSU LIMITED
    Inventors: Kiyoyuki Hatanaka, Shigeru Sugino, Takahiro Kitagawa, Ryo Kanai, Nobuo Taketomi, Mitsunori Abe
  • Patent number: 10783309
    Abstract: An information processing device includes a processor that calculates a distortion amount that represents an amount of distortion generated in a via of a printed circuit board based on a following equation, ??={(L×?×?t×E)/(D×T)}×m×?×?×?; calculates a lifetime of the via based on a following equation, M=N/(n×365); changes, when the calculated lifetime is outside a first setting range, at least two design values of the via length, the thermal expansion coefficient, the Young's modulus, the via diameter, or the plating thickness within a second setting range corresponding to the at least two design values respectively; gives points of two perspectives affected by the change and outputs a graph that indicates an impact degree according to the points of the two perspectives for each combination of the at least two design values.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: September 22, 2020
    Assignee: FUJITSU LIMITED
    Inventors: Mitsunori Abe, Yoshiyuki Hiroshima, Takahiro Kitagawa, Akiko Matsui, Naoki Nakamura
  • Patent number: 10624216
    Abstract: A wiring board includes, a base plate that has a first surface, a second surface opposite to the first surface, and a side surface coupled to the first surface and the second surface, a conductor provided on the side surface, and a protrusion provided over the side surface. The protrusion partitions the conductor into a first portion on the side surface that extends to the first surface and a second portion on the side surface that extends to the second surface. The protrusion has a solder wettability lower than the conductor and protrudes from the conductor.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: April 14, 2020
    Assignee: FUJITSU LIMITED
    Inventors: Nobuo Taketomi, Takahiro Kitagawa, Mitsunori Abe, Shigeru Sugino, Kiyoyuki Hatanaka, Shigeo Iriguchi, Ryo Kanai
  • Publication number: 20200052296
    Abstract: A method of producing a nickel-cobalt composite hydroxide includes: preparing a first solution containing nickel ions and cobalt ions; preparing a second solution containing tungsten ions and having a pH of 10 or more; preparing a third solution containing a complex ion-forming factor; preparing a liquid medium having a pH in a range of 10 to 13.5; supplying the first solution, the second solution, and the third solution separately and simultaneously to the liquid medium to obtain a reacted solution having a pH in a range of 10 to 13.5; and obtaining the nickel-cobalt composite hydroxide containing nickel, cobalt, and tungsten from the reacted solution.
    Type: Application
    Filed: October 9, 2019
    Publication date: February 13, 2020
    Applicant: NICHIA CORPORATION
    Inventors: Hideki YOSHIDA, Masato SONOO, Takahiro KITAGAWA
  • Publication number: 20200037452
    Abstract: A method of manufacturing a through hole of a substrate includes forming, to the substrate, a cutting hole surrounding a removal-target-part such that a connection part of the substrate remains, the connection part that connects the removal-target-part that is removed from the substrate and a remaining part other than the removal-target-part that has been removed, along a cutting line of the through hole formed to the substrate; applying plating on an area including an inner peripheral wall face of the cutting hole of the substrate; applying a film covering an opening of the cutting hole on a surface of the substrate applied with the plating and performing exposure and development of the film to form an etching resist covering an area including the opening of the cutting hole; performing etching of the plating applied on the substrate; removing the etching resist; and cutting the connection part to remove the removal-target-part.
    Type: Application
    Filed: July 17, 2019
    Publication date: January 30, 2020
    Applicant: FUJITSU LIMITED
    Inventors: Kiyoyuki Hatanaka, Shigeru Sugino, Takahiro Kitagawa, Ryo Kanai, Nobuo Taketomi, Mitsunori Abe
  • Publication number: 20200026816
    Abstract: An information processing device includes a processor that calculates a distortion amount that represents an amount of distortion generated in a via of a printed circuit board based on a following equation, ??={(L×?×?t×E)/(D×T)}×m×?×?×?; calculates a lifetime of the via based on a following equation, M=N/(n×365); changes, when the calculated lifetime is outside a first setting range, at least two design values of the via length, the thermal expansion coefficient, the Young's modulus, the via diameter, or the plating thickness within a second setting range corresponding to the at least two design values respectively; gives points of two perspectives affected by the change and outputs a graph that indicates an impact degree according to the points of the two perspectives for each combination of the at least two design values.
