Patents by Inventor Takahisa Kaneko

Takahisa Kaneko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10299352
    Abstract: A light source control system includes a plurality of light sources, and a plurality of light source control devices. The light source control devices include a plurality of main light source control devices that transmits command signals to the other light source control devices. Each main light source control device includes a collision determination circuit that determines whether data of the command signal transmitted through a bus has collided with other data, and a restoration circuit that executes a restoration operation in the case of a collision. The collision determination circuit includes an edge detection circuit that detects change timing of a signal representing the data of the command signal, an area setting circuit that sets a collision determination area in accordance with the detected change timing detected, and a collision detection circuit that detects the presence or absence of a collision in the set collision determination area.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: May 21, 2019
    Assignee: Renesas Electronics Corporation
    Inventors: Takashi Ienaga, Satoshi Kaneko, Kazumi Ishii, Akio Fujii, Takahisa Gunji
  • Patent number: 9219425
    Abstract: An electric power converter includes a semiconductor module that has a semiconductor element therein, a cooler that cools the semiconductor module, a circuit board provided with a semiconductor control circuit that controls the semiconductor module, a capacitor electrically connected to the semiconductor module, and a quick discharge resistor for discharging an electric charge accumulated in the capacitor. The circuit board is provided with a discharge control circuit that controls a current that flows into the quick discharge resistor. The semiconductor module, the cooler, the capacitor, and the quick discharge resistor are disposed on one major surface of the circuit board.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: December 22, 2015
    Assignee: DENSO CORPORATION
    Inventors: Tomohisa Sano, Takahisa Kaneko, Kenshiro Hida, Kenji Funahashi
  • Patent number: 9070666
    Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.
    Type: Grant
    Filed: August 27, 2014
    Date of Patent: June 30, 2015
    Assignee: DENSO CORPORATION
    Inventors: Kuniaki Mamitsu, Takahisa Kaneko, Masaya Tonomoto, Masayoshi Nishihata, Hiroyuki Wado, Chikage Noritake, Eiji Nomura, Toshiki Itoh
  • Patent number: 8957517
    Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.
    Type: Grant
    Filed: September 12, 2013
    Date of Patent: February 17, 2015
    Assignee: DENSO CORPORATION
    Inventors: Kuniaki Mamitsu, Takahisa Kaneko, Masaya Tonomoto, Masayoshi Nishihata, Hiroyuki Wado, Chikage Noritake, Eiji Nomura, Toshiki Itoh
  • Publication number: 20140361425
    Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.
    Type: Application
    Filed: August 27, 2014
    Publication date: December 11, 2014
    Inventors: Kuniaki MAMITSU, Takahisa KANEKO, Masaya TONOMOTO, Masayoshi NISHIHATA, Hiroyuki WADO, Chikage NORITAKE, Eiji NOMURA, Toshiki ITOH
  • Patent number: 8884426
    Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.
    Type: Grant
    Filed: March 20, 2014
    Date of Patent: November 11, 2014
    Assignee: DENSO CORPORATION
    Inventors: Kuniaki Mamitsu, Takahisa Kaneko, Masaya Tonomoto, Masayoshi Nishihata, Hiroyuki Wado, Chikage Noritake, Eiji Nomura, Toshiki Itoh
  • Patent number: 8879256
    Abstract: An electric power conversion apparatus includes a plurality of semiconductor modules, a frame, a control circuit board, and a reinforcing and fixing member. Each of the semiconductor modules has a plurality of control terminals. The frame receives the semiconductor modules therein. The frame has, at least, a pair of side walls that face each other with the semiconductor modules interposed therebetween. The control circuit board is located outside of the frame and has the control terminals of the semiconductor modules connected thereto. The reinforcing and fixing member extends to connect the side walls of the frame, thereby reinforcing the frame. The reinforcing and fixing member also has the control circuit board fixed thereto so that the reinforcing and fixing member is positioned between the control circuit board and the semiconductor modules.
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: November 4, 2014
    Assignee: Denso Corporation
    Inventors: Hiromi Ichijyo, Takahisa Kaneko, Takeshi Fujihara, Kenshiro Hida
  • Publication number: 20140203426
    Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.
