Abstract: An object of the present invention is to provide a power semiconductor device capable of improving seismic resistance while suppressing a decrease in assembly efficiency. According to the present invention, a power semiconductor device 1 includes an element installation conductor 2 including a first conductor portion 20a that is made of metal and is used for installing a power semiconductor element 300, a second conductor portion 20b that is made of metal and forms one or more main terminals 2a for transmitting a current to the power semiconductor element 300, and one or more control terminals 2b for transmitting a switching control signal to the power semiconductor element 300, and a third conductor portion 20c that is made of metal and is provided at a tip portion of the control terminal 2b.

Abstract: A semiconductor module includes a first power semiconductor element having a first surface and a second surface. The semiconductor module also includes a second power semiconductor element having a first surface and a second surface. The semiconductor module also includes first, second, third, and fourth conductor plates, and a connecting part. The connecting part is integrally formed with the second conductor plate, extends toward the third conductor plate, and is connected to the third conductor plate.

Abstract: A register machine of a register machine network including the register machine and a plurality of other register machines, comprises a network communication interface through data are transmitted to and received from the other register machines, a display device, an input device, and a control unit.

Abstract: An object of the present invention is to provide a power semiconductor device capable of improving seismic resistance while suppressing a decrease in assembly efficiency. According to the present invention, a power semiconductor device 1 includes an element installation conductor 2 including a first conductor portion 20a that is made of metal and is used for installing a power semiconductor element 300, a second conductor portion 20b that is made of metal and forms one or more main terminals 2a for transmitting a current to the power semiconductor element 300, and one or more control terminals 2b for transmitting a switching control signal to the power semiconductor element 300, and a third conductor portion 20c that is made of metal and is provided at a tip portion of the control terminal 2b.

Abstract: A self-service checkout apparatus includes dispensers each configured to dispense an article, first sensors each configured to detect a presence of the article in the corresponding dispenser, first indicators each configured to indicate that the presence of the article in the corresponding dispenser, a second sensor configured to detect whether a user is present, and a processor configured to, when one or more articles are detected by the first sensors and the user is detected by the second sensor, perform first notification using the respective one or more of the first indicators, and when one or more articles are detected by the first sensors and the user is not detected by the second sensor, perform second notification according to a priority order predetermined for each article, using at least one of a second indicator of the self-service checkout apparatus and a third indicator of another apparatus.

Abstract: A register machine of a register machine network including the register machine and a plurality of other register machines, comprises a network communication interface through data are transmitted to and received from the other register machines, a display device, an input device, and a control unit.

Abstract: [PROBLEM] To provide a power connector including a terminal having a metal member and a resin member and configured such that the metal member and the resin member are firmly fixed to each other and a portion connected to a partner connector has sufficient strength and a power connector device using the power connector. [SOLUTION] A power connector includes a housing having a fitting space in which a predetermined portion of a partner connector is to be fitted and a terminal attached to the housing. The terminal includes a metal member and a resin member molded integrally with the metal member. The metal member has a tubular portion electrically connected to a partner terminal of the partner connector arranged in the fitting space. The resin member has a charged portion charged into the tubular portion and a cover portion covering the outside of the metal member in a state in which at least part of the tubular portion is exposed to the outside.

Abstract: The present invention is directed to improving the bonding strength between a bonding wire and a lead frame bonded to a plurality of semiconductor devices electrically connected in parallel. One end and the other end of a first bonding wire are connected to a control electrode and a first lead frame portion or a bent portion of a first semiconductor device, and one end and the other end of a second bonding wire are connected to a control electrode and a second lead frame portion of a second semiconductor device. The first lead frame portion extends in a direction overlapping with the first semiconductor device from the bent portion toward the side opposite to the first semiconductor device side, and the second lead frame portion extends from the bent portion toward the second semiconductor device side in a direction overlapping with the second semiconductor device.

Abstract: According to one embodiment, a POS device includes a housing, a cover, a first detector, and a first driving mechanism. The housing includes an accommodation chamber configured to accommodate a product to which an RFID tag is attached, an opening portion for putting the product into the accommodation chamber being formed in the housing. The cover is configured to open and close the opening portion. The first detector is configured to detect whether a person is present near the housing. The first driving mechanism is configured to transition the cover from a closed state in which the cover closes the opening portion to an open state in which the cover opens the opening portion, based on the detection of the person by the first detector.

Abstract: A semiconductor module includes a first power semiconductor element having a first surface and a second surface. The semiconductor module also includes a second power semiconductor element having a first surface and a second surface. The semiconductor module also includes first, second, third, and fourth conductor plates, and a connecting part. The connecting part is integrally formed with the second conductor plate, extends toward the third conductor plate, and is connected to the third conductor plate.

