Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract: A game machine has a back side display unit composed of reels for displaying back patterns, and a front side display unit composed of transparent EL panels for displaying overlapping patterns overlapping with the back patterns. The back side display unit and the front side display unit are disposed not to produce blind spot regions of the back patterns. The game machine can provide various overlapping patterns with good visibility and a high game selection capability to a player.

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract: A semiconductor module having an integrated structure is manufactured by mounting a semiconductor chip on the side of a surface of a cooling plate via an insulating material, and by molding the semiconductor chip and the cooling plate by a resin-molded member. This method includes the steps of: (a) forming a sprayed insulating film as the insulating material on a surface of the cooling plate; (b) forming a sprayed conductive film on a face of the sprayed insulating film opposite to a face where the cooling plate is provided; (c) checking whether the sprayed conductive film is insulated from the cooling plate by using the sprayed conductive film and the cooling plate as electrodes and applying voltage therebetween; and (d) mounting the semiconductor chip on the upper side of the sprayed conductive film when the sprayed conductive film is insulated, and then resin-molding the semiconductor chip and the cooling plate.

Abstract: An electric power converter includes a semiconductor module that has a semiconductor element therein, a cooler that cools the semiconductor module, a circuit board provided with a semiconductor control circuit that controls the semiconductor module, a capacitor electrically connected to the semiconductor module, and a quick discharge resistor for discharging an electric charge accumulated in the capacitor. The circuit board is provided with a discharge control circuit that controls a current that flows into the quick discharge resistor. The semiconductor module, the cooler, the capacitor, and the quick discharge resistor are disposed on one major surface of the circuit board.

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract: A method of manufacturing a honeycomb structure having honeycomb segments, which includes a masking step (S1) of attaching masking materials (8) to both end surfaces (2a) of the honeycomb segments (2), a stacked body bonding step (S2) of bonding the honeycomb stacked body (3) by bonding the plurality of honeycomb segments (2) together while interposing adhesive layers therebetween, an adhesive layer drying step (S3) of integrally fixing the honeycomb stacked body (3) by heating and drying the adhesive layers, a masking material separating step (S4), of separating the masking materials (8), and a grinding step (S5) of grinding an outer peripheral portion of the honeycomb stacked body (3) into a predetermined shape.

Abstract: A game machines has a back side display unit composed of reels for displaying back patterns, and a front side display unit composed of transparent EL panels for displaying overlapping patterns overlapping with the back patterns. The back side display unit and the front side display unit are disposed not to produce blind spot regions of the back patterns. The game machine can provide various overlapping patterns with good visibility and a high game selection capability to a player.

Abstract: An electric power conversion apparatus includes a plurality of semiconductor modules, a frame, a control circuit board, and a reinforcing and fixing member. Each of the semiconductor modules has a plurality of control terminals. The frame receives the semiconductor modules therein. The frame has, at least, a pair of side walls that face each other with the semiconductor modules interposed therebetween. The control circuit board is located outside of the frame and has the control terminals of the semiconductor modules connected thereto. The reinforcing and fixing member extends to connect the side walls of the frame, thereby reinforcing the frame. The reinforcing and fixing member also has the control circuit board fixed thereto so that the reinforcing and fixing member is positioned between the control circuit board and the semiconductor modules.

Abstract: A game machines has a back side display unit composed of reels for displaying back patterns, and a front side display unit composed of transparent EL panels for displaying overlapping patterns overlapping with the back patterns. The back side display unit and the front side display unit are disposed not to produce blind spot regions of the back patterns. The game machine can provide various overlapping patterns with good visibility and a high game selection capability to a player.

Abstract: A game machines has a back side display unit composed of reels for displaying back patterns, and a front side display unit composed of transparent EL panels for displaying overlapping patterns overlapping with the back patterns. The back side display unit and the front side display unit are disposed not to produce blind spot regions of the back patterns. The game machine can provide various overlapping patterns with good visibility and a high game selection capability to a player.