    Type: Application
    Filed: March 20, 2014
    Publication date: July 24, 2014
    Applicant: DENSO CORPORATION
    Inventors: Kuniaki MAMITSU, Takahisa KANEKO, Masaya TONOMOTO, Masayoshi NISHIHATA, Hiroyuki WADO, Chikage NORITAKE, Eiji NOMURA, Toshiki ITOH
  • Patent number: 8708799
    Abstract: A game machine has a back side display unit composed of reels for displaying back patterns, and a front side display unit composed of transparent EL panels for displaying overlapping patterns overlapping with the back patterns. The back side display unit and the front side display unit are disposed not to produce blind spot regions of the back patterns. The game machine can provide various overlapping patterns with good visibility and a high game selection capability to a player.
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: April 29, 2014
    Assignees: Konami Digital Entertainment Co., Ltd., Yamasa Co., Ltd.
    Inventors: Masaaki Ozaki, Takahisa Kaneko, Ken Nishioka, Tsuneo Uchida, Hiroshi Kawakami, Yoshio Aoki, Takashi Yamaguchi
  • Publication number: 20140015120
    Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.
    Type: Application
    Filed: September 12, 2013
    Publication date: January 16, 2014
    Applicant: DENSO CORPORATION
    Inventors: Kuniaki MAMITSU, Takahisa KANEKO, Masaya TONOMOTO, Masayoshi NISHIHATA, Hiroyuki WADO, Chikage NORITAKE, Eiji NOMURA, Toshiki ITOH
  • Patent number: 8629004
    Abstract: A semiconductor module having an integrated structure is manufactured by mounting a semiconductor chip on the side of a surface of a cooling plate via an insulating material, and by molding the semiconductor chip and the cooling plate by a resin-molded member. This method includes the steps of: (a) forming a sprayed insulating film as the insulating material on a surface of the cooling plate; (b) forming a sprayed conductive film on a face of the sprayed insulating film opposite to a face where the cooling plate is provided; (c) checking whether the sprayed conductive film is insulated from the cooling plate by using the sprayed conductive film and the cooling plate as electrodes and applying voltage therebetween; and (d) mounting the semiconductor chip on the upper side of the sprayed conductive film when the sprayed conductive film is insulated, and then resin-molding the semiconductor chip and the cooling plate.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: January 14, 2014
    Assignees: Denso Corporation, Toyota Jidosha Kabushiki Kaisha
    Inventors: Daisuke Harada, Hiroshi Ishiyama, Takahisa Kaneko, Yoshikazu Suzuki
  • Publication number: 20130272043
    Abstract: An electric power converter includes a semiconductor module that has a semiconductor element therein, a cooler that cools the semiconductor module, a circuit board provided with a semiconductor control circuit that controls the semiconductor module, a capacitor electrically connected to the semiconductor module, and a quick discharge resistor for discharging an electric charge accumulated in the capacitor. The circuit board is provided with a discharge control circuit that controls a current that flows into the quick discharge resistor. The semiconductor module, the cooler, the capacitor, and the quick discharge resistor are disposed on one major surface of the circuit board.
    Type: Application
    Filed: March 18, 2013
    Publication date: October 17, 2013
    Applicant: DENSO CORPORATION
    Inventors: Tomohisa SANO, Takahisa KANEKO, Kenshiro HIDA, Kenji FUNAHASHI
  • Patent number: 8558375
    Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: October 15, 2013
    Assignee: DENSO CORPORATION
    Inventors: Kuniaki Mamitsu, Takahisa Kaneko, Masaya Tonomoto, Masayoshi Nishihata, Hiroyuki Wado, Chikage Noritake, Eiji Nomura, Toshiki Itoh
  • Patent number: 8398799
    Abstract: A method of manufacturing a honeycomb structure having honeycomb segments, which includes a masking step (S1) of attaching masking materials (8) to both end surfaces (2a) of the honeycomb segments (2), a stacked body bonding step (S2) of bonding the honeycomb stacked body (3) by bonding the plurality of honeycomb segments (2) together while interposing adhesive layers therebetween, an adhesive layer drying step (S3) of integrally fixing the honeycomb stacked body (3) by heating and drying the adhesive layers, a masking material separating step (S4), of separating the masking materials (8), and a grinding step (S5) of grinding an outer peripheral portion of the honeycomb stacked body (3) into a predetermined shape.
    Type: Grant
    Filed: January 20, 2004
    Date of Patent: March 19, 2013
    Assignee: NGK Insulators, Ltd.
    Inventors: Jun Fujita, Takahisa Kaneko
  • Patent number: 8360853
    Abstract: A game machines has a back side display unit composed of reels for displaying back patterns, and a front side display unit composed of transparent EL panels for displaying overlapping patterns overlapping with the back patterns. The back side display unit and the front side display unit are disposed not to produce blind spot regions of the back patterns. The game machine can provide various overlapping patterns with good visibility and a high game selection capability to a player.
