Abstract: A control device including a control unit configured to control a fan system including a fan and a motor for driving the fan is disclosed. The control unit includes a fan characteristic storage unit configured to store correlated information correlated to a fan characteristic, the fan characteristic being a characteristic of the fan. The control unit controls the fan system based on the correlated information. The control unit includes a correction unit configured to correct the correlated information to correspond to changes in the fan characteristic occurring as a function of deformation over time of the fan.

Abstract: A fluid transfer apparatus includes a control device configured to determine whether or not a structure is in a clogged state, using a physical quantity obtained from a motor and correlated with a pressure loss in a fluid passage, At least one of a transfer section or the fluid passage is configured to make a proportion of a disturbance to the physical quantity small.

Abstract: Provided are a solder alloy and a solder joint formed from the soldier alloy. The solder alloy has an alloy composition of, by mass %, Ag: 1.0 to 3.7%, Cu: 0.4 to 0.8%, Sb: 0.50 to 2.90%, In: 5.00 to 10.00%, and Ni: 0.01 to 0.06%, with the balance being Sn.

Abstract: An etching method in accordance with the present disclosure includes providing a substrate, which includes a silicon-containing film, in a chamber; and etching the silicon-containing film with a chemical species in plasma generated from a process gas supplied in the chamber. The process gas includes a phosphorus gas component and a fluorine gas component.

Abstract: A fluid transfer apparatus includes a processor; a fan configured to transfer fluid along a flow path by a rotational motion; a structure provided in the flow path, the structure being configured to generate a pressure loss in the flow path as the fluid passes through the structure; and a memory storing one or more programs, which when executed, cause the processor to detect a state of the fluid or a state of the structure by monitoring a phenomenon correlated with a change in a force received by a blade of the fan from the fluid due to a disturbance of the fluid transferred along the flow path by the fan.

Abstract: Provided are a solder alloy, a solder ball, a solder preform, a solder paste, and a solder joint which have excellent wettability and high reliability by prevention of rupture of solder joints. The solder alloy has an alloy composition of, by mass %, Ag: 1.0 to 3.8%, Cu: 0.4 to 0.8%, Sb: 0.03 to 2.90%, In: 1.1 to 4.2%, Ni: 0.01 to 0.14%, Bi: 0.1 to 5.0%, with the balance being Sn.

Abstract: An etching method in accordance with the present disclosure includes providing a substrate, which includes a silicon-containing film, in a chamber; and etching the silicon-containing film with a chemical species in plasma generated from a process gas supplied in the chamber. The process gas includes a phosphorus gas component and a fluorine gas component.

Abstract: An ozone generating body (3) includes a first electrode (10), a first dielectric (11) that covers the first electrode (10), a second electrode (30), and a second dielectric (31) that covers the second electrode (30). The second dielectric (31) forms a discharge space (DS) between the second dielectric (31) and the first dielectric (11). The ozone generating body (3) further includes a support portion (50) that supports the first dielectric (11) and the second dielectric (31). Young's modulus of the support portion (50) is less than those of the first dielectric (11) and the second dielectric (31).

Abstract: An etching method includes: (a) providing a substrate having a film stack including at least two different silicon-containing films and a mask on the film stack; (b) etching the film stack using plasma generated from a first processing gas to form a recess in the film stack; and (c) supplying hydrogen fluoride to the recess in the film stack.

Abstract: A solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity and excellent heat cycle resistance. The solder alloy has an alloy composition of, by mass %, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: more than 0% and 0.9% or less, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: 0.001 to 0.020%, with the balance being Sn. The solder alloy may further contain, by mass %, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.

Abstract: A solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity, and excellent heat cycle resistance. The solder alloy has an alloy composition of, by mass %, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: more than 0% and less than 1.5%, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: more than 0.008% and 0.020% or less, with the balance being Sn. The solder alloy may further contain, by mass %, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.

Abstract: A solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity, and excellent heat cycle resistance. The solder alloy has an alloy composition of, by mass %, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: 1.1% or more and less than 1.5%, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: 0.001 to 0.020%, with the balance being Sn. The solder alloy may further contain, by mass %, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.