    Type: Application
    Filed: July 3, 2019
    Publication date: January 23, 2020
    Applicant: FUJITSU LIMITED
    Inventors: Mitsunori Abe, YOSHIYUKI HIROSHIMA, Takahiro KITAGAWA, AKIKO MATSUI, Naoki Nakamura
  • Patent number: 10483541
    Abstract: A method of producing a nickel-cobalt composite hydroxide includes: preparing a first solution containing nickel ions and cobalt ions; preparing a second solution containing tungsten ions and having a pH of 10 or more; preparing a third solution containing a complex ion-forming factor; preparing a liquid medium having a pH in a range of 10 to 13.5; supplying the first solution, the second solution, and the third solution separately and simultaneously to the liquid medium to obtain a reacted solution having a pH in a range of 10 to 13.5; and obtaining the nickel-cobalt composite hydroxide containing nickel, cobalt, and tungsten from the reacted solution.
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: November 19, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Hideki Yoshida, Masato Sonoo, Takahiro Kitagawa
  • Publication number: 20190275965
    Abstract: A protector includes a case configured to accommodate a wire harness, wherein the case is provided with an insertion hole configured such that the wire harness is inserted through the insertion hole, a rib is provided on an inner surface of the case, the inner surface defining the insertion hole, and the rib protruding inwardly from the inner surface, and the rib is configured to: be fitted in a groove portion provided in an outer peripheral surface of a corrugated tube that is externally mounted on the wire harness; and hold a plug configured to close the insertion hole.
    Type: Application
    Filed: March 4, 2019
    Publication date: September 12, 2019
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, Yazaki Corporation
    Inventors: Kouichi Inoue, Takahiro Kitagawa, Kunihito Ogura
  • Publication number: 20190263675
    Abstract: A method for producing a nickel cobalt complex hydroxide includes first crystallization of supplying a solution containing Ni, Co and Mn, a complex ion forming agent and a basic solution separately and simultaneously to one reaction vessel to obtain nickel cobalt complex hydroxide particles, and a second crystallization of, after the first crystallization, further supplying a solution containing nickel, cobalt, and manganese, a solution of a complex ion forming agent, a basic solution, and a solution containing said element M separately and simultaneously to the reaction vessel to crystallize a complex hydroxide particles containing nickel, cobalt, manganese and said element M on the nickel cobalt complex hydroxide particles crystallizing a complex hydroxide particles comprising Ni, Co, Mn and the element M on the nickel cobalt complex hydroxide particles.
    Type: Application
    Filed: May 13, 2019
    Publication date: August 29, 2019
    Applicant: NICHIA CORPORATION
    Inventors: Hideki YOSHIDA, Masato SONOO, Takahiro KITAGAWA
  • Patent number: 10393797
    Abstract: A method for inspecting a laminated board, includes: performing a reflow process to solder an electronic component to a surface of a laminated board in which at least one of a plurality of wiring layers which are laminated with each other is coupled to another adjacent wiring layer via a via; and inspecting, in the reflow process, a conduction state of the via after a temperature of the laminated board reaches a melting point of a solder, and when the temperature of the laminated board is at a temperature range lower than the melting point and higher than room temperature.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: August 27, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Mitsunori Abe, Takahiro Kitagawa, Shigeo Iriguchi, Kiyoyuki Hatanaka, Shigeru Sugino, Ryo Kanai
  • Publication number: 20190220564
    Abstract: A recording medium recording a program for a process, the process includes: calculating an amount of distortion in a via of a printed circuit board based on an expression using coefficient m, ??={(L×?×?t×E)/(D×T)}×m, where ?? is the amount of distortion, L is a length of the via, ? is a thermal expansion coefficient of a base material, ?t is a temperature change of an environment, E is a Young's modulus, D is a diameter of the via, and T is a thickness of plating in the via; and calculating a lifetime of the via based on an expression, M=N/(n×365), where M is the lifetime of the via, n is a frequency of the temperature change, and N is the number of cycles of the lifetime satisfying an expression Nx=C/??.
