Abstract: A resin composition including from 30 to 99 wt % of a cellulose-based resin represented by the following formula (1) and from 70 to 1 wt % of a fumaric acid ester polymer containing 30 mol % or more of a fumaric acid diester residue unit represented by the following formula (2); an optical compensation film using the same; and a production method of the optical compensation film. (wherein R1 to R3 represent a substituent having a carbon number of 1 to 12, and R4 and R5 represent an alkyl group having a carbon number of 1 to 12).

Abstract: To provide a novel diisopropyl fumarate-cinnamic acid derivative-based copolymer expected to be formed into a retardation film having excellent optical properties ensuring that, for example, the refractive index in the film thickness direction and the out-of-plane retardation are large and even in the form of a thin film, the film has a high out-of-plane retardation, and a retardation film using the same. The diisopropyl fumarate-cinnamic acid derivative-based copolymer contains: a diisopropyl fumarate residue unit; and a cinnamic acid residue unit or a cinnamic acid ester residue unit having an alkyl group with a carbon number of 1 to 6.

Abstract: To provide a novel fumaric acid diester-cinnamic acid ester-based copolymer having a high molecular weight, which is expected to maintain excellent strength or ensures excellent toughness even when formed into a film, a method for efficiently producing the copolymer, and a film using the same. The fumaric acid diester-cinnamic acid ester-based copolymer contains a fumaric acid diester residue unit, a cinnamic acid ester residue unit having an alkyl group with a carbon number of 1 to 6, and a residue unit of a polyfunctional monomer having two or more radical polymerizable functional groups.

Abstract: To provide a novel diisopropyl fumarate-cinnamic acid derivative-based copolymer expected to be formed into a retardation film having excellent optical properties ensuring that, for example, the refractive index in the film thickness direction and the out-of-plane retardation are large and even in the form of a thin film, the film has a high out-of-plane retardation, and a retardation film using the same. The diisopropyl fumarate-cinnamic acid derivative-based copolymer contains: a diisopropyl fumarate residue unit; and a cinnamic acid residue unit or a cinnamic acid ester residue unit having an alkyl group with a carbon number of 1 to 6.

Abstract: A printed circuit board solder mounting method of solder-jointing a first-land formed on a first-printed-circuit-board and a second-land formed on a second-printed-circuit-board together, includes: filling a solder-filling-hole with cream solder, the solder-filling-hole provided so as to be open in a planar region of the first-land; arranging a solder-drawing-hole so that the solder-drawing-hole and the solder-filling-hole face each other, the solder-drawing-hole being formed so as to be open in a planar region of the second region, having a center position to be superposed on a center position of the solder-filling-hole, and having a solder wettability higher than a solder wettability of the solder-filling-hole; melting the cream solder in the solder-filling-hole by reflow heating and causing at least part of the cream solder to ascend to the solder-drawing-hole facing the solder-filling-hole; and jointing the first-land and the second-land together by solidifying the cream solder interposed between the firs

Abstract: A resin composition containing a specific cellulose-based resin and a specific fumaric acid diester polymer in a specific blending ratio or containing, as the resin component, a specific cellulose-based resin and a specific fumaric acid diester polymer in a specific blending ratio and containing the resin component and an additive having an aromatic hydrocarbon ring or the like in a specific blending ratio. An optical compensation film can be produced using the resin composition.

Abstract: There is provided a printed wiring board which includes a substrate, and a soldering portion disposed on the substrate, an electronic component being to be soldered to the solder portion. The soldering portion includes a first conductor to which a solder paste is applied, and a plurality of second conductors extends in a direction away from the first conductor, where the plurality of second conductors extend parallel to each other and linearly.

Abstract: A method of soldering an electronic component includes; providing solder onto a printed circuit board electrode of a printed circuit board; placing the electronic component over the printed circuit board, the electronic component having a component electrode to be mounted on the printed circuit board electrode with a component-supporting member that melts with heat interposed therebetween; and heating the solder and the component-supporting member. The electronic component is supported on one side thereof by the component-supporting member and on the opposite side thereof directly by the printed circuit board.

Abstract: A board unit includes an electronic component having electrodes; a printed circuit board that has board electrodes each disposed at a position corresponding to a respective one of the electrodes, and that mounts thereon the electronic component; recesses each arranged from the center of a respective one of the board electrodes toward the inside thereof; and joining members that are filled in the respective recesses, and that project from the respective board electrodes upon being heated.

Abstract: Articles with a tenaciously adherent diamond coating are made by forming a diamond coating on a base material by vapor-phase synthesis without causing any warpage of the coating. The diamond coating layer is formed on the surface of a base material having a number of pores formed by electric discharge or laser beams and having a depth of 0.0001-0.2 mm and a diameter of 0.001-0.02 mm. The pores may be connected to one another to form a groove. Suitable examples of the base material include molybdenum, tungsten, silicon, tungsten carbide, silicon carbide, silicon nitride, and cemented carbide mainly comprising tungsten carbide and cobalt and/or nickel.

Abstract: A contacting method comprises the steps of holding a photomask and a wafer at a predetermined interval, curving at least one of the photomask and the wafer so as to form a convexity relative to the other, and moving the photomask and the wafer relative to each other to bring them into intimate contact with each other.