Abstract: A power semiconductor device includes a first power semiconductor element, a second power semiconductor element, a first conductor plate, a second conductor plate, a third conductor plate, and a fourth conductor plate. The power semiconductor device also includes a DC positive terminal, a DC negative terminal, an AC terminal, and a sealing member that integrally seals the first conductor plate, the second conductor plate, the third conductor plate, and the fourth conductor plate. Each of the DC positive terminal, the DC negative terminal, and the AC terminal has a cut section formed by cutting a tie bar that integrally couples the DC positive terminal, the DC negative terminal, and the AC terminal.

Abstract: The present invention is directed to improving the bonding strength between a bonding wire and a lead frame bonded to a plurality of semiconductor devices electrically connected in parallel. One end and the other end of a first bonding wire are connected to a control electrode and a first lead frame portion or a bent portion of a first semiconductor device, and one end and the other end of a second bonding wire are connected to a control electrode and a second lead frame portion of a second semiconductor device. The first lead frame portion extends in a direction overlapping with the first semiconductor device from the bent portion toward the side opposite to the first semiconductor device side, and the second lead frame portion extends from the bent portion toward the second semiconductor device side in a direction overlapping with the second semiconductor device.

Abstract: A self-service checkout apparatus includes dispensers each configured to dispense an article, first sensors each configured to detect a presence of the article in the corresponding dispenser, first indicators each configured to indicate that the presence of the article in the corresponding dispenser, a second sensor configured to detect whether a user is present, and a processor configured to, when one or more articles are detected by the first sensors and the user is detected by the second sensor, perform first notification using the respective one or more of the first indicators, and when one or more articles are detected by the first sensors and the user is not detected by the second sensor, perform second notification according to a priority order predetermined for each article, using at least one of a second indicator of the self-service checkout apparatus and a third indicator of another apparatus.

Abstract: A heat storage material composition, at least containing at least one organic compound selected from ethanol, ethylene glycol, propylene glycol, and acetic acid, sodium acetate, and water, wherein a content of the water is 72.4 to 100 parts by mass, relative to 100 parts by mass of the sodium acetate; an auxiliary heat source and a heat supply method, using the heat storage material composition.

Abstract: The present invention aims to suppress a coolant from bypassing a non-cooling unit without lowering the productivity. The power converter according to the present invention includes: a power semiconductor module; and a flow path forming body having a flow path in which the power semiconductor module is disposed and an opening which is connected with the flow path, wherein the power semiconductor module includes a first fin formed on one surface and a second fin formed on another surface which faces the one surface so as to sandwich the semiconductor element, the flow path forming body has a first coolant control unit and a second coolant control unit which are arranged so as to sandwich the first fin, the first coolant control unit and the second coolant control unit are formed to be overlapped with a region of the power semiconductor module where the first fin is not formed, and a first flow path is formed along the first coolant control unit and the second coolant control unit.

Abstract: There is provided a portable apparatus capable of detecting a touch position where a user touches the portable apparatus and a touch strength with which the user touches the portable apparatus. The portable apparatus includes: a rectangular frame on which a display panel unit is to be mounted; four touch detection-dedicated legs respectively extending from vicinities of four corners of the frame; a first strain gage attached to each of the touch detection-dedicated legs; and a calculation unit that finds the touch position and the touch strength based on an output of the first strain gage.

Abstract: There is provided a portable apparatus capable of detecting a touch position where a user touches the portable apparatus and a touch strength with which the user touches the portable apparatus. The portable apparatus includes: a rectangular frame on which a display panel unit is to be mounted; four touch detection-dedicated legs respectively extending from vicinities of four corners of the frame; a first strain gage attached to each of the touch detection-dedicated legs; and a calculation unit that finds the touch position and the touch strength based on an output of the first strain gage.

Abstract: There is provided a portable apparatus capable of detecting a touch position where a user touches the portable apparatus and a touch strength with which the user touches the portable apparatus. The portable apparatus includes: a rectangular frame on which a display panel unit is to be mounted; four touch detection-dedicated legs respectively extending from vicinities of four corners of the frame; a first strain gage attached to each of the touch detection-dedicated legs; and a calculation unit that finds the touch position and the touch strength based on an output of the first strain gage.

Abstract: A power semiconductor device includes a first power semiconductor element, a second power semiconductor element, a first conductor plate, a second conductor plate, a third conductor plate, and a fourth conductor plate. The power semiconductor device also includes a DC positive terminal, a DC negative terminal, an AC terminal, and a sealing member that integrally seals the first conductor plate, the second conductor plate, the third conductor plate, and the fourth conductor plate. Each of the DC positive terminal, the DC negative terminal, and the AC terminal has a cut section formed by cutting a tie bar that integrally couples the DC positive terminal, the DC negative terminal, and the AC terminal.

Abstract: A tag reading system includes a cart including a loading section in which an article having a radio tag attached can be placed, a reading box including a housing formed of a radio wave blocking material and an opening, the housing enclosing a storage section capable of storing the loading section of the cart, and the opening permitting the cart to enter and exit the storage section, and an antenna that transmits and receives radio waves for reading the radio tag attached to the article when the cart is stored in the storage section.