    Type: Grant
    Filed: February 22, 2012
    Date of Patent: January 29, 2013
    Assignees: Konami Digital Entertainment Co., Ltd., Yamasa Co., Ltd.
    Inventors: Masaaki Ozaki, Takahisa Kaneko, Ken Nishioka, Takashi Yamaguchi
  • Publication number: 20120250380
    Abstract: An electric power conversion apparatus includes a plurality of semiconductor modules, a frame, a control circuit board, and a reinforcing and fixing member. Each of the semiconductor modules has a plurality of control terminals. The frame receives the semiconductor modules therein. The frame has, at least, a pair of side walls that face each other with the semiconductor modules interposed therebetween. The control circuit board is located outside of the frame and has the control terminals of the semiconductor modules connected thereto. The reinforcing and fixing member extends to connect the side walls of the frame, thereby reinforcing the frame. The reinforcing and fixing member also has the control circuit board fixed thereto so that the reinforcing and fixing member is positioned between the control circuit board and the semiconductor modules.
    Type: Application
    Filed: March 27, 2012
    Publication date: October 4, 2012
    Applicant: DENSO CORPORATION
    Inventors: Hiromi ICHIJYO, Takahisa Kaneko, Takeshi Fujihara, Kenshiro Hida
  • Publication number: 20120149466
    Abstract: A game machines has a back side display unit composed of reels for displaying back patterns, and a front side display unit composed of transparent EL panels for displaying overlapping patterns overlapping with the back patterns. The back side display unit and the front side display unit are disposed not to produce blind spot regions of the back patterns. The game machine can provide various overlapping patterns with good visibility and a high game selection capability to a player.
    Type: Application
    Filed: February 22, 2012
    Publication date: June 14, 2012
    Applicants: YAMASA CO., LTD., DENSO CORPORATION
    Inventors: Masaaki Ozaki, Takahisa KANEKO, Ken NISHIOKA, Tsuneo UCHIDA, Hiroshi KAWAKAMI, Yoshio AOKI, Takashi YAMAGUCHI
  • Patent number: 8162317
    Abstract: A game machines has a back side display unit composed of reels for displaying back patterns, and a front side display unit composed of transparent EL panels for displaying overlapping patterns overlapping with the back patterns. The back side display unit and the front side display unit are disposed not to produce blind spot regions of the back patterns. The game machine can provide various overlapping patterns with good visibility and a high game selection capability to a player.
    Type: Grant
    Filed: August 26, 2010
    Date of Patent: April 24, 2012
    Assignees: DENSO CORPORATION, Yamasa Co., Ltd.
    Inventors: Masaaki Ozaki, Takahisa Kaneko, Ken Nishioka, Tsuneo Uchida, Hiroshi Kawakami, Yoshio Aoki, Takashi Yamaguchi
  • Publication number: 20120001318
    Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.
    Type: Application
    Filed: June 28, 2011
    Publication date: January 5, 2012
    Applicant: DENSO CORPORATION
    Inventors: Kuniaki MAMITSU, Takahisa Kaneko, Masaya Tonomoto, Masayoshi Nishihata, Hiroyuki Wado, Chikage Noritake, Eiji Nomura, Toshiki Itoh
  • Publication number: 20120001349
    Abstract: A semiconductor module having an integrated structure is manufactured by mounting a semiconductor chip on the side of a surface of a cooling plate via an insulating material, and by molding the semiconductor chip and the cooling plate by a resin-molded member. This method includes the steps of: (a) forming a sprayed insulating film as the insulating material on a surface of the cooling plate; (b) forming a sprayed conductive film on a face of the sprayed insulating film opposite to a face where the cooling plate is provided; (c) checking whether the sprayed conductive film is insulated from the cooling plate by using the sprayed conductive film and the cooling plate as electrodes and applying voltage therebetween; and (d) mounting the semiconductor chip on the upper side of the sprayed conductive film when the sprayed conductive film is insulated, and then resin-molding the semiconductor chip and the cooling plate.
    Type: Application
    Filed: June 30, 2011
    Publication date: January 5, 2012
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, DENSO CORPORATION
    Inventors: Daisuke HARADA, Hiroshi ISHIYAMA, Takahisa KANEKO, Yoshikazu SUZUKI