    Type: Application
    Filed: January 4, 2019
    Publication date: July 18, 2019
    Applicant: FUJITSU LIMITED
    Inventors: Mitsunori ABE, YOSHIYUKI HIROSHIMA, Takahiro KITAGAWA, Naoki NAKAMURA, AKIKO MATSUI
  • Patent number: 10336626
    Abstract: A method for producing a nickel cobalt complex hydroxide includes first crystallization of supplying a solution containing Ni, Co and Mn, a complex ion forming agent and a basic solution separately and simultaneously to one reaction vessel to obtain nickel cobalt complex hydroxide particles, and a second crystallization of, after the first crystallization, further supplying a solution containing nickel, cobalt, and manganese, a solution of a complex ion forming agent, a basic solution, and a solution containing said element M separately and simultaneously to the reaction vessel to crystallize a complex hydroxide particles containing nickel, cobalt, manganese and said element M on the nickel cobalt complex hydroxide particles crystallizing a complex hydroxide particles comprising Ni, Co, Mn and the element Mon the nickel cobalt complex hydroxide particles.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: July 2, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Hideki Yoshida, Masato Sonoo, Takahiro Kitagawa
  • Patent number: 10342129
    Abstract: A substrate includes an insulation layer including a glass cloth impregnated with a resin, and a through hole having a hole included in the insulation layer and plating formed in an inner surface of the hole, where a location, intersecting with the glass cloth, of an outer circumferential portion of the through hole has a recessed portion recessed toward an outside of the hole.
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: July 2, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Shigeo Iriguchi, Takahiro Kitagawa, Mitsunori Abe, Shigeru Sugino, Nobuo Taketomi, Kiyoyuki Hatanaka, Ryo Kanai
  • Publication number: 20190110365
    Abstract: A wiring board includes, a base plate that has a first surface, a second surface opposite to the first surface, and a side surface coupled to the first surface and the second surface, a conductor provided on the side surface, and a protrusion provided over the side surface. The protrusion partitions the conductor into a first portion on the side surface that extends to the first surface and a second portion on the side surface that extends to the second surface. The protrusion has a solder wettability lower than the conductor and protrudes from the conductor.
    Type: Application
    Filed: October 3, 2018
    Publication date: April 11, 2019
    Applicant: FUJITSU LIMITED
    Inventors: Nobuo Taketomi, Takahiro KITAGAWA, Mitsunori Abe, Shigeru SUGINO, Kiyoyuki Hatanaka, Shigeo Iriguchi, Ryo Kanai
  • Publication number: 20180351175
    Abstract: A method of producing a positive-electrode active material for a non-aqueous electrolyte secondary battery is provided. The method includes obtaining a precipitate containing nickel and manganese from a solution containing nickel and manganese, heat-treating the resulting precipitate at a temperature of from 850° C. to less than 1100° C. to obtain a first heat-treated product, mixing the first heat-treated product and a lithium compound, and heat-treating the resulting lithium-containing mixture at a temperature of from 550° C. to 1000° C. to obtain a second heat-treated product. The second heat-treated product contains a group of lithium transition metal composite oxide particles having an average particle diameter DSEM of from 0.5 ?m to less than 3 ?m and D50/DSEM of 1 to 2.5. The lithium transition metal composite oxide particles have a spinel structure based on nickel and manganese.
    Type: Application
    Filed: May 31, 2018
    Publication date: December 6, 2018
    Applicant: NICHIA CORPORATION
    Inventors: Tomooki KAWASAKI, Kenichi KOBAYASHI, Takahiro KITAGAWA
  • Patent number: 10126478
    Abstract: A resin composition suitable for an optical compensation film, an optical compensation film using the same, which is excellent in the retardation characteristics and wavelength dispersion characteristics, and a production method of an optical compensation film. A resin composition containing, as resin components, from 30 to 99 wt % of a cellulose-based resin represented by the following formula (1) and from 1 to 70 wt % of a cinnamic acid ester copolymer: where each of R1, R2 and R3 independently represents hydrogen or a substituent having a carbon number of 1 to 12.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: November 13, 2018
    Assignee: TOSOH CORPORATION
    Inventors: Masayasu Ito, Takahiro Kitagawa, Takuya Komine, Kaori Suyama