Abstract: In a printed circuit board for a liquid crystal display using Tape Automated Bonding (TAB) for making interconnections, flow of molten solder to adjacent input electrodes on the TAB is prevented as well as short-circuiting between electrodes and wire breakage by using an improved TAB structure that avoids applying a concentration of shearing stress to the input electrodes and retards short-circuiting solder flow. This is accomplished by making the width of the slit for the input electrodes uneven. The width of the slit where each of the electrodes crosses over the slit is narrower than elsewhere.