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract: A semiconductor module having an integrated structure is manufactured by mounting a semiconductor chip on the side of a surface of a cooling plate via an insulating material, and by molding the semiconductor chip and the cooling plate by a resin-molded member. This method includes the steps of: (a) forming a sprayed insulating film as the insulating material on a surface of the cooling plate; (b) forming a sprayed conductive film on a face of the sprayed insulating film opposite to a face where the cooling plate is provided; (c) checking whether the sprayed conductive film is insulated from the cooling plate by using the sprayed conductive film and the cooling plate as electrodes and applying voltage therebetween; and (d) mounting the semiconductor chip on the upper side of the sprayed conductive film when the sprayed conductive film is insulated, and then resin-molding the semiconductor chip and the cooling plate.

Abstract: An apparatus for coating the outer peripheral surface 1a of a pillar structure 1 comprising a smoothing means 10 having a smoothing plate 10a and an elastic body 10b; the elastic body 10 being disposed to be contacted with the outer peripheral surface 1a of the pillar structure 1 to be coated. The coating surface of a coating material supplied to the outer peripheral surface 1a is smoothed between the outer peripheral surface 1a and the elastic body 10b. A method for coating the outer peripheral surface of a pillar structure is also provided. According to the method by using the apparatus, the occurrence of partial uncoating or peeling of the coating and occurrence of cracks in the coating portion during drying after coating can be inhibited since the coating material can be applied thinly and uniformly on the outer peripheral surface, thereby the coating surface is smoothed.

Abstract: There is provided a device for bonding ceramic structural bodies. In the state in which a set of ceramic structural bodies provided with a bonding agent between bonding surfaces and provided with elastic sleeves disposed on a peripheral surface of the set of the structural bodies are placed in a tubular container with an elastic sheet disposed between the elastic sleeves and the tubular container, the device is able to charge a hydrostatic pressure medium between the tubular container and the elastic sheet to press and bond the structural bodies. By bonding the ceramic structural bodies with the device, it may provide accurate positioning of the bonding surfaces. It may also provide a uniform distance between bonded surfaces, and reduce the number of bonding operations, thereby affording an excellent working efficiency.

Abstract: A die was provided for forming a honeycomb body having a structure provided with groovy slits on a front face thereof, the slits being formed by cell blocks and back holes on a back surface thereof, each hole being communicatively connected with the slit. The die is made of cemented carbide having wear resistance. The cemented carbide is formed by compacting, followed by sintering at high temperature, metal carbide powder of transition metal element series with an iron group metal binder having toughness. A connection area ratio of the back hole and the cell block is 35 to 65%.

Abstract: A game machines has a back side display unit composed of reels for displaying back patterns, and a front side display unit composed of transparent EL panels for displaying overlapping patterns overlapping with the back patterns. The back side display unit and the front side display unit are disposed not to produce blind spot regions of the back patterns. The game machine can provide various overlapping patterns with good visibility and a high game selection capability to a player.

Abstract: A game machines has a back side display unit composed of reels for displaying back patterns, and a front side display unit composed of transparent EL panels for displaying overlapping patterns overlapping with the back patterns. The back side display unit and the front side display unit are disposed not to produce blind spot regions of the back patterns. The game machine can provide various overlapping patterns with good visibility and a high game selection capability to a player.

Abstract: A game machines has a back side display unit composed of reels for displaying back patterns, and a front side display unit composed of transparent EL panels for displaying overlapping patterns overlapping with the back patterns. The back side display unit and the front side display unit are disposed not to produce blind spot regions of the back patterns. The game machine can provide various overlapping patterns with good visibility and a high game selection capability to a player.

Abstract: A game machines has a back side display unit composed of reels for displaying back patterns, and a front side display unit composed of transparent EL panels for displaying overlapping patterns overlapping with the back patterns. The back side display unit and the front side display unit are disposed not to produce blind spot regions of the back patterns. The game machine can provide various overlapping patterns with good visibility and a high game selection capability to a player.