Abstract: Provided are a solder alloy and a solder joint, which have a narrow ?T to suppress solder bridges and solder icicles, and a small amount of dross generated in a solder tank, suppress Cu leaching, and have higher strength. The solder alloy has an alloy composition of, by mass %, Cu: more than 2.0% and less than 3.0%; Ni: 0.010% or more and less than 0.30%; and Ge: 0.0010 to 0.20% with the balance being Sn. Preferably, by mass %, Cu is more than 2.5% and less than 3.0%, and the alloy composition satisfies the following relations (1) and (2): 2.400?Cu+Ni+Ge?3.190 (1), and 0.33?Ge/Ni?1.04 (2). Cu, Ni, and Ge in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.

Abstract: An etching method includes providing a substrate including an etching target layer including a silicon-containing layer, and a mask located on the etching target layer, comprising a metal, and having an opening defined by a side wall of the mask, supplying a process gas including a metal-containing gas, and etching, with plasma generated from the process gas, the etching target layer through the opening while forming a protective layer comprising a metal on a top of the mask and on the side wall of the mask.

Abstract: In an electrochemical gas sensor (10), a first sensing element (21) is stored in a first storage portion (31). A moisture permeable film (24) is disposed in a first introduction inlet (31A) of the first storage portion (31). The moisture permeable film (24) substantially prevents a to-be-detected gas from permeating therethrough. A second sensing element (22) is disposed in a space into which water vapor and the to-be-detected gas contained in a target gas flow. In such a configuration, the electrochemical gas sensor (10) is capable of detecting a to-be-detected gas having a concentration of 0 or more and 1 ppm or less.

Abstract: An ozone generator (100) includes: a flow path (1) through which gas flows from an inlet (5) to an outlet (6); an ozone generation unit (3) disposed in the flow path (1); and an ozone sensor (4) disposed in the flow path (1) and upstream of the ozone generation unit (3). The flow path (1) has an upstream-side flow path (130) that forms a gas passing space (AR) located upstream of the ozone generation unit (3) and through which the gas flows from one side to another side in a predetermined direction. The inlet (5) is disposed closer to an outer circumferential portion (131) of the upstream-side flow path (130) than the ozone sensor (4).

Abstract: A hydroelectric power generation system is included in a channel control system. The channel control system includes a command section that outputs a command value of a flow rate or pressure of a fluid, an opening degree control unit that calculates a target opening degree based on the command value, and a motor-operated valve installed in a channel through which the fluid flows. The valve opens and closes in accordance with the target opening degree. The hydroelectric power generation system includes a water turbine disposed in the channel, a generator driven by the water turbine, and a generator control unit that controls at least one of a torque and a number of rotations of the generator based on opening degree information that indicates a measured value of an actual opening degree of the valve or an opening degree estimated.

Abstract: A motor drive apparatus includes a motor, a power converter, and a controller that controls the voltage supplied to the motor by the power converter. The power converter converts a voltage of a 400 V-class AC power supply to a voltage with an effective value lower than an effective value of the 400 V-class AC power supply. The power converter converts the voltage by a switching operation of a plurality of switching elements. The motor is configured so that a value of ?×Vx/Ld is greater than Pmax when an effective value voltage Vx=200 V. A d-axis inductance of the motor is Ld. A flux linkage of the motor is ?. A maximum output of the motor in a device where the motor is mounted is Pmax. The controller has a control mode in which an effective value voltage higher than Vx is applied to the motor.

Abstract: A motor drive method is a method of driving a motor by a motor drive apparatus. The motor drive apparatus includes an inverter that regulates supplied power to the motor that is a position sensorless synchronous machine, and includes a controller that outputs a control signal to control the inverter. The method includes reducing output torque of the motor to be less than maximum output torque, in a speed range that is lower than a first speed at which the motor rotates. The maximum torque that is output from the motor is the maximum output torque in a case the motor drive apparatus drives the motor.

Abstract: A motor drive method is a method of driving a motor by a motor drive apparatus. The motor drive apparatus includes an inverter that regulates supply power to the motor that is a synchronous machine and includes a controller that controls the inverter. The method includes changing, before loss of synchronism, a speed of the motor from a second speed range to a first speed range. A speed range in which the motor is operable at a substantially fixed speed is the first speed range, and a speed range that is lower than the first speed range and includes zero speed is the second speed range.